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1. Release Information
2. External Memory Interfaces Cyclone® 10 GX FPGA IP Introduction
3. Cyclone® 10 GX EMIF IP Product Architecture
4. Cyclone® 10 GX EMIF IP End-User Signals
5. Cyclone® 10 GX EMIF – Simulating Memory IP
6. Cyclone® 10 GX EMIF IP for DDR3
7. Cyclone® 10 GX EMIF IP for LPDDR3
8. Cyclone® 10 GX EMIF IP Timing Closure
9. Optimizing Controller Performance
10. Cyclone® 10 GX EMIF IP Debugging
11. External Memory Interfaces Cyclone® 10 GX FPGA IP User Guide Archives
12. Document Revision History for Cyclone® 10 GX External Memory Interfaces FPGA IP User Guide
4.1.1.1. pll_ref_clk for DDR3
4.1.1.2. pll_locked for DDR3
4.1.1.3. pll_extra_clk_0 for DDR3
4.1.1.4. pll_extra_clk_1 for DDR3
4.1.1.5. pll_extra_clk_2 for DDR3
4.1.1.6. pll_extra_clk_3 for DDR3
4.1.1.7. oct for DDR3
4.1.1.8. mem for DDR3
4.1.1.9. status for DDR3
4.1.1.10. afi_reset_n for DDR3
4.1.1.11. afi_clk for DDR3
4.1.1.12. afi_half_clk for DDR3
4.1.1.13. afi for DDR3
4.1.1.14. emif_usr_reset_n for DDR3
4.1.1.15. emif_usr_clk for DDR3
4.1.1.16. emif_usr_reset_n_sec for DDR3
4.1.1.17. emif_usr_clk_sec for DDR3
4.1.1.18. cal_debug_reset_n for DDR3
4.1.1.19. cal_debug_clk for DDR3
4.1.1.20. cal_debug_out_reset_n for DDR3
4.1.1.21. cal_debug_out_clk for DDR3
4.1.1.22. clks_sharing_master_out for DDR3
4.1.1.23. clks_sharing_slave_in for DDR3
4.1.1.24. clks_sharing_slave_out for DDR3
4.1.1.25. ctrl_amm for DDR3
4.1.1.26. ctrl_auto_precharge for DDR3
4.1.1.27. ctrl_user_priority for DDR3
4.1.1.28. ctrl_ecc_user_interrupt for DDR3
4.1.1.29. ctrl_ecc_readdataerror for DDR3
4.1.1.30. ctrl_mmr_slave for DDR3
4.1.1.31. cal_debug for DDR3
4.1.1.32. cal_debug_out for DDR3
4.1.2.1. pll_ref_clk for LPDDR3
4.1.2.2. pll_locked for LPDDR3
4.1.2.3. pll_extra_clk_0 for LPDDR3
4.1.2.4. pll_extra_clk_1 for LPDDR3
4.1.2.5. pll_extra_clk_2 for LPDDR3
4.1.2.6. pll_extra_clk_3 for LPDDR3
4.1.2.7. oct for LPDDR3
4.1.2.8. mem for LPDDR3
4.1.2.9. status for LPDDR3
4.1.2.10. afi_reset_n for LPDDR3
4.1.2.11. afi_clk for LPDDR3
4.1.2.12. afi_half_clk for LPDDR3
4.1.2.13. afi for LPDDR3
4.1.2.14. emif_usr_reset_n for LPDDR3
4.1.2.15. emif_usr_clk for LPDDR3
4.1.2.16. cal_debug_reset_n for LPDDR3
4.1.2.17. cal_debug_clk for LPDDR3
4.1.2.18. cal_debug_out_reset_n for LPDDR3
4.1.2.19. cal_debug_out_clk for LPDDR3
4.1.2.20. clks_sharing_master_out for LPDDR3
4.1.2.21. clks_sharing_slave_in for LPDDR3
4.1.2.22. clks_sharing_slave_out for LPDDR3
4.1.2.23. ctrl_user_priority for LPDDR3
4.1.2.24. ctrl_mmr_slave for LPDDR3
4.1.2.25. cal_debug for LPDDR3
4.1.2.26. cal_debug_out for LPDDR3
4.4.1. ctrlcfg0
4.4.2. ctrlcfg1
4.4.3. dramtiming0
4.4.4. sbcfg1
4.4.5. caltiming0
4.4.6. caltiming1
4.4.7. caltiming2
4.4.8. caltiming3
4.4.9. caltiming4
4.4.10. caltiming9
4.4.11. dramaddrw
4.4.12. sideband0
4.4.13. sideband1
4.4.14. sideband2
4.4.15. sideband3
4.4.16. sideband4
4.4.17. sideband5
4.4.18. sideband6
4.4.19. sideband7
4.4.20. sideband8
4.4.21. sideband9
4.4.22. sideband10
4.4.23. sideband11
4.4.24. sideband12
4.4.25. sideband13
4.4.26. dramsts
4.4.27. niosreserve0
4.4.28. niosreserve1
4.4.29. ecc3: ECC Error and Interrupt Configuration
4.4.30. ecc4: Status and Error Information
4.4.31. ecc5: Address of Most Recent SBE/DBE
4.4.32. ecc6: Address of Most Recent Correction Command Dropped
6.1.1. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: General
6.1.2. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Memory
6.1.3. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Mem I/O
6.1.4. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: FPGA I/O
6.1.5. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Mem Timing
6.1.6. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Board
6.1.7. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Controller
6.1.8. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Diagnostics
6.1.9. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Example Designs
7.1.1. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: General
7.1.2. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Memory
7.1.3. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Mem I/O
7.1.4. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: FPGA I/O
7.1.5. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Mem Timing
7.1.6. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Board
7.1.7. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Controller
7.1.8. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Diagnostics
7.1.9. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Example Designs
9.4.1. Auto-Precharge Commands
9.4.2. Latency
9.4.3. Calibration
9.4.4. Bank Interleaving
9.4.5. Additive Latency and Bank Interleaving
9.4.6. User-Controlled Refresh
9.4.7. Frequency of Operation
9.4.8. Series of Reads or Writes
9.4.9. Data Reordering
9.4.10. Starvation Control
9.4.11. Command Reordering
9.4.12. Bandwidth
9.4.13. Enable Command Priority Control
10.1. Interface Configuration Performance Issues
10.2. Functional Issue Evaluation
10.3. Timing Issue Characteristics
10.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer
10.5. Hardware Debugging Guidelines
10.6. Categorizing Hardware Issues
10.7. Debugging Cyclone® 10 GX EMIF IP
10.8. Using the Traffic Generator with the Generated Design Example
10.5.1. Create a Simplified Design that Demonstrates the Same Issue
10.5.2. Measure Power Distribution Network
10.5.3. Measure Signal Integrity and Setup and Hold Margin
10.5.4. Vary Voltage
10.5.5. Operate at a Lower Speed
10.5.6. Determine Whether the Issue Exists in Previous Versions of Software
10.5.7. Determine Whether the Issue Exists in the Current Version of Software
10.5.8. Try A Different PCB
10.5.9. Try Other Configurations
10.5.10. Debugging Checklist
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6.4.5.5. Package Migration
Package delays can be different for the same pin in different packages. If you want to use multiple migratable packages in your system, you should compensate for package skew as described in this topic. The information in this topic applies to Cyclone® 10 GX devices.
Scenario 1
Your PCB is designed for multiple migratable devices, but you have only one device with which to go to production.
Assume two migratable packages, device A and device B, and that you want to go to production with device A. Follow these steps:
- Perform package deskew for device A.
- Compile your design for device A, with the Package Skew option enabled.
- Note the skews in the <core_name>.pin file for device A. Deskew these package skews with board trace lengths as described in the preceding examples.
- Recompile your design for device A.
- For device B, open the parameter editor and deselect the Package Deskew option.
- Calculate board skew parameters, only taking into account the board traces for device B, and enter that value into the parameter editor for device B.
- Regenerate the IP and recompile the design for device B.
- Verify that timing requirements are met for both device A and device B.
Scenario 2
Your PCB is designed for multiple migratable devices, and you want to go to production with all of them.
Assume you have device A and device B, and plan to use both devices in production. Follow these steps:
- Do not perform any package deskew compensation for either device.
- Compile a Quartus Prime design for device A with the Package Deskew option disabled, and ensure that all board skews are entered accurately.
- Verify that the Report DDR timing report meets your timing requirements.
- Compile a Quartus Prime design for device B with the Package Deskew option disabled, and ensure that all board skews are entered accurately.
- Verify that the Report DDR timing report meets your timing requirements.