AN 886: Intel Agilex® 7 Device Design Guidelines

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ID 683634
Date 10/09/2023
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to the Intel Agilex® 7 Device Design Guidelines 2. System Specification 3. Device Selection 4. Security Considerations 5. Design Entry 6. Board and Software Considerations 7. Design Implementation, Analysis, Optimization, and Verification 8. Debugging 9. Embedded Software Design Guidelines for Intel Agilex® 7 SoC FPGAs
1. Introduction to the Intel Agilex® 7 Device Design Guidelines x
1.1. Design Flow 1.2. Introduction to the Intel Agilex® 7 Device Design Guidelines Revision History
2. System Specification x
2.1. Design Specifications 2.2. Install Intel® Quartus® Prime Software 2.3. IP Selection 2.4. Simulation 2.5. Preparing for Design Entry 2.6. I/O Summary 2.7. Using Intel Agilex® 7 HPS in your Device 2.8. System Specification Revision History
2.3. IP Selection x
2.3.1. Evaluate Available HPS IP 2.3.2. Select Soft/Hardened IP and I/O Interfaces
2.5. Preparing for Design Entry x
2.5.1. Coding Styles and Design Recommendations 2.5.2. Platform Designer
3. Device Selection x
3.1. Device Variant 3.2. PLLs and Clock Routing 3.3. Logic, Memory, and Multiplier Density 3.4. I/O Pin Count, LVDS SERDES Channels, and Package Offering 3.5. Speed Grade 3.6. Device Migration 3.7. Device Selection Revision History
4. Security Considerations x
4.1. Security Considerations Revision History
5. Design Entry x
5.1. Design Entry for SoC Devices 5.2. Design Entry for FPGA-only Devices 5.3. Design Entry for NoC 5.4. EMIF Considerations 5.5. Nios® Software Processor IP 5.6. Transceiver Planning 5.7. Reconfiguration 5.8. Design Entry Revision History
5.1. Design Entry for SoC Devices x
5.1.1. Firewall Planning 5.1.2. Boot And Configuration Considerations 5.1.3. HPS Clocking and Reset Design Considerations 5.1.4. Reset Configuration 5.1.5. HPS Pin Multiplexing Design Considerations 5.1.6. HPS I/O Settings: Constraints and Drive Strengths 5.1.7. Design Guidelines for HPS Interfaces 5.1.8. Interfacing between the FPGA and HPS 5.1.9. Implementing the Intel Agilex® 7 HPS Component
5.1.2. Boot And Configuration Considerations x
5.1.2.1. Selecting HPS Boot Options 5.1.2.2. Configuration Sources 5.1.2.3. Remote System Update (RSU)
5.1.3. HPS Clocking and Reset Design Considerations x
5.1.3.1. HPS Clock Planning 5.1.3.2. Early Pin Planning and I/O Assignment Analysis 5.1.3.3. Pin Features and Connections for HPS Clocks, Reset and PoR 5.1.3.4. Direct to Factory Pin Support for Remote System Update (RSU) Feature 5.1.3.5. Internal Clocks
5.1.4. Reset Configuration x
5.1.4.1. HPS Peripheral Reset Management 5.1.4.2. System Reset Considerations
5.1.7. Design Guidelines for HPS Interfaces x
5.1.7.1. Design Considerations for Selecting PHY Interfaces 5.1.7.2. USB Interface Design Guidelines 5.1.7.3. SD/MMC and eMMC Card Interface Design Guidelines 5.1.7.4. Design Guidelines for Flash Interfaces 5.1.7.5. UART Interface Design Guidelines 5.1.7.6. I2C Interface Design Guidelines
5.1.7.1. Design Considerations for Selecting PHY Interfaces x
5.1.7.1.1. HPS EMAC PHY Interfaces 5.1.7.1.2. RMII and RGMII PHY Interfaces 5.1.7.1.3. PHY Interfaces Connected Through FPGA I/O 5.1.7.1.4. Consider Device Driver Availability 5.1.7.1.5. MDIO 5.1.7.1.6. Signal Integrity
5.1.7.4. Design Guidelines for Flash Interfaces x
5.1.7.4.1. NAND Flash Interface Design Guidelines
5.1.8. Interfacing between the FPGA and HPS x
5.1.8.1. Overview of HPS Memory-Mapped Interfaces 5.1.8.2. Recommended System Topologies 5.1.8.3. Recommended Starting Point for HPS-to-FPGA Interface Designs 5.1.8.4. Information on How to Configure and Use the Bridges
5.1.8.1. Overview of HPS Memory-Mapped Interfaces x
5.1.8.1.1. HPS-to-FPGA Bridge 5.1.8.1.2. Lightweight HPS-to-FPGA Bridge 5.1.8.1.3. FPGA-to-HPS Bridge 5.1.8.1.4. Interface Bandwidths
5.1.8.2. Recommended System Topologies x
5.1.8.2.1. System Level Cache Coherency 5.1.8.2.2. HPS Accesses to FPGA Fabric 5.1.8.2.3. MPU Sharing Data with FPGA 5.1.8.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
5.2. Design Entry for FPGA-only Devices x
5.2.1. Clocking and Reset Design Considerations 5.2.2. I/O and Clock Planning
5.2.2. I/O and Clock Planning x
5.2.2.1. Making FPGA Pin Assignments 5.2.2.2. Early Pin Planning and I/O Assignment Analysis for the FPGA Device 5.2.2.3. I/O Features and Pin Connections 5.2.2.4. Clock and PLL Selection 5.2.2.5. PLL Feature Guidelines 5.2.2.6. Clock Control Features 5.2.2.7. I/O Simultaneous Switching Noise
5.2.2.3. I/O Features and Pin Connections x
5.2.2.3.1. I/O Signaling Type 5.2.2.3.2. Selectable Standards and Flexible I/O Banks 5.2.2.3.3. Dual-Purpose and Special Pin Connections 5.2.2.3.4. Intel Agilex® 7 I/O Features
5.2.2.5. PLL Feature Guidelines x
5.2.2.5.1. Clock Feedback Mode 5.2.2.5.2. Clock Outputs
5.3. Design Entry for NoC x
5.3.1. NoC Architecture Basics 5.3.2. NoC Design Flow 5.3.3. Configuring NoC IP 5.3.4. Instantiating NoC IP 5.3.5. NoC Assignments 5.3.6. NoC Physical Placement 5.3.7. Compilation 5.3.8. Simulation
5.4. EMIF Considerations x
5.4.1. Memory Interfaces 5.4.2. FPGA EMIF Design Considerations
5.5. Nios® Software Processor IP x
5.5.1. Nios® V 5.5.2. Nios® II
6. Board and Software Considerations x
6.1. Early System and Board Planning 6.2. Board Design Guidelines for Intel Agilex® 7 SoC FPGAs 6.3. Pin Connection Considerations for Board Design 6.4. Board Considerations Revision History
6.1. Early System and Board Planning x
6.1.1. SmartVID 6.1.2. Intel® FPGA Power and Thermal Calculator 6.1.3. Thermal Management and Design 6.1.4. Temperature Sensing for Thermal Management 6.1.5. Voltage Sensor 6.1.6. Device Power-Up 6.1.7. Power Pin Connections and Power Supplies 6.1.8. Planning for Device Configuration
6.1.7. Power Pin Connections and Power Supplies x
6.1.7.1. Decoupling Capacitors 6.1.7.2. PLL Board Design Guidelines 6.1.7.3. Transceiver Board Design Guidelines
6.1.8. Planning for Device Configuration x
6.1.8.1. Device Power Cycling and Reconfiguration 6.1.8.2. Configuration Scheme Selection 6.1.8.3. Configuration Features 6.1.8.4. Intel® Quartus® Prime Configuration Settings 6.1.8.5. Configuration Pin Connections
6.1.8.2. Configuration Scheme Selection x
6.1.8.2.1. Serial Configuration Devices 6.1.8.2.2. Intel® FPGA Download Cable
6.1.8.4. Intel® Quartus® Prime Configuration Settings x
6.1.8.4.1. Optional Configuration Pins 6.1.8.4.2. Dual Purpose Configuration Pins
6.1.8.5. Configuration Pin Connections x
6.1.8.5.1. Configuration Pin Voltage Level 6.1.8.5.2. Clock Trace Signal Integrity 6.1.8.5.3. JTAG Pins 6.1.8.5.4. MSEL Configuration Mode Pins 6.1.8.5.5. Other Configuration Pins
6.2. Board Design Guidelines for Intel Agilex® 7 SoC FPGAs x
6.2.1. Boundary Scan for HPS 6.2.2. Embedded Software Debugging and Trace
6.3. Pin Connection Considerations for Board Design x
6.3.1. Board-Related Intel® Quartus® Prime Settings 6.3.2. Signal Integrity Considerations 6.3.3. Board-Level Simulation and Advanced I/O Timing Analysis
6.3.1. Board-Related Intel® Quartus® Prime Settings x
6.3.1.1. Unused Pins
6.3.2. Signal Integrity Considerations x
6.3.2.1. High-Speed Board Design 6.3.2.2. Voltage Reference Pins 6.3.2.3. Simultaneous Switching Noise 6.3.2.4. I/O Termination
7. Design Implementation, Analysis, Optimization, and Verification x
7.1. Selecting a Synthesis Tool 7.2. Device Resource Utilization Reports 7.3. Intel® Quartus® Prime Messages 7.4. Timing Constraints and Analysis 7.5. Area and Timing Optimization 7.6. Preserving Performance and Reducing Compilation Time 7.7. Designing with Intel® Hyperflex™ 7.8. Simulation 7.9. Power Analysis 7.10. Power Optimization 7.11. Design Implementation, Analysis, Optimization, and Verification Revision History
7.4. Timing Constraints and Analysis x
7.4.1. Recommended Timing Optimization and Analysis Assignments
7.10. Power Optimization x
7.10.1. Device and Design Power Optimization Techniques 7.10.2. Intel® Quartus® Prime Power Optimization Techniques
7.10.1. Device and Design Power Optimization Techniques x
7.10.1.1. Device Speed Grade 7.10.1.2. Clock Power Management 7.10.1.3. Memory Power Reduction 7.10.1.4. I/O Power Guidelines
8. Debugging x
8.1. On-Chip Debug Overview 8.2. On-Chip Debugging Tools 8.3. Debugging Revision History
8.1. On-Chip Debug Overview x
8.1.1. Planning Guidelines for Debugging Tools
9. Embedded Software Design Guidelines for Intel Agilex® 7 SoC FPGAs x
9.1. Overview 9.2. Golden Hardware Reference Design (GHRD) 9.3. Define Software Requirements 9.4. Define Software Architecture 9.5. Selecting Software Tools 9.6. Choosing the Bootloader Software 9.7. Selecting an Operating System for Your Application 9.8. Assembling Your Software Development Platform for Linux* 9.9. Assembling your Software Development Platform for Partner OS or RTOS 9.10. Driver Considerations 9.11. Boot And Configuration Considerations 9.12. System Reset Considerations 9.13. Flash Considerations 9.14. Develop Application 9.15. Test and Validate 9.16. Embedded Software Design Guidelines Revision History
9.5. Selecting Software Tools x
9.5.1. Selecting Software Build Tools 9.5.2. Selecting Software Debug Tools 9.5.3. Selecting Software Trace Tools
9.7. Selecting an Operating System for Your Application x
9.7.1. Using Linux* or RTOS 9.7.2. Using the Bootloader as a Bare-Metal Framework 9.7.3. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
9.8. Assembling Your Software Development Platform for Linux* x
9.8.1. Golden System Reference Design (GSRD) for Linux* 9.8.2. Source Code Management Considerations
9.11. Boot And Configuration Considerations x
9.11.1. Configuration Sources 9.11.2. Configuration Flash 9.11.3. Configuration Clock 9.11.4. Selecting HPS Boot Options 9.11.5. HPS Boot Sources 9.11.6. Remote System Update (RSU)
9.13. Flash Considerations x
9.13.1. Flash Programming Method 9.13.2. Using a Single flash for Both FPGA Configuration and HPS Mass Storage
1. Introduction to the Intel Agilex® 7 Device Design Guidelines
2. System Specification
3. Device Selection
4. Security Considerations
5. Design Entry
6. Board and Software Considerations
7. Design Implementation, Analysis, Optimization, and Verification
8. Debugging
9. Embedded Software Design Guidelines for Intel Agilex® 7 SoC FPGAs

5.2.2.3.2. Selectable Standards and Flexible I/O Banks

Table 31.  Selectable Standards and Flexible I/O Banks Checklist
Number Done? Checklist Item
1   Select a suitable signaling type and I/O standard for each I/O pin. The I/O banks are located in the top and bottom I/O bank row. Each I/O bank contains its own PLL, DPA, and SERDES circuitries.
2   Ensure that the appropriate I/O standard support is supported in the targeted I/O bank.
3   Place I/O pins that share voltage levels in the same I/O bank.
4   Verify that all output signals in each I/O bank are intended to drive out at the bank’s VCCIO voltage level.
5   Verify that all voltage-referenced signals in each I/O bank are intended to use the bank’s VREF voltage level.
6   Check the I/O bank support for true differential signaling features.
7   Place I/O pins that share OCT calibration block in the same I/O tile.

Intel Agilex® 7 I/O pins are arranged in groups called modular I/O banks. Be sure to use the correct dedicated pin inputs for signals such as clocks and global control signals.

For Intel Agilex® 7 F-Series and Intel Agilex® 7 I-Series series devices, board must supply each bank with one VCCIO_PIO voltage level for every VCCIO_PIO pin in a bank. Each I/O bank is powered by the VCCIO_PIO pins of that particular bank, and is independent of the VCCIO_PIO pins of other I/O banks. A single I/O bank supports single-ended or voltage-referenced output and input signals that are driving and receiving at the same voltage as the VCCIO_PIO. An I/O bank can simultaneously support any number of input signals with different I/O standards.

To accommodate voltage-referenced I/O standards, each I/O bank supports multiple VREF pins feeding a common VREF bus. Intel Agilex® 7 F-Series, Intel Agilex® 7 I-Series, and Intel Agilex® 7 M-Series GPIO bank supports internal and external VREF types. Each I/O lane must share the same VREF type. Set the VREF pins to the correct voltage for the I/O standards in the bank. Each I/O bank can only have a single VCCIO_PIO voltage level and a single VREF voltage level at a given time. If the VREF pins are not used as voltage references, they cannot be used as generic I/O pins and are tied to VCCIO_PIO of that same bank or GND.

An I/O bank including single-ended or differential standards can support voltage-referenced standards as long as all voltage-referenced standards use the same VREF setting. Voltage-referenced bi-directional and output signals must drive out at the I/O bank’s VCCIO_PIO voltage level.

F-series and I-series I/O banks support 1.5V True Differential Signaling output, M-series I/O banks support 1.3V True Differential Signaling output.

The F-series and I-series GPIO bank supports true differential input standard at 1.05V/1.1V/1.2V/ 1.5V VCCIO_PIO. Whereby the M-series GPIO bank supports true differential input standard at 1.2V/ 1.3V VCCIO_PIO.

For Intel Agilex® 7 M-Series devices, the board must supply each sub-bank with one VCCIO_PIO voltage level for every VCCIO_PIO pin in a sub-bank. Each I/O sub-bank is powered by the VCCIO_PIO pins of that particular sub-bank, and is independent if the VCCIO_PIO pins of other I/O sub-banks. A single I/O sub-bank supports single-ended or voltage-referenced output and input signals that are driving and receiving at the same voltage as the VCCIO_PIO. An I/O sub-bank can simultaneously support any number of input signals with different I/O standards provided that the I/O standard placement adhere to the GPIO-B design guidelines.

To accommodate voltage-referenced I/O standards, each I/O sub-bank supports an internal VREF type. Each I/O lane must share the same VREF source. Each I/O sub-bank can only have a single VCCIO_PIO voltage level and each I/O lane must share the same VREF voltage source at a given time. An I/O lane including single-ended or differential standards can support voltage-referenced standards as long as all voltage-referenced standards use the same VREF source. Voltage-referenced bi-directional and output signals must drive out at the I/O sub-bank VCCIO_PIO voltage level.

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