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1. Simultaneous Switching Noise (SSN) Analysis and Optimizations
2. Signal Integrity Analysis with Third-Party Tools
3. Mentor Graphics* PCB Design Tools Support
4. Cadence PCB Design Tools Support
5. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
A. Intel® Quartus® Prime Standard Edition User Guides
1.1. Simultaneous Switching Noise (SSN) Analysis and Optimizations
1.2. Definitions
1.3. Understanding SSN
1.4. SSN Estimation Tools
1.5. SSN Analysis Overview
1.6. Design Factors Affecting SSN Results
1.7. Optimizing Your Design for SSN Analysis
1.8. Performing SSN Analysis and Viewing Results
1.9. Decreasing Processing Time for SSN Analysis
1.10. Scripting Support
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1.7.1. Optimizing Pin Placements for Signal Integrity
1.7.2. Specifying Board Trace Model Settings
1.7.3. Defining PCB Layers and PCB Layer Thickness
1.7.4. Specifying Signal Breakout Layers
1.7.5. Creating I/O Assignments
1.7.6. Decreasing Pessimism in SSN Analysis
1.7.7. Excluding Pins as Aggressor Signals
2.1. Signal Integrity Analysis with Third-Party Tools
2.2. I/O Model Selection: IBIS or HSPICE
2.3. FPGA to Board Signal Integrity Analysis Flow
2.4. Simulation with IBIS Models
2.5. Simulation with HSPICE Models
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2.4.1. Elements of an IBIS Model
2.4.2. Creating Accurate IBIS Models
2.4.3. Design Simulation Using the Mentor Graphics* HyperLynx* Software
2.4.4. Configuring LineSim to Use Intel IBIS Models
2.4.5. Integrating Intel IBIS Models into LineSim Simulations
2.4.6. Running and Interpreting LineSim Simulations
2.5.1. Supported Devices and Signaling
2.5.2. Accessing HSPICE Simulation Kits
2.5.3. The Double Counting Problem in HSPICE Simulations
2.5.4. HSPICE Writer Tool Flow
2.5.5. Running an HSPICE Simulation
2.5.6. Interpreting the Results of an Output Simulation
2.5.7. Interpreting the Results of an Input Simulation
2.5.8. Viewing and Interpreting Tabular Simulation Results
2.5.9. Viewing Graphical Simulation Results
2.5.10. Making Design Adjustments Based on HSPICE Simulations
2.5.11. Sample Input for I/O HSPICE Simulation Deck
2.5.12. Sample Output for I/O HSPICE Simulation Deck
2.5.13. Advanced Topics
2.5.4.1. Applying I/O Assignments
2.5.4.2. Enabling HSPICE Writer
2.5.4.3. Enabling HSPICE Writer Using Assignments
2.5.4.4. Naming Conventions for HSPICE Files
2.5.4.5. Invoking HSPICE Writer
2.5.4.6. Invoking HSPICE Writer from the Command Line
2.5.4.7. Customizing Automatically Generated HSPICE Decks
2.5.11.1. Header Comment
Sample Header Comment Block
2.5.11.2. Simulation Conditions
2.5.11.3. Simulation Options
2.5.11.4. Constant Definition
2.5.11.5. Buffer Netlist
2.5.11.6. Drive Strength
2.5.11.7. I/O Buffer Instantiation
2.5.11.8. Board Trace and Termination
2.5.11.9. Stimulus Model
2.5.11.10. Simulation Analysis
2.5.12.1. Header Comment
2.5.12.2. Simulation Conditions
2.5.12.3. Simulation Options
2.5.12.4. Constant Definition
2.5.12.5. I/O Buffer Netlist
2.5.12.6. Drive Strength
2.5.12.7. Slew Rate and Delay Chain
2.5.12.8. I/O Buffer Instantiation
2.5.12.9. Board and Trace Termination
2.5.12.10. Double-Counting Compensation Circuitry
2.5.12.11. Simulation Analysis
3.1. FPGA-to-PCB Design Flow
3.2. Integrating with I/O Designer
3.3. Integrating with DxDesigner
3.4. Analyzing FPGA Simultaneous Switching Noise (SSN)
3.5. Scripting API
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3.2.1. Generating Pin Assignment Files
3.2.2. I/O Designer Settings
3.2.3. Transferring I/O Assignments
3.2.4. Updating I/O Designer with Intel® Quartus® Prime Pin Assignments
3.2.5. Updating Intel® Quartus® Prime with I/O Designer Pin Assignments
3.2.6. Generating Schematic Symbols in I/O Designer
3.2.7. Exporting Schematic Symbols to DxDesigner
4.1. Cadence PCB Design Tools Support
4.2. Product Comparison
4.3. FPGA-to-PCB Design Flow
4.4. Setting Up the Intel® Quartus® Prime Software
4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software
4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software
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5.1. Reviewing Intel® Quartus® Prime Software Settings
5.2. Reviewing Device Pin-Out Information in the Fitter Report
5.3. Reviewing Compilation Error and Warning Messages
5.4. Using Additional Intel® Quartus® Prime Software Features
5.5. Using Additional Intel® Quartus® Prime Software Tools
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2.5.11.1. Header Comment
The first block of an input simulation spice deck is the header comment. The purpose of this block is to provide an easily readable summary of how the simulation file has been automatically configured by the Intel® Quartus® Prime software.
This block has two main components: The first component summarizes the I/O configuration relevant information such as device, speed grade, and so on. The second component specifies the exact test condition that the Intel® Quartus® Prime software assumes for the given I/O standard.
Sample Header Comment Block
* Intel® Quartus® Prime HSPICE Writer I/O Simulation Deck* * This spice simulation deck was automatically generated by * Quartus for the following IO settings: * * Device: EP2S60F1020C3 * Speed Grade: C3 * Pin: AA4 (out96) * Bank: IO Bank 6 (Row I/O) * I/O Standard: LVTTL, 12mA * OCT: Off * * Intel® Quartus® Prime’s default I/O timing delays assume the following slow * corner simulation conditions. * * Specified Test Conditions For Intel® Quartus® Prime Tco * Temperature: 85C (Slowest Temperature Corner) * Transistor Model: TT (Typical Transistor Corner) * Vccn: 3.135V (Vccn_min = Nominal - 5%) * Vccpd: 2.97V (Vccpd_min = Nominal - 10%) * Load: No Load * Vtt: 1.5675V (Voltage reference is Vccn/2) * * Note: The I/O transistors are specified to operate at least as * fast as the TT transistor corner, actual production * devices can be as fast as the FF corner. Any simulations * for hold times should be conducted using the fast process * corner with the following simulation conditions. * Temperature: 0C (Fastest Commercial Temperature Corner **) * Transistor Model: FF (Fastest Transistor Corner) * Vccn: 1.98V (Vccn_hold = Nominal + 10%) * Vccpd: 3.63V (Vccpd_hold = Nominal + 10%) * Vtt: 0.95V (Vtt_hold = Vccn/2 - 40mV) * Vcc: 1.25V (Vcc_hold = Maximum Recommended) * Package Model: Short-circuit from pad to pin (no parasitics) * * Warnings: