Intel® FPGA Programmable Acceleration Card N3000 Data Sheet

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ID 683260
Date 6/30/2021
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Overview 3. System Compatibility 4. Mechanical Information 5. Thermal Specifications 6. Intel® Provided FPGA Image A. References B. Safety and Regulatory Information C. Document Revision History for Intel® FPGA Programmable Acceleration Card N3000 Data Sheet
2. Overview x
2.1. Intel® FPGA PAC N3000 Block Diagram 2.2. Overview of Product Features 2.3. PCIe Overview 2.4. Board Management Controller Overview
2.2. Overview of Product Features x
2.2.1. Intel® Arria® 10 GT FPGA 2.2.2. Intel® Ethernet Controller XL710-BM2 Network Interface Controller 2.2.3. On-Board Memory 2.2.4. Software and Firmware 2.2.5. Power 2.2.6. Network Interface
2.2.6. Network Interface x
2.2.6.1. Intel® Ethernet Connection C827 Retimer
2.4. Board Management Controller Overview x
2.4.1. Field Replaceable Unit Identification (FRUID) EEPROM
5. Thermal Specifications x
5.1. Cooling Requirements
B. Safety and Regulatory Information x
B.1. Regulatory Compliance
1. Introduction
2. Overview
3. System Compatibility
4. Mechanical Information
5. Thermal Specifications
6. Intel® Provided FPGA Image
A. References
B. Safety and Regulatory Information
C. Document Revision History for Intel® FPGA Programmable Acceleration Card N3000 Data Sheet

5.1. Cooling Requirements

Figure 7. Forward Flow Cooling Curve
Table 11.  Local Air Inlet Temperature and Air Flow Values for Forward CoolingForward Flow Requirements to maintain FPGA Tj= 95 °C

FPGA Power < 49 W

Board Power < 96 W

FPGA Power < 54 W

Board Power < 102 W

FPGA Power < 69 W

Board Power < 126 W (TDP)
Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM)
46 8 40.7 8 39.2 10
54.5 12 49.8 12 47.8 15
62 20 57.9 20 52.3 20
Figure 8. Reverse Flow Cooling Curve
Table 12.  Local Air Inlet Temperature and Air Flow Values for Reverse CoolingReverse Flow Requirements to maintain FPGA Tj= 95 °C

FPGA Power < 49 W

Board Power < 96 W

FPGA Power < 54 W

Board Power < 102 W

FPGA Power < 69 W

Board Power < 126 W (TDP)

Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM) Maximum TLA (°C) Air Flow (CFM)
44.6 8 39.8 8 36.1 10
52.6 12 48 12 44.7 15
61 20 56 20 49.4 20
Note: TLA values shown in the tables and charts of this section are informational, and may represent conditions outside of the supported operating range.
Note: These flow curves are based on numerical analysis and should be used as a starting point for thermal design estimation. Thermal performance of host systems may vary. Therefore, you should perform in-system thermal validation.
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