Visible to Intel only — GUID: mcn1408329978614
Ixiasoft
2.1. Cyclone® 10 LP Devices
2.2. MAX® 10 Devices
2.3. Cyclone® V SoC Devices
2.4. Cyclone® V Devices
2.5. Cyclone® IV Devices
2.6. MAX® V Devices
2.7. MAX® II Devices
2.8. Cyclone® III Devices (Legacy Support)
2.9. Cyclone® II Devices (Legacy Support)
2.10. Cyclone® Devices (Legacy Support)
2.11. MAX® 7000A Devices (Legacy Support)
Visible to Intel only — GUID: mcn1408329978614
Ixiasoft
2.5.2. Package Options and Maximum User I/Os
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | ||||||
---|---|---|---|---|---|---|---|---|---|
EP4CE6 (6.3K LEs) | EP4CE10 (10.3K LEs) | EP4CE15 (15.4K LEs) | EP4CE22 (22.3K LEs) | EP4CE30 (28.8K LEs) | EP4CE40 (39.6K LEs) | EP4CE55 (55.9K LEs) | |||
I/Os | |||||||||
EQFP-144 | 0.5 | 22 x 22 | 91 | 91 | — | 79 | — | — | — |
UBGA-256 | 0.8 | 14 x 14 | — | — | 165 | 153 | — | — | — |
FBGA-256 | 1 | 17 x 17 | 179 | 179 | 165 | 153 | — | — | — |
UBGA-484 | 0.8 | 19 x 19 | — | — | — | — | — | 328 | — |
FBGA-324 | 1 | 19 x 19 | — | — | — | — | 193 | 193 | — |
FBGA-484 | 1 | 23 x 23 | — | — | 343 | — | 328 | 328 | 324 |
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line |
---|---|---|---|
EP4CGX15 (14.4K LEs) | |||
I/Os | |||
FBGA-169 | 1 | 14 x 14 | 72 / 2 |