FPGA Packaging Device Information

MAX II Devices

The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.

Device:

Keywords:

Showing 1 - 20 / 33 Entries

Device	Part Number	Package Type	Pins	Silicon	Package Description
EPM1270	EPM1270GT144	TQFP	144	Production	144-Pin TQFP - Wire Bond - A:1.60
EPM1270	EPM1270T144	TQFP	144	Production	144-Pin TQFP - Wire Bond - A:1.60
EPM1270	EPM1270F256	FBGA	256	Production	256-Pin FBGA - Wire Bond - A:1.90
EPM1270	EPM1270GF256	FBGA	256	Production	256-Pin FBGA - Wire Bond - A:1.90
EPM1270	EPM1270GM256	MBGA	256	Production	256-Pin MBGA - Wire Bond - A:1.20
EPM1270	EPM1270M256	MBGA	256	Production	256-Pin MBGA - Wire Bond - A:1.20
EPM2210	EPM2210F256	FBGA	256	Production	256-Pin FBGA - Wire Bond - A:1.90
EPM2210	EPM2210GF256	FBGA	256	Production	256-Pin FBGA - Wire Bond - A:1.90
EPM2210	EPM2210F324	FBGA	324	Production	324-Pin FBGA - Wire Bond - A:1.90
EPM2210	EPM2210GF324	FBGA	324	Production	324-Pin FBGA - Wire Bond - A:1.90
EPM240	EPM240ZM68	MBGA	68	Production	68-Pin MBGA - Wire Bond - A:1.20
EPM240	EPM240F100	FBGA	100	Production	100-Pin FBGA-THIN - Wire Bond - A:1.55
EPM240	EPM240GF100	FBGA	100	Production	100-Pin FBGA-THIN - Wire Bond - A:1.55
EPM240	EPM240GM100	MBGA	100	Production	100-Pin MBGA - Wire Bond - A:1.20
EPM240	EPM240GT100	TQFP	100	Production	100-Pin TQFP - Wire Bond - A:1.20
EPM240	EPM240M100	MBGA	100	Production	100-Pin MBGA - Wire Bond - A:1.20
EPM240	EPM240T100	TQFP	100	Production	100-Pin TQFP - Wire Bond - A:1.20
EPM240	EPM240ZM100	MBGA	100	Production	100-Pin MBGA - Wire Bond - A:1.20
EPM570	EPM570F100	FBGA	100	Production	100-Pin FBGA-THIN - Wire Bond - A:1.55
EPM570	EPM570GF100	FBGA	100	Production	100-Pin FBGA-THIN - Wire Bond - A:1.55

Showing 1 - 20 / 33 Entries

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