FPGA Packaging Device Information | Altera

EPCS Devices

The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.

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Showing 1 - 5 / 5 Entries

Device	Part Number	Package Type	Pins	Silicon	Package Description
EPCS1	EPCS1SI8	SOIC	8	Production	8-Pin SOIC - Wire Bond - A:1.75
EPCS128	EPCS128SI16	SOIC	16	Production	16-Pin SOIC - Wire Bond - A:2.65
EPCS16	EPCS16SI8	SOIC	8	Production	8-Pin SOIC - Wire Bond - A:1.75
EPCS4	EPCS4SI8	SOIC	8	Production	8-Pin SOIC - Wire Bond - A:1.75
EPCS64	EPCS64SI16	SOIC	16	Production	16-Pin SOIC - Wire Bond - A:2.65

Showing 1 - 5 / 5 Entries

For PCB Manufacturing Information and Resources visit the Board Developer Center.

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