Packaging Device Information
The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.
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Device:
| Device | Part Number | Package Type | Pins | Silicon | Package Description |
|---|---|---|---|---|---|
| EPCQ128 | EPCQ128SI16 | SOIC | 16 | Production | 16-Pin SOIC - Wire Bond - A:2.65 |
| EPCQ128A | EPCQ128ASI16N | SOIC | 16 | Production | 16-Pin SOIC - Wire Bond |
| EPCQ16 | EPCQ16SI8 | SOIC | 8 | Production | 8-Pin SOIC - Wire Bond - A:1.75 |
| EPCQ16A | EPCQ16ASI8N | SOIC | 8 | Production | 8-Pin SOIC - Wire Bond |
| EPCQ256 | EPCQ256SI16 | SOIC | 16 | Production | 16-Pin SOIC - Wire Bond - A:2.65 |
| EPCQ32 | EPCQ32SI8 | SOIC | 8 | Production | 8-Pin SOIC - Wire Bond - A:1.75 |
| EPCQ32A | EPCQ32ASI8N | SOIC | 8 | Production | 8-Pin SOIC - Wire Bond |
| EPCQ4A | EPCQ4ASI8N | SOIC | 8 | Production | 8-Pin SOIC - Wire Bond |
| EPCQ512 | EPCQ512SI16 | SOIC | 16 | Production | 16-Pin SOIC - Wire Bond - A:2.65 |
| EPCQ64 | EPCQ64SI16 | SOIC | 16 | Production | 16-Pin SOIC - Wire Bond - A:2.65 |
| EPCQ64A | EPCQ64ASI16N | SOIC | 16 | Production | 16-Pin SOIC - Wire Bond |
| EPCQL1024 | EPCQL1024F24 | FBGA | 24 | Production | 24-Pin FBGA - Wire Bond - A:1.30 |
| EPCQL256 | EPCQL256F24 | FBGA | 24 | Production | 24-Pin FBGA - Wire Bond - A:1.20 |
| EPCQL512 | EPCQL512F24 | FBGA | 24 | Production | 24-Pin FBGA - Wire Bond - A:1.20 |
For PCB Manufacturing Information and Resources visit the Board Developer Center.