FPGA Packaging Device Information

Cyclone IV Devices

The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.

Device:

Keywords:

Showing 1 - 20 / 46 Entries

Device	Part Number	Package Type	Pins	Silicon	Package Description
EP4CE10	EP4CE10E22	EQFP	144	Production	144-Pin EQFP - Wire Bond - A:1.65 - D2:5.40
EP4CE10	EP4CE10F17	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
EP4CE10	EP4CE10U14	UBGA	256	Production	256-Pin UBGA - Wire Bond - A:1.50
EP4CE115	EP4CE115F23	FBGA	484	Production	484-Pin FBGA - Wire Bond - A:2.40
EP4CE115	EP4CE115F29	FBGA	780	Production	780-Pin FBGA - Wire Bond - A:2.40
EP4CE15	EP4CE15E22	EQFP	144	Production	144-Pin EQFP - Wire Bond - A:1.65 - D2:6.610
EP4CE15	EP4CE15M8	MBGA	164	Production	164-Pin MBGA - Wire Bond - A:1.20
EP4CE15	EP4CE15F17	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
EP4CE15	EP4CE15M9	MBGA	256	Production	256-Pin MBGA - Wire Bond - A:1.20
EP4CE15	EP4CE15U14	UBGA	256	Production	256-Pin UBGA - Wire Bond - A:1.50
EP4CE15	EP4CE15F23	FBGA	484	Production	484-Pin FBGA - Wire Bond - A:2.40
EP4CE22	EP4CE22E22	EQFP	144	Production	144-Pin EQFP - Wire Bond - A:1.65 - D2:6.610
EP4CE22	EP4CE22F17	FBGA	256	Production	256-Pin FBGA-THIN - Wire Bond - A:1.55
EP4CE22	EP4CE22U14	UBGA	256	Production	256-Pin UBGA - Wire Bond - A:1.50
EP4CE30	EP4CE30F19	FBGA	324	Production	324-Pin FBGA - Wire Bond - A:1.90
EP4CE30	EP4CE30F23	FBGA	484	Production	484-Pin FBGA - Wire Bond - A:2.40
EP4CE30	EP4CE30F29	FBGA	780	Production	780-Pin FBGA - Wire Bond - A:2.40
EP4CE40	EP4CE40F19	FBGA	324	Production	324-Pin FBGA - Wire Bond - A:1.90
EP4CE40	EP4CE40F23	FBGA	484	Production	484-Pin FBGA - Wire Bond - A:2.40
EP4CE40	EP4CE40U19	UBGA	484	Production	484-Pin UBGA - Wire Bond - A:2.05

Showing 1 - 20 / 46 Entries

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