Socket Package Carrier for 4th and 5th Gen Intel® Xeon® Scalable Processors

This article lists the types of Socket E1 (LGA4677-1) Packages Carries for 4th and 5th Gen Intel® Xeon® Scalable Processors.

For a complete list of compatible Intel® Xeon® Scalable Processors Sockets,  check Sockets Supported by Intel® Xeon® Processors.

The 4th and 5th Gen Intel® Xeon® Scalable Processors SKUs use Socket E1 (LGA4677-1) and the enabled loading mechanism requires a Package Carrier. 
There are three carrier types for the different package types:  E1A, E1B, & E1C.

Types of Carries

Package Carrier features include:

• Enabling removal of the CPU without separating the CPU TIM (thermal interface material) bond.
• Visual markings indicating the proper carrier-to-CPU pairing.
• Physical keying features that mitigate the mixing of:
  • A carrier to the wrong CPU SKU.
  • A CPU to the wrong socket/platform type.
• Integrated TIM breaker features for separating the CPU from the heatsink when needed.
• Shim features on  E1B carriers that adapt the bolster plate load to the slightly taller package height of some CPU SKUs.
• Refinements to the E1C carrier that accommodate the larger packages with HBM. 

Package Carrier Features – TIM Bond Breaker & Shims

Separation of the TIM bond:

E1A & E1B – Integrated TIM Break Lever

E1C – Integrated TIM Break Cam 
Cam rotated by a  ¼” flathead screwdriver

Shim features on E1B carriers ensure proper bolster plate loading on non-HBM CPU SKUs that use the E1A carrier.

A complete list of Package Carrier types for each SKU may be found in the Package Specifications section for the CPU on ark.intel.com.