Intel® Compute Module HNS2600TP24SR

Intel® Compute Module HNS2600TP24SR

Essentials

Product Collection
Intel® Compute Module HNS2600TP Family
Code Name
Products formerly Taylor Pass
Marketing Status
Discontinued
Launch Date
Q4'15
Expected Discontinuance
Q3'20
EOL Announce
Friday, July 19, 2019
Last Order
Sunday, July 5, 2020
Last Receipt Attributes
Monday, October 5, 2020
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Additional Extended Warranty Details
Intel® Compute Module HNS2000 Extended Warranty
# of QPI Links
2
Compatible Product Series
Intel® Xeon® Processor E5-2600 v4 Family
Board Form Factor
Custom 6.8" x 18.9"
Chassis Form Factor
Rack
Socket
Socket R3
Integrated Systems Available
No
Integrated BMC with IPMI
IPMI 2.0
Rack-Friendly Board
Yes
TDP
145 W
Included Items
Integrated compute module includes: (1) Intel® Server Board S2600TPR w/two 1Gb ports (Intel® Ethernet Controller I350); (1) 12Gb/s bridge board (FHWKPTPBGB24); (1) node power board (FH2000NPB24); (1) one slot PCIe x16 riser card (FHW1U16RISER2); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) rear 1U passive heat sink (FXXCA91X91HS); (3) 4056 dual rotor fan (FXX4056DRFAN2); (1) PCI Express* x16 rIOM riser and rIOM carrier board kit (AXXKPTPM2IOM); (1) Dual SFP+ port 10GBASE-T I/O module (AXX10GBNIAIOM); (1) airduct; (1) 1U node tray
Board Chipset
Intel® C612 Chipset
Target Market
Cloud/Datacenter

Supplemental Information

Embedded Options Available
No
Description
A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600TPR for higher memory capability and flexible configuration options for the Intel® Server Chassis H2224XXKR2/H2224XXLR2

Memory Specifications

Max Memory Size (dependent on memory type)
1 TB
Memory Types
DDR4-1600/1866/2133/2400
Max # of Memory Channels
8
Max Memory Bandwidth
153.6 GB/s
Physical Address Extensions
46-bit
# of Memory Slots
16
ECC Memory Supported ‡
Yes

GPU Specifications

Integrated Graphics ‡
Yes
Graphics Output
VGA
Discrete Graphics
Supported

Expansion Options

PCI Express Revision
3.0
Max # of PCI Express Lanes
64
PCIe x16 Gen 3
1
Connector for Intel® I/O Expansion Module x8 Gen 3
1
Riser Slot 1: Total # of Lanes
16
Riser Slot 2: Total # of Lanes
16
Riser Slot 3: Total # of Lanes
24
Riser Slot 4: Total # of Lanes
16

I/O Specifications

# of USB Ports
4
USB Revision
2.0
Total # of SATA Ports
6
# of Serial Ports
1
# of LAN Ports
4
Integrated LAN
2x 1GbE + 2x 10GbE SFP+
Integrated SAS Ports
6

Package Specifications

Max CPU Configuration
2

Advanced Technologies

Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® Remote Management Module Support
Yes
Intel® Node Manager
Yes
Intel® Fast Memory Access
Yes
Intel® Flex Memory Access
Yes
Intel® I/O Acceleration Technology
Yes
Intel® Advanced Management Technology
Yes
Intel® Server Customization Technology
Yes
Intel® Build Assurance Technology
Yes
Intel® Efficient Power Technology
Yes
Intel® Quiet Thermal Technology
Yes

Security & Reliability

Intel® AES New Instructions
Yes
Intel® Trusted Execution Technology ‡
No

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

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