Product Collection
Vertical Segment
Mobile
Processor Number
x3-C3230RK
Lithography
28 nm

CPU Specifications

Total Cores
4
Burst Frequency
1.10 GHz
Cache
1 MB
Scenario Design Power (SDP)
2 W

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q1'15
Embedded Options Available
No

Memory Specifications

Max Memory Size (dependent on memory type)
2 GB
Memory Types
1x32 LPDDR2/3 1066 2x16 DDR3L 1333
Max # of Memory Channels
1
Max Memory Bandwidth
4.2 GB/s

GPU Specifications

Graphics Base Frequency
600 MHz
Graphics Output
MIPI DSI
Max Refresh Rate
60 Hz
Max Resolution (eDP - Integrated Flat Panel)‡
up to 1920x1080
OpenGL* Support
ES 2.0
# of Displays Supported
1

I/O Specifications

# of USB Ports
1
USB Revision
2.0 OTG
General Purpose IO
4 x I2C
UART
2 x USIF configurable

Networking Specifications

Baseband Functions
HSDPA 21Mbps HSUPA 5.7 Mbps
RF Transceiver
A-GOLD 620
RF Transceiver Functions
Low power multimode multiband transceiver for 3G 2.5G 2G
Protocol Stack
Intel Release 9 Protocol Stack

Package Specifications

Max Operating Temperature
85 °C
Minimum Operating Temperature
-25 °C
Package Size
11mm x 11mm

Advanced Technologies

Secure Boot
Yes
Instruction Set
64-bit