Product Collection
Vertical Segment
Mobile
Processor Number
x3-C3445
Lithography
28 nm

CPU Specifications

Total Cores
4
Burst Frequency
1.40 GHz
Processor Base Frequency
1.20 GHz
Cache
1 MB
Scenario Design Power (SDP)
2 W

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q1'15
Embedded Options Available
No

Memory Specifications

Max Memory Size (dependent on memory type)
2 GB
Memory Types
1x32 LPDDR2/3 1066
Max # of Memory Channels
1
Max Memory Bandwidth
4.2 GB/s

GPU Specifications

Graphics Base Frequency
456 MHz
Graphics Output
MIPI DSI
Max Resolution (eDP - Integrated Flat Panel)‡
1280x800
DirectX* Support
9.3
OpenGL* Support
ES 3.0
# of Displays Supported
1

I/O Specifications

# of USB Ports
1
USB Revision
2.0 OTG
General Purpose IO
5 x I2C
UART
7 x USIF configurable

Networking Specifications

Baseband Functions
LTE FDD/TDD; up to Cat.6 300Mbps 2CA up to 40MHz DC-HSDPA 42Mbps HSUPA 11Mbps TD-SCDMA EDGE
RF Transceiver
SMARTi™ 4.5s
RF Transceiver Functions
Low power multimode multiband transceiver for LTE-FDD LTE-TDD 3G 2.5G 2G TD-SCDMA
Protocol Stack
Intel Release 10 Protocol Stack

Package Specifications

Max Operating Temperature
85 °C
Minimum Operating Temperature
-25 °C
Package Size
12mm x 12mm

Advanced Technologies

Secure Boot
Yes
Instruction Set
64-bit