Vertical Segment
Embedded
Processor Number
B810E
Lithography
32 nm

CPU Specifications

Total Cores
2
Total Threads
2
Processor Base Frequency
1.60 GHz
Cache
2 MB Intel® Smart Cache
TDP
35 W

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q2'11
Servicing Status
End of Servicing Lifetime
Embedded Options Available
Yes
Use Conditions
Embedded Broad Market Commercial Temp, PC/Client/Tablet
Datasheet

Memory Specifications

Max Memory Size (dependent on memory type)
16.6 GB
Memory Types
DDR3 1066/1333
Max # of Memory Channels
2
Max Memory Bandwidth
21.3 GB/s
ECC Memory Supported
Yes

GPU Specifications

GPU Name
Intel® HD Graphics for 2nd Generation Intel® Processors
Graphics Base Frequency
650 MHz
Graphics Max Dynamic Frequency
1.00 GHz
Graphics Output
eDP/DP/HDMI/SDVO/CRT
Intel® Quick Sync Video
No
Intel® InTru™ 3D Technology
No
Intel® Clear Video HD Technology
No
Intel® Clear Video Technology
No
Macrovision* License Required
No
# of Displays Supported
2

Expansion Options

PCI Express Revision
2.0
PCI Express Configurations
1x16, 2x8, 1x8 2x4
Max # of PCI Express Lanes
16

Package Specifications

Sockets Supported
FCBGA1023
TJUNCTION
100
Package Size
31mm x 24mm (FCBGA1023)

Advanced Technologies

Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® 64
Yes
Instruction Set
64-bit
Intel® My WiFi Technology
No
4G WiMAX Wireless Technology
No
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No
Thermal Monitoring Technologies
Yes
Intel® Fast Memory Access
Yes
Intel® Flex Memory Access
Yes

Security & Reliability

Intel® AES New Instructions
No
Intel® Trusted Execution Technology
No
Anti-Theft Technology
No
Intel® Virtualization Technology (VT-x)
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
No