Vertical Segment
Mobile
Lithography
130 nm

Performance Specifications

Total Cores
1
Processor Base Frequency
600 MHz
Cache
512 KB L2 Cache
Bus Speed
400 MHz
TDP
7 W

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q2'03
Servicing Status
End of Servicing Lifetime
Embedded Options Available
Yes
Datasheet

Package Specifications

Sockets Supported
H-PBGA479
TJUNCTION
100°C
Processing Die Size
83 mm2
# of Processing Die Transistors
77 million

Advanced Technologies

Intel® Turbo Boost Technology
No
Intel® Virtualization Technology (VT-x)
No
Instruction Set
32-bit
Enhanced Intel SpeedStep® Technology
Yes