Intel® E7320 Memory Controller

Intel® E7320 Memory Controller

Essentials

Product Collection
Intel® E7000 Series Chipsets
Code Name
Products formerly Lindenhurst
Marketing Status
Discontinued
Launch Date
Q3'04
Supported FSBs
800MHz
FSB Parity
Yes
TDP
9.2 W

Supplemental Information

Embedded Options Available
Yes
Datasheet
ftp://download.intel.com/design/chipsets/datashts/30300702.pdf

Memory Specifications

Max Memory Size (dependent on memory type)
32 GB
Memory Types
DDR 266 (32GB) / DDR 333 (16GB) / DDR2 400 (16GB)
Max # of Memory Channels
2
Max Memory Bandwidth
6.4 GB/s
Physical Address Extensions
36-bit
ECC Memory Supported ‡
Yes

GPU Specifications

Integrated Graphics ‡
No
Graphics Output
None
Intel® Clear Video Technology
No
Macrovision* License Required
No

Expansion Options

PCI Express Revision
1.1
PCI Express Configurations ‡
1x8

Package Specifications

Max CPU Configuration
2
Package Size
42.5mm x 42.5mm

Advanced Technologies

Intel® Fast Memory Access
No
Intel® Flex Memory Access
No

Security & Reliability

Intel® Trusted Execution Technology ‡
No

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

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