Intel® Server System D50DNP1MHCPAC Compute Module
Intel® Server System D50DNP1MHCPAC Compute Module
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Essentials
(1) – 1U air-cooled heat sink back – iPC DNP1UHSB
(1) – 1U half-width module tray – iPN M44835-xxx
(1) – 1U compute module air duct – iPN M44897-xxx
(2) – 1U riser bracket to support riser cards DNP1URISER and DNP1UMRISER – iPN M44890-xxx
(1) – 1U low-profile PCIe standard riser card – iPC DNP1URISER
(1) – 1U low-profile PCIe MCIO riser card – iPC DNP1UMRISER
(1) – MCIO cable for 1U left riser – iPN M40563-xxx
(1) – 1U air-cooled heat sink front – iPC DNP1UHSF
(1) – 1U air-cooled heat sink back – iPC DNP1UHSB
Supplemental Information
Supports two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors and up to 16 DDR5 DIMMs.
Memory & Storage
• DDR5 3DS-RDIMM
• DDR5 9x4 RDIMM
GPU Specifications
Expansion Options
I/O Specifications
• Two USB 3.0 ports via breakout cable
Package Specifications
Advanced Technologies
Security & Reliability
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.