Model Number
A770M
Microarchitecture
Xe HPG
Lithography Type
TSMC N6
Vertical Segment
Mobile
Marketing Status
Launched
Launch Date
Q2'22
Embedded Options Available
No

GPU Specifications

Xe-cores
32
Render Slices
8
Ray Tracing Units
32
Intel® Xe Matrix Extensions (Intel® XMX) Engines
512
Xe Vector Engines
512
Execution Units
512
Graphics Clock
1650 MHz
GPU Peak TOPS (Int8)
223
TGP
120W-150W
PCI Express Configurations
Up to PCI Express 4.0 x16
Device ID
0x5690

Memory Specifications

Memory Size
16 GB
Memory Type
GDDR6
Graphics Memory Interface
256 bit
Graphics Memory Bandwidth
512 GB/s
Graphics Memory Speed
16 Gbps

I/O Specifications

# of Displays Supported
4
Graphics Output
eDP* 1.4, DP 2.0 up to UHBR 10**, HDMI* 2.1, HDMI* 2.0b
Max Resolution (HDMI)
4096 x 2160@60Hz
Max Resolution (DP)
7680 x 4320@60Hz
Max Resolution (eDP - Integrated Flat Panel)
5120 x 2880@60Hz

Features

H.264 Hardware Encode/Decode
Yes
H.265 (HEVC) Hardware Encode/Decode
Yes
AV1 Encode/Decode
Yes
VP9 Bitstream & Decoding
Yes

Supported Technologies

Ray Tracing
Yes
oneAPI Support
Yes
OpenVINO™ Support
Yes
DirectX* Support
DirectX 12 Ultimate
Vulkan* Support
1.3
OpenGL* Support
Up to 4.6
OpenCL* Support
3.0
Multi-Format Codec Engines
2
VESA Adaptive Sync
Yes

Intel® Deep Link Technologies

Intel® Deep Link Dynamic Power Share
Yes
Intel® Deep Link Hyper Compute
Yes
Intel® Deep Link Hyper Encode
Yes
Intel® Deep Link Stream Assist
Yes