Product Collection
Marketing Status
Launched
Launch Date
2014
Lithography
55 nm

Resources

Logic Elements (LE)
2000
Fabric and I/O Phase-Locked Loops (PLLs)
2
Maximum Embedded Memory
108 Kb
Digital Signal Processing (DSP) Format
Multiply
Hard Memory Controllers
No
External Memory Interfaces (EMIF)
SRAM
User-Flashable Memory
Yes
Internal Configuration Storage
Yes

I/O Specifications

Maximum User I/O Count
246
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.0 V to 3.3 V LVCMOS, PCI, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL, PPDS, BLVDS, TMDS, Sub-LVDS, SLVS, HiSpi
Maximum LVDS Pairs
15

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
V36, U324, E144, M153, U169, U324

Supplemental Information