Skylake H
The 6th generation Intel® Core™ processor family, formerly Skylake H-Series (Mobile) is manufactured on Intel’s latest 14 nm technology. Paired with an Intel® CM230 or 100 series chipset, these processors offer dramatically higher CPU and graphics performance compared to the previous generation. They provide a broad range of power options and new advanced features that boost edge-to-cloud performance for Internet of Things (IoT) designs. The 6th generation Intel® Core™ processor family maintains a standardized thermal envelope for 45W (cTDP 35W), 35W, and 25W remaining consistent with the previous processor generation. The new generation is ideal for a wide range of IoT applications, including retail transaction terminals, digital signage, military and aerospace systems, casino gaming, and industrial automation.
The Intel® Xeon® processor family is introducing ball grid array (BGA) parts for mobile workstation computing needs. The BGA parts are 45W (35W cTDP) and 25W. The Intel Xeon processor E3-1200 v5 product family offers numerous advancements over the previous generation making them ideal for a wide range of IoT applications, including industrial control and automation equipment, retail devices, and military, aerospace, and government systems.
Key features on Skylake H
- Stunning visual performance
- Power-efficient performance
- Broad design range
- Advanced security and manageability
Platform componets for Skylake H
| Processor Name | Ordering Code | Cache | Clock Speed | Power | Memory |
|---|---|---|---|---|---|
| Intel® Xeon® processor e3-1515M v5 | JQ8066202193208 | 8 M | 2.8 GHz | 45 W (cTDP 35 W) | DDR4-2133, LPDDR3-1866, DDR3L-1600 |
| Intel® Xeon® processor e3-1505M v5 | CL8066202191415 | 8 M | 3.7 GHz | 45 W (cTDP 35 W) | DDR3L: 1600 DDR4: 2133 |
| Intel® Xeon® processor e3-1505L v5 | CL8066202399804 | 8 M | 2.8 GHz | 25 W | DDR3L: 1600 DDR4: 2133 |
| Intel® Core™ i7-6820EQ processor | CL8066201939103 | 8 M | 3.6 GHz | 45 W (cTDP 35 W) | DDR3L: 1600 DDR4: 2133 |
| Intel® Core™ i7-6822EQ processor | CL8066202302204 | 8 M | 2.8 GHz | 25 W | DDR3L: 1600 DDR4: 2133 |
| Intel® Core™ i5-6440EQ processor | CL8066201939503 | 6 M | 3.5 GHz | 45 W (cTDP 35 W) | DDR3L: 1600 DDR4: 2133 |
| Intel® Core™ i5-6442EQ processor | CL8066202400005 | 6 M | 2.7 GHz | 25 W | DDR3L: 1600 DDR4: 2133 |
| Intel® Core™ i3-6100E processor | CL8066201939604 | 3 M | 2.7 GHz | 35 W | DDR3L: 1600 DDR4: 2133 |
| Intel® Core™ i3-6102E processor | CL8066202400105 | 3 M | 1.9 GHz | 25 W | DDR3L: 1600 DDR4: 2133 |
| Intel® Celeron® processor G3900 | CM8066201928610 | 2 M | 2.8 GHz | 51 W | DDR4-1866/2133, DDR3L-1333/1600 |
| Intel® Celeron® processor G3902E | CL8066202400204 | 2 M | 1.6 GHz | 25 W | DDR4-1866/2133, DDR3L-1333/1600 |
| Chipset Name | Ordering Code | Power | Features |
|---|---|---|---|
| Intel® Q170 chipset | GLQ170 |
6 W | Up to six SATA ports (6 Gbps); 14 total USB ports (up to 10 USB 3.0); up to 20 PCI Express* x1 gen 3.0 ports; 1x16, 2x8 or 1x8+2x4 PCI Express graphics support; memory channels/DIMM per channel = 2/2; support Intel® vPro™ technology |
| Intel® H110 chipset | GLH110 |
6 W | Up to four SATA ports (6 Gbps); 10 total USB ports (up to 4 USB 3.0); up to six PCI Express* x1 gen 2.0 ports; 1 x 16 PCI Express graphics support; memory channels/DIMM per channel = 2/1 |
| Intel® C236 chipset | GLC236 |
6 W | Supports ECC and Intel® Active Management Technology 11.0; up to eight SATA ports (6 Gbps); 14 total USB ports (up to 10 USB 3.0); up to 20 PCI Express x1 Gen 3 ports; 1x16, 2x8 or 1x8+2x4 PCI Express graphics support; memory channels/DIMM per channel = 2/2 |
| Intel® CM236 chipset | GLCM236 |
3.7 W | Supports ECC and Intel® Active Management Technology 11.0; up to eight SATA ports (6 Gbps); 14 total USB ports (up to 10 USB 3.0); up to 20 PCI Express x1 Gen 3 ports; 1x16, 2x8 or 1x8+2x4 PCI Express graphics support; memory channels/DIMM per channel = 2/2 |