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1. Agilex™ 7 M-Series General-Purpose I/O Overview
2. Agilex™ 7 M-Series GPIO-B Banks
3. Agilex™ 7 M-Series HPS I/O Banks
4. Agilex™ 7 M-Series SDM I/O Banks
5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines
6. GPIO Intel® FPGA IP
7. Programmable I/O Features Description
8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series
9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives
10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os
2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank
2.5.3. VREF Sources and Input Standards Grouping
2.5.4. GPIO-B Pin Restrictions for External Memory Interfaces
2.5.5. RZQ Pin Requirement
2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages
2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check
2.5.8. Simultaneous Switching Noise
2.5.9. HPS Shared I/O Requirements
2.5.10. Clocking Requirements
2.5.11. SDM Shared I/O Requirements
2.5.12. Unused Pins
2.5.13. VCCIO_PIO Supply for Unused GPIO-B Banks
2.5.14. GPIO-B Pins During Power Sequencing
2.5.15. Drive Strength Requirement for GPIO-B Input Pins
2.5.16. Maximum DC Current Restrictions
2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility
2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration
2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements
2.5.20. Implementing a Pseudo Open Drain
2.5.21. Allowed Duration for Using RT OCT
2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction
2.5.23. Implementing SLVS-400 Standard at 1.1 V VCCIO_PIO Sub-bank
6.1. Release Information for GPIO Intel® FPGA IP
6.2. Generating the GPIO Intel® FPGA IP
6.3. GPIO Intel® FPGA IP Parameter Settings
6.4. GPIO Intel® FPGA IP Interface Signals
6.5. GPIO Intel® FPGA IP Architecture
6.6. Verifying Resource Utilization and Design Performance
6.7. GPIO Intel® FPGA IP Timing
6.8. GPIO Intel® FPGA IP Design Examples
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2.6.4. Net Length Reports
The net length information consists of the package trace delay from the die pad to the package pin. Each pin in an FPGA package has its own net length information. This information is important for you to perform board trace compensation to optimize the channel-to-channel skew on your board design.
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