Agilex™ 7 General-Purpose I/O User Guide: M-Series

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ID 772138
Date 10/07/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 M-Series General-Purpose I/O Overview 2. Agilex™ 7 M-Series GPIO-B Banks 3. Agilex™ 7 M-Series HPS I/O Banks 4. Agilex™ 7 M-Series SDM I/O Banks 5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines 6. GPIO Intel® FPGA IP 7. Programmable I/O Features Description 8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series 9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives 10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series
1. Agilex™ 7 M-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Agilex™ 7 M-Series GPIO-B Banks x
2.1. GPIO-B Bank Overview 2.2. GPIO-B Features 2.3. GPIO-B Implementation Guide 2.4. GPIO-B Termination 2.5. GPIO-B Design Guidelines 2.6. GPIO-B Simulation
2.1. GPIO-B Bank Overview x
2.1.1. GPIO-B Bank Structure 2.1.2. GPIO-B Buffers and Registers
2.2. GPIO-B Features x
2.2.1. Supported I/O Standards for GPIO-B Banks 2.2.2. GPIO-B Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO-B Bank
2.2.3. Programmable I/O Element Features for the GPIO-B Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Pull-Up Resistor 2.2.3.3. Guidelines: Programmable De-Emphasis
2.3. GPIO-B Implementation Guide x
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 2.3.1.3. GPIO-B Programmable IOE Features Assignment Names and Settings
2.4. GPIO-B Termination x
2.4.1. Single-Ended I/O Termination in M-Series Devices 2.4.2. True Differential Signaling I/O Termination in M-Series Devices
2.4.1. Single-Ended I/O Termination in M-Series Devices x
2.4.1.1. Single-Ended I/O Standards On-Chip Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standards On-Chip Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination in M-Series Devices x
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO-B Design Guidelines x
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. GPIO-B Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. VCCIO_PIO Supply for Unused GPIO-B Banks 2.5.14. GPIO-B Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO-B Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 1.2 V LVCMOS I/O Standard Voltage Swing Calculation 1.2 V Voltage-Referenced I/O Standards Voltage Swing Calculation 2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction 2.5.23. Implementing SLVS-400 Standard at 1.1 V VCCIO_PIO Sub-bank
2.6. GPIO-B Simulation x
2.6.1. IBIS Models—GPIO-B Support 2.6.2. IBIS-AMI Models 2.6.3. HSPICE* Models 2.6.4. Net Length Reports
3. Agilex™ 7 M-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. Programmable I/O Element Features for the HPS I/O Bank 3.2.3. HPS I/O Buffer Behavior
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. HPS I/O Pins During Power Sequencing 3.4.2. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. IBIS Models—HPS I/O Support 3.5.2. Net Length Reports
4. Agilex™ 7 M-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. SDM I/O Pins During Power Sequencing 4.3.2. Avalon® Streaming Interface Dedicated Configuration Pins
4.4. SDM I/O Simulation x
4.4.1. IBIS Models—SDM I/O Support 4.4.2. Net Length Reports
6. GPIO Intel® FPGA IP x
6.1. Release Information for GPIO Intel® FPGA IP 6.2. Generating the GPIO Intel® FPGA IP 6.3. GPIO Intel® FPGA IP Parameter Settings 6.4. GPIO Intel® FPGA IP Interface Signals 6.5. GPIO Intel® FPGA IP Architecture 6.6. Verifying Resource Utilization and Design Performance 6.7. GPIO Intel® FPGA IP Timing 6.8. GPIO Intel® FPGA IP Design Examples
6.2. Generating the GPIO Intel® FPGA IP x
6.2.1. Intel® FPGA IP Generation Output
6.3. GPIO Intel® FPGA IP Parameter Settings x
6.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.4. GPIO Intel® FPGA IP Interface Signals x
6.4.1. Shared Signals 6.4.2. Data Bit-Order for Data Interface 6.4.3. Input and Output Bus High and Low Bits 6.4.4. Data Interface Signals and Corresponding Clocks
6.5. GPIO Intel® FPGA IP Architecture x
6.5.1. GPIO Intel® FPGA IP Data Paths 6.5.2. Register Packing
6.5.1. GPIO Intel® FPGA IP Data Paths x
6.5.1.1. Input Path 6.5.1.2. Output and Output Enable Paths
6.7. GPIO Intel® FPGA IP Timing x
6.7.1. Timing Components 6.7.2. Delay Elements 6.7.3. Timing Analysis 6.7.4. Timing Closure Guidelines
6.7.3. Timing Analysis x
6.7.3.1. Single Data Rate Input Register 6.7.3.2. DDIO Input Register 6.7.3.3. Single Data Rate Output Register 6.7.3.4. DDIO Output Register
6.8. GPIO Intel® FPGA IP Design Examples x
6.8.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 6.8.2. GPIO Intel® FPGA IP Simulation Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage 7.4. Continuous Time Linear Equalization 7.5. Decision Feedback Equalization
1. Agilex™ 7 M-Series General-Purpose I/O Overview
2. Agilex™ 7 M-Series GPIO-B Banks
3. Agilex™ 7 M-Series HPS I/O Banks
4. Agilex™ 7 M-Series SDM I/O Banks
5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines
6. GPIO Intel® FPGA IP
7. Programmable I/O Features Description
8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series
9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives
10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series

2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility

Evaluate the electrical signal level compatibility between M-Series 1.05 V, 1.1 V, or 1.2 V output and the downstream device. Ensure that the VOH and VOL voltages of the 1.05 V, 1.1 V, or 1.2 V output buffer conform to the VIH and VIL specifications of the receiving buffer of the downstream device.

1.2 V LVCMOS I/O Standard Voltage Swing Calculation

If you use the 1.2 V LVCMOS I/O standard, the output signal swings from 0 V to 1.2 V on a lossless transmission line with no external pull-up or pull-down component. Ensure that the VIH or VIL tolerance of the downstream connecting device can meet those conditions.

1.2 V Voltage-Referenced I/O Standards Voltage Swing Calculation

If you use the 1.2 V voltage-referenced I/O standards, the output signal swing has a dependency on the external board termination or the internal termination of the receiver.

Figure 20. Termination Setup Using 40 Ω RS OCT Driver with On-Board 50 Ω Pull-Up Resistor to VCCIO_PIO/2 This figure shows an example termination setup and its equivalent circuit.
Figure 21. Equivalent Circuit of the Example with Output Buffer Driving HIGHWhen the output buffer is driving HIGH, the pin voltage is 0.93 V based on voltage divider rule: ( ).
Figure 22. Equivalent Circuit of the Example with Output Buffer Driving LOWWhen the output buffer is driving LOW, the pin voltage is 0.27 V based on the voltage divider rule: ( ).
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