Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series

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ID 683780
Date 7/08/2024
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Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview 2. Agilex™ 7 F-Series and I-Series GPIO Banks 3. Agilex™ 7 F-Series and I-Series HPS I/O Banks 4. Agilex™ 7 F-Series and I-Series SDM I/O Banks 5. Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines 6. Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs 7. Programmable I/O Features Description 8. Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series User Guide Archives 9. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series 10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
1. Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Agilex™ 7 F-Series and I-Series GPIO Banks x
2.1. GPIO Bank Overview 2.2. GPIO Features 2.3. GPIO Implementation Guide 2.4. GPIO Termination 2.5. GPIO Design Guidelines 2.6. GPIO Simulation
2.1. GPIO Bank Overview x
2.1.1. GPIO Bank Structure 2.1.2. GPIO Buffers and Registers
2.2. GPIO Features x
2.2.1. Supported I/O Standards for GPIO Banks 2.2.2. GPIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO Bank
2.2.3. Programmable I/O Element Features for the GPIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Open-Drain Output 2.2.3.3. Guidelines: Programmable Bus-Hold 2.2.3.4. Guidelines: Programmable Pull-Up Resistor 2.2.3.5. Guidelines: Programmable De-Emphasis
2.3. GPIO Implementation Guide x
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 2.3.1.3. GPIO Programmable IOE Features Assignment Names and Settings
2.4. GPIO Termination x
2.4.1. Single-Ended I/O Termination in F-Series and I-Series Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in F-Series and I-Series Devices x
2.4.1.1. Single-Ended I/O Standards On-Chip Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standards On-Chip Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO Design Guidelines x
2.5.1. VREF Sources and VREF Pins 2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.3. OCT Calibration Block Requirement 2.5.4. I/O Pins Placement Requirements 2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.6. Simultaneous Switching Noise 2.5.7. Special Pins Requirement 2.5.8. External Memory Interface Pin Placement Requirements 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. Voltage Setting for Unused GPIO Banks 2.5.14. GPIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme 2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
2.6. GPIO Simulation x
2.6.1. IBIS Models—GPIO Support 2.6.2. HSPICE* Models 2.6.3. Net Length Reports
3. Agilex™ 7 F-Series and I-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. HPS I/O Buffer Behavior 3.2.3. Programmable I/O Element Features for the HPS I/O Bank
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. Configuring I/O Delays Feature for the HPS I/O 3.3.3. I/O Assignments with the Quartus® Prime Assignment Editor 3.3.4. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
3.3.3. I/O Assignments with the Quartus® Prime Assignment Editor x
3.3.3.1. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 3.3.3.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. Unused Pins 3.4.2. HPS I/O Pins During Power Sequencing 3.4.3. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. IBIS Models—HPS I/O Support 3.5.2. Net Length Reports
4. Agilex™ 7 F-Series and I-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. Unused Pins 4.3.2. SDM I/O Pins During Power Sequencing
4.4. SDM I/O Simulation x
4.4.1. IBIS Models—SDM I/O Support 4.4.2. Net Length Reports
6. Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs x
6.1. GPIO Intel® FPGA IP 6.2. OCT Intel® FPGA IP
6.1. GPIO Intel® FPGA IP x
6.1.1. Release Information for GPIO Intel® FPGA IP 6.1.2. Generating the GPIO Intel® FPGA IP 6.1.3. GPIO Intel® FPGA IP Parameter Settings 6.1.4. GPIO Intel® FPGA IP Interface Signals 6.1.5. GPIO Intel® FPGA IP Architecture 6.1.6. Verifying Resource Utilization and Design Performance 6.1.7. GPIO Intel® FPGA IP Timing 6.1.8. GPIO Intel® FPGA IP Design Examples
6.1.2. Generating the GPIO Intel® FPGA IP x
6.1.2.1. Intel® FPGA IP Generation Output
6.1.3. GPIO Intel® FPGA IP Parameter Settings x
6.1.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.1.4. GPIO Intel® FPGA IP Interface Signals x
6.1.4.1. Shared Signals 6.1.4.2. Data Bit-Order for Data Interface 6.1.4.3. Input and Output Bus High and Low Bits 6.1.4.4. Data Interface Signals and Corresponding Clocks
6.1.5. GPIO Intel® FPGA IP Architecture x
6.1.5.1. GPIO Intel® FPGA IP Data Paths 6.1.5.2. Register Packing
6.1.5.1. GPIO Intel® FPGA IP Data Paths x
6.1.5.1.1. Input Path 6.1.5.1.2. Output and Output Enable Paths
6.1.7. GPIO Intel® FPGA IP Timing x
6.1.7.1. Timing Components 6.1.7.2. Delay Elements 6.1.7.3. Timing Analysis 6.1.7.4. Timing Closure Guidelines
6.1.7.3. Timing Analysis x
6.1.7.3.1. Single Data Rate Input Register 6.1.7.3.2. Full-Rate or Half-Rate DDIO Input Register 6.1.7.3.3. Single Data Rate Output Register 6.1.7.3.4. Full-Rate or Half-Rate DDIO Output Register
6.1.8. GPIO Intel® FPGA IP Design Examples x
6.1.8.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 6.1.8.2. GPIO Intel® FPGA IP Simulation Design Example
6.2. OCT Intel® FPGA IP x
6.2.1. Release Information 6.2.2. Generating the OCT Intel® FPGA IP 6.2.3. OCT Intel® FPGA IP Parameter Settings 6.2.4. OCT Intel® FPGA IP Signals 6.2.5. QSF Assignments 6.2.6. OCT Intel® FPGA IP Architecture 6.2.7. OCT Intel® FPGA IP Design Example
6.2.2. Generating the OCT Intel® FPGA IP x
6.2.2.1. Intel® FPGA IP Generation Output
6.2.7. OCT Intel® FPGA IP Design Example x
6.2.7.1. Generating the Quartus® Prime Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage
1. Agilex™ 7 F-Series and I-Series General-Purpose I/O Overview
2. Agilex™ 7 F-Series and I-Series GPIO Banks
3. Agilex™ 7 F-Series and I-Series HPS I/O Banks
4. Agilex™ 7 F-Series and I-Series SDM I/O Banks
5. Agilex™ 7 F-Series and I-Series I/O Troubleshooting Guidelines
6. Agilex™ 7 F-Series and I-Series General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series User Guide Archives
9. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series
10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series

2.5.8. External Memory Interface Pin Placement Requirements

When you select pins for External Memory Interface grouping, all pins within the same group must be located in adjacent sub-banks.

Within a GPIO bank, the top sub-bank is located near the edge of the die while the bottom sub-bank is near the FPGA core.

Interconnects between the sub-banks chain the sub-banks into a row. The following figures show examples of how I/O lanes in various sub-banks are chained together to form the top and bottom I/O rows in different device variants. These figures represent the top view of the silicon die that corresponds to a reverse view of the device package.

Figure 18. Sub-Bank Ordering in Top GPIO Row in AGF 012 and AGF 014 Devices
Figure 19. Sub-Bank Ordering in Bottom GPIO Row in AGF 012 and AGF 014 Devices

The two sub-banks within an I/O bank are adjacent to each other, unless any of the sub-banks is not bonded out or partially bonded out. The blue line in the figures shows the connectivity between the sub-banks.

For example, in the top row bank of the AGF 012 and AGF 014 devices:

  • The top sub-bank in bank 3A is adjacent to the bottom sub-bank in bank 3A and the bottom sub-bank in bank 3B.
  • The top sub-bank in bank 3B is adjacent to the bottom sub-bank in bank 3B and the top sub-bank in bank 3C.
    • The top sub-bank in bank 3B is adjacent to the top sub-bank in bank 3C even though there is a zipper block between the two sub-banks.
  • The top sub-bank in bank 3B is not adjacent to the bottom sub-bank in bank 3A.

You can identify where a pin is located within an I/O bank based on its Index within I/O Bank value in the device pinout file.

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