Quartus® Prime Pro Edition User Guide: PCB Design Tools

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ID 683768
Date 4/01/2024
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Document Table of Contents
Document Table of Contents x
Answers to Top FAQs 1. Signal Integrity Analysis with Third-Party Tools 2. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software 3. Siemens EDA PCB Design Tools Support 4. Cadence Board Design Tools Support 5. Quartus® Prime Pro Edition User Guide: PCB Design Tools Document Archives A. Quartus® Prime Pro Edition User Guides
1. Signal Integrity Analysis with Third-Party Tools x
1.1. Signal Integrity Analysis with Third-Party Tools 1.2. I/O Model Selection: IBIS or HSPICE 1.3. FPGA to Board Signal Integrity Analysis Flow 1.4. Simulation with IBIS Models 1.5. Simulation with HSPICE Models 1.6. Signal Integrity Analysis with Third-Party Tools Document Revision History
1.1. Signal Integrity Analysis with Third-Party Tools x
1.1.1. What's New In This Version 1.1.2. Signal Integrity Simulations with HSPICE and IBIS Models
1.3. FPGA to Board Signal Integrity Analysis Flow x
1.3.1. Create I/O and Board Trace Model Assignments 1.3.2. Customize the Output Files 1.3.3. Set Up and Run Simulations in Third-Party Tools 1.3.4. Interpret Simulation Results
1.4. Simulation with IBIS Models x
1.4.1. IBIS Model Access and Customization Flows 1.4.2. Elements of an IBIS Model 1.4.3. Customizing IBIS Models 1.4.4. Design Simulation Using the Siemens EDA HyperLynx* Software 1.4.5. Configuring LineSim to Use Intel IBIS Models 1.4.6. Integrating Intel IBIS Models into LineSim Simulations 1.4.7. Running and Interpreting LineSim Simulations
1.4.3. Customizing IBIS Models x
1.4.3.1. Generate Custom IBIS Models with the EDA Netlist Writer GUI 1.4.3.2. Customizing Downloaded or Installed IBIS Model Files for Agilex™ FPGA Portfolio Devices 1.4.3.3. Customizing Downloaded IBIS Models for Stratix® 10 Devices, Arria® 10 Devices, and Cyclone® 10 GX Devices
1.4.3.1. Generate Custom IBIS Models with the EDA Netlist Writer GUI x
1.4.3.1.1. Board Level Signal Integrity Analysis Settings
1.5. Simulation with HSPICE Models x
1.5.1. Supported Devices and Signaling 1.5.2. Accessing HSPICE Simulation Kits 1.5.3. The Double Counting Problem in HSPICE Simulations 1.5.4. HSPICE Writer Tool Flow 1.5.5. Running an HSPICE Simulation 1.5.6. Interpreting the Results of an Output Simulation 1.5.7. Interpreting the Results of an Input Simulation 1.5.8. Viewing and Interpreting Tabular Simulation Results 1.5.9. Viewing Graphical Simulation Results 1.5.10. Making Design Adjustments Based on HSPICE Simulations 1.5.11. Sample Input for I/O HSPICE Simulation Deck 1.5.12. Sample Output for I/O HSPICE Simulation Deck 1.5.13. Advanced Topics
1.5.3. The Double Counting Problem in HSPICE Simulations x
1.5.3.1. Defining the Double Counting Problem 1.5.3.2. The Solution to Double Counting
1.5.4. HSPICE Writer Tool Flow x
1.5.4.1. Applying I/O Assignments 1.5.4.2. Enabling HSPICE Writer Using Assignments 1.5.4.3. Naming Conventions for HSPICE Files 1.5.4.4. Invoking HSPICE Writer 1.5.4.5. Invoking HSPICE Writer from the Command Line 1.5.4.6. Customizing Automatically Generated HSPICE Decks
1.5.11. Sample Input for I/O HSPICE Simulation Deck x
1.5.11.1. Header Comment 1.5.11.2. Simulation Conditions 1.5.11.3. Simulation Options 1.5.11.4. Constant Definition 1.5.11.5. Buffer Netlist 1.5.11.6. Drive Strength 1.5.11.7. I/O Buffer Instantiation 1.5.11.8. Board Trace and Termination 1.5.11.9. Stimulus Model 1.5.11.10. Simulation Analysis
1.5.12. Sample Output for I/O HSPICE Simulation Deck x
1.5.12.1. Header Comment 1.5.12.2. Simulation Conditions 1.5.12.3. Simulation Options 1.5.12.4. Constant Definition 1.5.12.5. I/O Buffer Netlist 1.5.12.6. Drive Strength 1.5.12.7. Slew Rate and Delay Chain 1.5.12.8. I/O Buffer Instantiation 1.5.12.9. Board and Trace Termination 1.5.12.10. Double-Counting Compensation Circuitry 1.5.12.11. Simulation Analysis
1.5.13. Advanced Topics x
1.5.13.1. PVT Simulations 1.5.13.2. Hold Time Analysis 1.5.13.3. I/O Voltage Variations 1.5.13.4. Correlation Report
2. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software x
2.1. Reviewing Quartus® Prime Software Settings 2.2. Reviewing Device Pin-Out Information in the Fitter Report 2.3. Reviewing Compilation Error and Warning Messages 2.4. Using Additional Quartus® Prime Software Features 2.5. Using Additional Quartus® Prime Software Tools 2.6. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software Revision History
2.1. Reviewing Quartus® Prime Software Settings x
2.1.1. Device and Pins Options Dialog Box Settings
2.1.1. Device and Pins Options Dialog Box Settings x
2.1.1.1. Configuration Settings 2.1.1.2. Unused Pin Settings 2.1.1.3. Dual-Purpose Pins Settings 2.1.1.4. Voltage Settings 2.1.1.5. Error Detection CRC Settings
2.5. Using Additional Quartus® Prime Software Tools x
2.5.1. Pin Planner
3. Siemens EDA PCB Design Tools Support x
3.1. Integrating with DxDesigner 3.2. Siemens EDA PCB Design Tools Support Revision History
3.1. Integrating with DxDesigner x
3.1.1. DxDesigner Project Settings 3.1.2. Creating Schematic Symbols in DxDesigner
4. Cadence Board Design Tools Support x
4.1. Cadence PCB Design Tools Support 4.2. Product Comparison 4.3. FPGA-to-PCB Design Flow 4.4. Setting Up the Quartus® Prime Software 4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software 4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software 4.7. Cadence Board Design Tools Support Revision History
4.3. FPGA-to-PCB Design Flow x
4.3.1. Integrating Intel FPGA Designs
4.4. Setting Up the Quartus® Prime Software x
4.4.1. Generating a .pin File
4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software x
4.5.1. Creating Symbols 4.5.2. Instantiating the Symbol in the Cadence Allegro Design Entry HDL Software
4.5.1. Creating Symbols x
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool x
4.5.1.1.1. Cadence Allegro PCB Librarian Part Developer Tool in the Design Flow 4.5.1.1.2. Import and Export Wizard 4.5.1.1.3. Editing and Fracturing Symbol 4.5.1.1.4. Updating FPGA Symbols
4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software x
4.6.1. Creating a Cadence Allegro Design Entry CIS Project 4.6.2. Generating a Part 4.6.3. Generating Schematic Symbol 4.6.4. Splitting a Part 4.6.5. Instantiating a Symbol in a Design Entry CIS Schematic 4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software
4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software x
4.6.6.1. Using the Intel-provided Libraries with your Cadence Allegro Design Entry CIS Project
Answers to Top FAQs
1. Signal Integrity Analysis with Third-Party Tools
2. Reviewing Printed Circuit Board Schematics with the Quartus® Prime Software
3. Siemens EDA PCB Design Tools Support
4. Cadence Board Design Tools Support
5. Quartus® Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Quartus® Prime Pro Edition User Guides

4.6.4. Splitting a Part

After saving a new symbol in a project library, you can fracture the symbol into multiple parts called sections. Fracturing a part into separate sections is useful for FPGA designs. A single symbol for most FPGA packages might be too large for a single schematic page. Splitting the part into separate sections allows you to organize parts of the symbol by function, creating cleaner circuit schematics. For example, you can create one slot for an I/O symbol, a second slot for a JTAG symbol, and a third slot for a power/ground symbol.

Figure 23. Splitting a Symbol into Multiple Sections


Note: Although symbol generation in the Design Entry CIS software refers to symbol fractures as sections, other tools use different names to refer to symbol fractures.

To split a part into sections, select the part in its library in the Project Manager window of the Cadence Allegro Design Entry CIS software. On the Tools menu, click Split Part or right-click the part and choose Split Part. The Split Part Section Input Spreadsheet appears.

Figure 24. Split Part Section Input Spreadsheet


Each row in the spreadsheet represents a pin in the symbol. The Section column indicates the section of the symbol to which each pin is assigned. You can locate all pins in a new symbol in section 1. You can change the values in the Section column to assign pins to various sections of the symbol. You can also specify the side of a section on the location of the pin by changing the values in the Location column. When you are ready, click Split. A new symbol appears in the same library as the original with the name <original part name>_Split1.

View and edit each section individually. To view the new sections of the part, double-click the part. The Part Symbol Editor window appears and the first section of the part displays for editing. On the View menu, click Package to view thumbnails of all the part sections. To edit the section of the symbol, double-click the thumbnail.

For more information about splitting parts into sections and editing symbol sections in the Cadence Allegro Design Entry CIS software, refer to the Help in the software.

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