Intel® FPGA Power and Thermal Calculator Release Notes

ID 683455
Date 9/26/2022
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents

7.5. Known Issues and Workarounds

The I/O-IP page does not populate or utilize the Bank ID columns on the PLL and I/O pages for external memory interface (EMIF) applications.