AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

Download PDF
ID 683255
Date 3/29/2019
Public
Document Table of Contents
Document Table of Contents x
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices x
1.1. Handling J-Lead and QFP Devices 1.2. Transferring Devices Between Tubes 1.3. Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays 1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices 1.5. Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes 1.6. Ordering Information 1.7. Document Revision History for AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
1.1. Handling J-Lead and QFP Devices x
1.1.1. Tubes for J-Lead Devices and QFP Devices in Carriers 1.1.2. Stoppers for J-Lead and QFP Devices in Carriers 1.1.3. Foam for J-Lead Devices and QFP Devices in Carriers 1.1.4. Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers 1.1.5. Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
1.4. Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices x
1.4.1. Dry Pack Sizes
1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

1. Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

This application note provides guidelines for handling J-Lead, Quad Flat Pack (QFP), and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA packaging) devices to preserve the quality of these devices during storage, shipment, and transfer and to ensure easier soldering.

Devices that use surface-mount J-Lead, QFP, BGA, FBGA, and lidless BGA are now common on boards because they provide density, size, and cost benefits. However, a few precautions are necessary to protect these devices from mechanical damage during transportation and storage.

Note: All lidless flip chip and wire bond packages are non-vented packages. All other flip chip packages are vented packages.
Level Two Title