AN752: Guidelines for Handling Altera Wafer Level Chip Scale Package (WLCSP)

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ID 683229
Date 11/02/2015
Public
Document Table of Contents
Document Table of Contents x
1. Guidelines for Handling Altera Wafer Level Chip Scale Package 2. Document Revision History
1. Guidelines for Handling Altera Wafer Level Chip Scale Package x
1.1. Pick and Place Process 1.2. Vacuum Pen
1. Guidelines for Handling Altera Wafer Level Chip Scale Package
2. Document Revision History

1. Guidelines for Handling Altera Wafer Level Chip Scale Package

Proper care must be taken when handling Altera’s Wafer Level Chip Scale Package (WLCSP) components.

Follow these guidelines.

  • Make sure hardened pick-up tools are not used in handling WLCSP devices. Use vacuum pen with the correct suction cup size. The cup must be smaller than actual WLCSP device to ensure vacuum suction.
    CAUTION:
    Hardened pick-up tools, such as tweezers, may damage components.
  • Altera's WLCSP are shipped in a Tape and Reel carrier. Do not store or transport WLCSP devices in containers other than the Tape and Reel carriers. Other containers may cause additional damage to the devices.
  • Use appropriate vacuum pressure, 60–70 kilopascal (kPa), on the devices.
Level Two Title