External Memory Interfaces Intel® Arria® 10 FPGA IP User Guide

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ID 683106
Date 12/19/2023
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Document Table of Contents
Document Table of Contents x
1. Release Information 2. External Memory Interfaces Intel® Arria® 10 FPGA IP Introduction 3. Intel® Arria® 10 EMIF IP Product Architecture 4. Intel® Arria® 10 EMIF IP End-User Signals 5. Intel® Arria® 10 EMIF – Simulating Memory IP 6. Intel® Arria® 10 EMIF IP for DDR3 7. Intel® Arria® 10 EMIF IP for DDR4 8. Intel® Arria® 10 EMIF IP for QDR II/II+/II+ Xtreme 9. Intel® Arria® 10 EMIF IP for QDR-IV 10. Intel® Arria® 10 EMIF IP for RLDRAM 3 11. Intel® Arria® 10 EMIF IP for LPDDR3 12. Intel® Arria® 10 EMIF IP Timing Closure 13. Optimizing Controller Performance 14. Intel® Arria® 10 EMIF IP Debugging 15. External Memory Interfaces Intel® Arria® 10 FPGA IP User Guide Archives 16. Document Revision History for External Memory Interfaces Intel® Arria® 10 FPGA IP User Guide
2. External Memory Interfaces Intel® Arria® 10 FPGA IP Introduction x
2.1. Intel® Arria® 10 EMIF IP Design Flow 2.2. Intel® Arria® 10 EMIF IP Design Checklist
3. Intel® Arria® 10 EMIF IP Product Architecture x
3.1. EMIF Architecture: Introduction 3.2. Intel® Arria® 10 EMIF Sequencer 3.3. Intel® Arria® 10 EMIF Calibration 3.4. Periodic OCT Recalibration 3.5. Intel® Arria® 10 EMIF Controller 3.6. Hardware Resource Sharing Among Multiple EMIFs 3.7. Intel® Arria® 10 EMIF for Hard Processor Subsystem 3.8. Intel® Arria® 10 EMIF Ping Pong PHY 3.9. Intel® Arria® 10 EMIF and SmartVID
3.1. EMIF Architecture: Introduction x
3.1.1. I/O Subsystem 3.1.2. I/O Column 3.1.3. I/O AUX 3.1.4. I/O Bank 3.1.5. I/O Lane 3.1.6. Input DQS Clock Tree 3.1.7. PHY Clock Tree 3.1.8. PLL Reference Clock Networks 3.1.9. Clock Phase Alignment
3.1.4. I/O Bank x
3.1.4.1. Implementing a x8 Interface with Hard Memory Controller 3.1.4.2. Implementing a x72 Interface with Hard Memory Controller
3.2. Intel® Arria® 10 EMIF Sequencer x
3.2.1. DQS Tracking
3.3. Intel® Arria® 10 EMIF Calibration x
3.3.1. Calibration Stages 3.3.2. Calibration Stages Descriptions 3.3.3. Calibration Algorithms Address and Command Calibration Read Calibration Write Calibration 3.3.4. Calibration Flowchart
3.4. Periodic OCT Recalibration x
3.4.1. Operation 3.4.2. Technical Restrictions 3.4.3. Efficiency Impact
3.5. Intel® Arria® 10 EMIF Controller x
3.5.1. Hard Memory Controller 3.5.2. Hard Memory Controller Rate Conversion Feature
3.5.1. Hard Memory Controller x
3.5.1.1. Hard Memory Controller Features 3.5.1.2. Hard Memory Controller Main Control Path 3.5.1.3. Data Buffer Controller
3.6. Hardware Resource Sharing Among Multiple EMIFs x
3.6.1. I/O Aux Sharing 3.6.2. I/O Bank Sharing 3.6.3. PLL Reference Clock Sharing 3.6.4. Core Clock Network Sharing
3.7. Intel® Arria® 10 EMIF for Hard Processor Subsystem x
3.7.1. Restrictions on I/O Bank Usage for Intel® Arria® 10 EMIF IP with HPS 3.7.2. Using the EMIF Debug Toolkit with Intel® Arria® 10 HPS Interfaces
3.8. Intel® Arria® 10 EMIF Ping Pong PHY x
3.8.1. Ping Pong PHY Feature Description 3.8.2. Ping Pong PHY Architecture 3.8.3. Ping Pong PHY Limitations 3.8.4. Ping Pong PHY Calibration 3.8.5. Using the Ping Pong PHY 3.8.6. Ping Pong PHY Simulation Example Design
4. Intel® Arria® 10 EMIF IP End-User Signals x
4.1. Interface and Signal Descriptions 4.2. AFI Signals 4.3. AFI 4.0 Timing Diagrams 4.4. Intel® Arria® 10 Memory Mapped Register (MMR) Tables
4.1. Interface and Signal Descriptions x
4.1.1. Intel Arria 10 EMIF IP Interfaces for DDR3 4.1.2. Intel Arria 10 EMIF IP Interfaces for DDR4 4.1.3. Intel Arria 10 EMIF IP Interfaces for LPDDR3 4.1.4. Intel Arria 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme 4.1.5. Intel Arria 10 EMIF IP Interfaces for QDR-IV 4.1.6. Intel Arria 10 EMIF IP Interfaces for RLDRAM 3
4.1.1. Intel Arria 10 EMIF IP Interfaces for DDR3 x
4.1.1.1. pll_ref_clk for DDR3 4.1.1.2. pll_locked for DDR3 4.1.1.3. pll_extra_clk_0 for DDR3 4.1.1.4. pll_extra_clk_1 for DDR3 4.1.1.5. pll_extra_clk_2 for DDR3 4.1.1.6. pll_extra_clk_3 for DDR3 4.1.1.7. oct for DDR3 4.1.1.8. mem for DDR3 4.1.1.9. status for DDR3 4.1.1.10. afi_reset_n for DDR3 4.1.1.11. afi_clk for DDR3 4.1.1.12. afi_half_clk for DDR3 4.1.1.13. afi for DDR3 4.1.1.14. emif_usr_reset_n for DDR3 4.1.1.15. emif_usr_clk for DDR3 4.1.1.16. emif_usr_reset_n_sec for DDR3 4.1.1.17. emif_usr_clk_sec for DDR3 4.1.1.18. cal_debug_reset_n for DDR3 4.1.1.19. cal_debug_clk for DDR3 4.1.1.20. cal_debug_out_reset_n for DDR3 4.1.1.21. cal_debug_out_clk for DDR3 4.1.1.22. clks_sharing_master_out for DDR3 4.1.1.23. clks_sharing_slave_in for DDR3 4.1.1.24. clks_sharing_slave_out for DDR3 4.1.1.25. ctrl_amm for DDR3 4.1.1.26. ctrl_auto_precharge for DDR3 4.1.1.27. ctrl_user_priority for DDR3 4.1.1.28. ctrl_ecc_user_interrupt for DDR3 4.1.1.29. ctrl_ecc_readdataerror for DDR3 4.1.1.30. ctrl_mmr_slave for DDR3 4.1.1.31. hps_emif for DDR3 4.1.1.32. cal_debug for DDR3 4.1.1.33. cal_debug_out for DDR3
4.1.2. Intel Arria 10 EMIF IP Interfaces for DDR4 x
4.1.2.1. pll_ref_clk for DDR4 4.1.2.2. pll_locked for DDR4 4.1.2.3. pll_extra_clk_0 for DDR4 4.1.2.4. pll_extra_clk_1 for DDR4 4.1.2.5. pll_extra_clk_2 for DDR4 4.1.2.6. pll_extra_clk_3 for DDR4 4.1.2.7. oct for DDR4 4.1.2.8. mem for DDR4 4.1.2.9. status for DDR4 4.1.2.10. afi_reset_n for DDR4 4.1.2.11. afi_clk for DDR4 4.1.2.12. afi_half_clk for DDR4 4.1.2.13. afi for DDR4 4.1.2.14. emif_usr_reset_n for DDR4 4.1.2.15. emif_usr_clk for DDR4 4.1.2.16. emif_usr_reset_n_sec for DDR4 4.1.2.17. emif_usr_clk_sec for DDR4 4.1.2.18. cal_debug_reset_n for DDR4 4.1.2.19. cal_debug_clk for DDR4 4.1.2.20. cal_debug_out_reset_n for DDR4 4.1.2.21. cal_debug_out_clk for DDR4 4.1.2.22. clks_sharing_master_out for DDR4 4.1.2.23. clks_sharing_slave_in for DDR4 4.1.2.24. clks_sharing_slave_out for DDR4 4.1.2.25. ctrl_amm for DDR4 4.1.2.26. ctrl_auto_precharge for DDR4 4.1.2.27. ctrl_user_priority for DDR4 4.1.2.28. ctrl_ecc_user_interrupt for DDR4 4.1.2.29. ctrl_ecc_readdataerror for DDR4 4.1.2.30. ctrl_mmr_slave for DDR4 4.1.2.31. hps_emif for DDR4 4.1.2.32. cal_debug for DDR4 4.1.2.33. cal_debug_out for DDR4
4.1.3. Intel Arria 10 EMIF IP Interfaces for LPDDR3 x
4.1.3.1. pll_ref_clk for LPDDR3 4.1.3.2. pll_locked for LPDDR3 4.1.3.3. pll_extra_clk_0 for LPDDR3 4.1.3.4. pll_extra_clk_1 for LPDDR3 4.1.3.5. pll_extra_clk_2 for LPDDR3 4.1.3.6. pll_extra_clk_3 for LPDDR3 4.1.3.7. oct for LPDDR3 4.1.3.8. mem for LPDDR3 4.1.3.9. status for LPDDR3 4.1.3.10. afi_reset_n for LPDDR3 4.1.3.11. afi_clk for LPDDR3 4.1.3.12. afi_half_clk for LPDDR3 4.1.3.13. afi for LPDDR3 4.1.3.14. emif_usr_reset_n for LPDDR3 4.1.3.15. emif_usr_clk for LPDDR3 4.1.3.16. cal_debug_reset_n for LPDDR3 4.1.3.17. cal_debug_clk for LPDDR3 4.1.3.18. cal_debug_out_reset_n for LPDDR3 4.1.3.19. cal_debug_out_clk for LPDDR3 4.1.3.20. clks_sharing_master_out for LPDDR3 4.1.3.21. clks_sharing_slave_in for LPDDR3 4.1.3.22. clks_sharing_slave_out for LPDDR3 4.1.3.23. ctrl_user_priority for LPDDR3 4.1.3.24. ctrl_mmr_slave for LPDDR3 4.1.3.25. cal_debug for LPDDR3 4.1.3.26. cal_debug_out for LPDDR3
4.1.4. Intel Arria 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme x
4.1.4.1. pll_ref_clk for QDR II/II+/II+ Xtreme 4.1.4.2. pll_locked for QDR II/II+/II+ Xtreme 4.1.4.3. pll_extra_clk_0 for QDR II/II+/II+ Xtreme 4.1.4.4. pll_extra_clk_1 for QDR II/II+/II+ Xtreme 4.1.4.5. pll_extra_clk_2 for QDR II/II+/II+ Xtreme 4.1.4.6. pll_extra_clk_3 for QDR II/II+/II+ Xtreme 4.1.4.7. oct for QDR II/II+/II+ Xtreme 4.1.4.8. mem for QDR II/II+/II+ Xtreme 4.1.4.9. status for QDR II/II+/II+ Xtreme 4.1.4.10. emif_usr_reset_n for QDR II/II+/II+ Xtreme 4.1.4.11. emif_usr_clk for QDR II/II+/II+ Xtreme 4.1.4.12. cal_debug_reset_n for QDR II/II+/II+ Xtreme 4.1.4.13. cal_debug_clk for QDR II/II+/II+ Xtreme 4.1.4.14. cal_debug_out_reset_n for QDR II/II+/II+ Xtreme 4.1.4.15. cal_debug_out_clk for QDR II/II+/II+ Xtreme 4.1.4.16. clks_sharing_master_out for QDR II/II+/II+ Xtreme 4.1.4.17. clks_sharing_slave_in for QDR II/II+/II+ Xtreme 4.1.4.18. clks_sharing_slave_out for QDR II/II+/II+ Xtreme 4.1.4.19. ctrl_amm for QDR II/II+/II+ Xtreme 4.1.4.20. cal_debug for QDR II/II+/II+ Xtreme 4.1.4.21. cal_debug_out for QDR II/II+/II+ Xtreme
4.1.5. Intel Arria 10 EMIF IP Interfaces for QDR-IV x
4.1.5.1. pll_ref_clk for QDR-IV 4.1.5.2. pll_locked for QDR-IV 4.1.5.3. pll_extra_clk_0 for QDR-IV 4.1.5.4. pll_extra_clk_1 for QDR-IV 4.1.5.5. pll_extra_clk_2 for QDR-IV 4.1.5.6. pll_extra_clk_3 for QDR-IV 4.1.5.7. oct for QDR-IV 4.1.5.8. mem for QDR-IV 4.1.5.9. status for QDR-IV 4.1.5.10. afi_reset_n for QDR-IV 4.1.5.11. afi_clk for QDR-IV 4.1.5.12. afi_half_clk for QDR-IV 4.1.5.13. afi for QDR-IV 4.1.5.14. emif_usr_reset_n for QDR-IV 4.1.5.15. emif_usr_clk for QDR-IV 4.1.5.16. cal_debug_reset_n for QDR-IV 4.1.5.17. cal_debug_clk for QDR-IV 4.1.5.18. cal_debug_out_reset_n for QDR-IV 4.1.5.19. cal_debug_out_clk for QDR-IV 4.1.5.20. clks_sharing_master_out for QDR-IV 4.1.5.21. clks_sharing_slave_in for QDR-IV 4.1.5.22. clks_sharing_slave_out for QDR-IV 4.1.5.23. ctrl_amm for QDR-IV 4.1.5.24. cal_debug for QDR-IV 4.1.5.25. cal_debug_out for QDR-IV
4.1.6. Intel Arria 10 EMIF IP Interfaces for RLDRAM 3 x
4.1.6.1. pll_ref_clk for RLDRAM 3 4.1.6.2. pll_locked for RLDRAM 3 4.1.6.3. pll_extra_clk_0 for RLDRAM 3 4.1.6.4. pll_extra_clk_1 for RLDRAM 3 4.1.6.5. pll_extra_clk_2 for RLDRAM 3 4.1.6.6. pll_extra_clk_3 for RLDRAM 3 4.1.6.7. oct for RLDRAM 3 4.1.6.8. mem for RLDRAM 3 4.1.6.9. status for RLDRAM 3 4.1.6.10. afi_reset_n for RLDRAM 3 4.1.6.11. afi_clk for RLDRAM 3 4.1.6.12. afi_half_clk for RLDRAM 3 4.1.6.13. afi for RLDRAM 3 4.1.6.14. cal_debug_reset_n for RLDRAM 3 4.1.6.15. cal_debug_clk for RLDRAM 3 4.1.6.16. cal_debug_out_reset_n for RLDRAM 3 4.1.6.17. cal_debug_out_clk for RLDRAM 3 4.1.6.18. clks_sharing_master_out for RLDRAM 3 4.1.6.19. clks_sharing_slave_in for RLDRAM 3 4.1.6.20. clks_sharing_slave_out for RLDRAM 3 4.1.6.21. cal_debug for RLDRAM 3 4.1.6.22. cal_debug_out for RLDRAM 3
4.2. AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Tracking Management Signals 4.2.7. AFI Shadow Register Management Signals
4.3. AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Intel® Arria® 10 Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. sbcfg1 4.4.5. caltiming0 4.4.6. caltiming1 4.4.7. caltiming2 4.4.8. caltiming3 4.4.9. caltiming4 4.4.10. caltiming9 4.4.11. dramaddrw 4.4.12. sideband0 4.4.13. sideband1 4.4.14. sideband2 4.4.15. sideband3 4.4.16. sideband4 4.4.17. sideband5 4.4.18. sideband6 4.4.19. sideband7 4.4.20. sideband8 4.4.21. sideband9 4.4.22. sideband10 4.4.23. sideband11 4.4.24. sideband12 4.4.25. sideband13 4.4.26. dramsts 4.4.27. niosreserve0 4.4.28. niosreserve1 4.4.29. ecc3: ECC Error and Interrupt Configuration 4.4.30. ecc4: Status and Error Information 4.4.31. ecc5: Address of Most Recent SBE/DBE 4.4.32. ecc6: Address of Most Recent Correction Command Dropped
5. Intel® Arria® 10 EMIF – Simulating Memory IP x
5.1. Simulation Options 5.2. Simulation Walkthrough
5.2. Simulation Walkthrough x
5.2.1. Calibration Modes 5.2.2. Abstract PHY Simulation 5.2.3. Simulation Scripts 5.2.4. Functional Simulation with Verilog HDL 5.2.5. Functional Simulation with VHDL 5.2.6. Simulating the Design Example
6. Intel® Arria® 10 EMIF IP for DDR3 x
6.1. Parameter Descriptions 6.2. Board Skew Equations 6.3. Pin and Resource Planning 6.4. DDR3 Board Design Guidelines
6.1. Parameter Descriptions x
6.1.1. Intel Arria 10 EMIF IP DDR3 Parameters: General 6.1.2. Intel Arria 10 EMIF IP DDR3 Parameters: FPGA I/O 6.1.3. Intel Arria 10 EMIF IP DDR3 Parameters: Memory 6.1.4. Intel Arria 10 EMIF IP DDR3 Parameters: Mem I/O 6.1.5. Intel Arria 10 EMIF IP DDR3 Parameters: Mem Timing 6.1.6. Intel Arria 10 EMIF IP DDR3 Parameters: Board 6.1.7. Intel Arria 10 EMIF IP DDR3 Parameters: Controller 6.1.8. Intel Arria 10 EMIF IP DDR3 Parameters: Diagnostics 6.1.9. Intel Arria 10 EMIF IP DDR3 Parameters: Example Designs
6.2. Board Skew Equations x
6.2.1. Equations for DDR3 Board Skew Parameters
6.3. Pin and Resource Planning x
6.3.1. Interface Pins 6.3.2. FPGA Resources 6.3.3. Pin Guidelines for Intel® Arria® 10 EMIF IP
6.3.1. Interface Pins x
6.3.1.1. Estimating Pin Requirements 6.3.1.2. DIMM Options 6.3.1.3. Maximum Number of Interfaces
6.3.2. FPGA Resources x
6.3.2.1. OCT 6.3.2.2. PLL
6.3.3. Pin Guidelines for Intel® Arria® 10 EMIF IP x
6.3.3.1. General Guidelines 6.3.3.2. x4 DIMM Implementation 6.3.3.3. Command and Address Signals 6.3.3.4. Clock Signals 6.3.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 6.3.3.6. Resource Sharing Guidelines (Multiple Interfaces) 6.3.3.7. Ping-Pong PHY Implementation
6.4. DDR3 Board Design Guidelines x
6.4.1. Terminations and Slew Rates with Intel® Arria® 10 Devices 6.4.2. Channel Signal Integrity Measurement 6.4.3. Layout Approach 6.4.4. Design Layout Guidelines 6.4.5. Package Deskew
6.4.1. Terminations and Slew Rates with Intel® Arria® 10 Devices x
6.4.1.1. Dynamic On-Chip Termination (OCT) in Intel® Arria® 10 Devices 6.4.1.2. Choosing Terminations on Intel® Arria® 10 Devices 6.4.1.3. On-Chip Termination Recommendations for Intel® Arria® 10 Devices 6.4.1.4. Slew Rates
6.4.2. Channel Signal Integrity Measurement x
6.4.2.1. Importance of Accurate Channel Signal Integrity Information 6.4.2.2. Understanding Channel Signal Integrity Measurement 6.4.2.3. How to Enter Calculated Channel Signal Integrity Values 6.4.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
6.4.4. Design Layout Guidelines x
6.4.4.1. General Layout Guidelines 6.4.4.2. Layout Guidelines 6.4.4.3. Length Matching Rules 6.4.4.4. Spacing Guidelines 6.4.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 6.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals
6.4.5. Package Deskew x
6.4.5.1. DQ/DQS/DM Deskew 6.4.5.2. Address and Command Deskew 6.4.5.3. Package Deskew Recommendations for Intel® Arria® 10 Devices 6.4.5.4. Deskew Example 6.4.5.5. Package Migration
7. Intel® Arria® 10 EMIF IP for DDR4 x
7.1. Parameter Descriptions 7.2. Board Skew Equations 7.3. Pin and Resource Planning 7.4. DDR4 Board Design Guidelines
7.1. Parameter Descriptions x
7.1.1. Intel Arria 10 EMIF IP DDR4 Parameters: General 7.1.2. Intel Arria 10 EMIF IP DDR4 Parameters: FPGA I/O 7.1.3. Intel Arria 10 EMIF IP DDR4 Parameters: Memory 7.1.4. Intel Arria 10 EMIF IP DDR4 Parameters: Mem I/O 7.1.5. Intel Arria 10 EMIF IP DDR4 Parameters: Mem Timing 7.1.6. Intel Arria 10 EMIF IP DDR4 Parameters: Board 7.1.7. Intel Arria 10 EMIF IP DDR4 Parameters: Controller 7.1.8. Intel Arria 10 EMIF IP DDR4 Parameters: Diagnostics 7.1.9. Intel Arria 10 EMIF IP DDR4 Parameters: Example Designs
7.2. Board Skew Equations x
7.2.1. Equations for DDR4 Board Skew Parameters
7.3. Pin and Resource Planning x
7.3.1. Interface Pins 7.3.2. FPGA Resources 7.3.3. Pin Guidelines for Intel® Arria® 10 EMIF IP 7.3.4. Resource Sharing Guidelines (Multiple Interfaces)
7.3.1. Interface Pins x
7.3.1.1. Estimating Pin Requirements 7.3.1.2. DIMM Options 7.3.1.3. Maximum Number of Interfaces
7.3.2. FPGA Resources x
7.3.2.1. OCT 7.3.2.2. PLL
7.3.3. Pin Guidelines for Intel® Arria® 10 EMIF IP x
7.3.3.1. General Guidelines 7.3.3.2. x4 DIMM Implementation 7.3.3.3. Command and Address Signals 7.3.3.4. Clock Signals 7.3.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 7.3.3.6. alert_n Pin Termination Recommendation
7.4. DDR4 Board Design Guidelines x
7.4.1. Terminations and Slew Rates with Intel® Arria® 10 Devices 7.4.2. Channel Signal Integrity Measurement 7.4.3. Layout Approach 7.4.4. Design Layout Guidelines 7.4.5. Package Deskew
7.4.1. Terminations and Slew Rates with Intel® Arria® 10 Devices x
7.4.1.1. Dynamic On-Chip Termination (OCT) in Intel® Arria® 10 Devices 7.4.1.2. Dynamic On-Die Termination (ODT) in DDR4 7.4.1.3. Choosing Terminations on Intel® Arria® 10 Devices 7.4.1.4. On-Chip Termination Recommendations for Intel® Arria® 10 Devices 7.4.1.5. Slew Rates
7.4.2. Channel Signal Integrity Measurement x
7.4.2.1. Importance of Accurate Channel Signal Integrity Information 7.4.2.2. Understanding Channel Signal Integrity Measurement 7.4.2.3. How to Enter Calculated Channel Signal Integrity Values 7.4.2.4. Guidelines for Calculating DDR4 Channel Signal Integrity
7.4.4. Design Layout Guidelines x
7.4.4.1. General Layout Guidelines 7.4.4.2. Layout Guidelines 7.4.4.3. Length Matching Rules 7.4.4.4. Spacing Guidelines 7.4.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 7.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals 7.4.4.7. Additional Layout Guidelines for DDR4 Twin-die Devices
7.4.5. Package Deskew x
7.4.5.1. DQ/DQS/DM Deskew 7.4.5.2. Address and Command Deskew 7.4.5.3. Package Deskew Recommendations for Intel® Arria® 10 Devices 7.4.5.4. Deskew Example 7.4.5.5. Package Migration
8. Intel® Arria® 10 EMIF IP for QDR II/II+/II+ Xtreme x
8.1. Parameter Descriptions 8.2. Board Skew Equations 8.3. Pin and Resource Planning 8.4. QDR II/II+/II+ Xtreme Board Design Guidelines
8.1. Parameter Descriptions x
8.1.1. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: General 8.1.2. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: FPGA I/O 8.1.3. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Memory 8.1.4. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Mem Timing 8.1.5. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Board 8.1.6. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Controller 8.1.7. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Diagnostics 8.1.8. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Example Designs
8.2. Board Skew Equations x
8.2.1. Equations for QDRII, QDRII+, and QDRII+ Xtreme Board Skew Parameters
8.3. Pin and Resource Planning x
8.3.1. Interface Pins
8.3.1. Interface Pins x
8.3.1.1. Estimating Pin Requirements 8.3.1.2. Maximum Number of Interfaces 8.3.1.3. FPGA Resources 8.3.1.4. OCT 8.3.1.5. PLL 8.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP
8.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP x
8.3.1.6.1. General Guidelines 8.3.1.6.2. QDR II, QDR II+ and QDR II+ Xtreme SRAM Command Signals 8.3.1.6.3. QDR II, QDR II+ and QDR II+ Xtreme SRAM Address Signals 8.3.1.6.4. QDR II, QDR II+, and QDR II+ Xtreme SRAM Clock Signals 8.3.1.6.5. QDR II, QDR II+ and QDR II+ Xtreme SRAM Data, BWS, and QVLD Signals 8.3.1.6.6. Resource Sharing Guidelines (Multiple Interfaces)
8.4. QDR II/II+/II+ Xtreme Board Design Guidelines x
8.4.1. QDR II SRAM Configurations 8.4.2. General Layout Guidelines 8.4.3. QDR II Layout Guidelines 8.4.4. QDR II SRAM Layout Approach 8.4.5. Package Deskew 8.4.6. Package Migration 8.4.7. Slew Rates
9. Intel® Arria® 10 EMIF IP for QDR-IV x
9.1. Parameter Descriptions 9.2. Board Skew Equations 9.3. Pin and Resource Planning 9.4. QDR-IV Board Design Guidelines
9.1. Parameter Descriptions x
9.1.1. Intel Arria 10 EMIF IP QDR-IV Parameters: General 9.1.2. Intel Arria 10 EMIF IP QDR-IV Parameters: FPGA I/O 9.1.3. Intel Arria 10 EMIF IP QDR-IV Parameters: Memory 9.1.4. Intel Arria 10 EMIF IP QDR-IV Parameters: Mem Timing 9.1.5. Intel Arria 10 EMIF IP QDR-IV Parameters: Board 9.1.6. Intel Arria 10 EMIF IP QDR-IV Parameters: Controller 9.1.7. Intel Arria 10 EMIF IP QDR-IV Parameters: Diagnostics 9.1.8. Intel Arria 10 EMIF IP QDR-IV Parameters: Example Designs
9.2. Board Skew Equations x
9.2.1. Equations for QDR-IV Board Skew Parameters
9.3. Pin and Resource Planning x
9.3.1. Interface Pins
9.3.1. Interface Pins x
9.3.1.1. Estimating Pin Requirements 9.3.1.2. Maximum Number of Interfaces 9.3.1.3. FPGA Resources 9.3.1.4. OCT 9.3.1.5. PLL 9.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP 9.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
9.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP x
9.3.1.6.1. General Guidelines 9.3.1.6.2. QDR IV SRAM Commands and Addresses, AP, and AINV Signals 9.3.1.6.3. QDR IV SRAM Clock Signals 9.3.1.6.4. QDR IV SRAM Data, DINV, and QVLD Signals
9.4. QDR-IV Board Design Guidelines x
9.4.1. QDR-IV Layout Approach 9.4.2. General Layout Guidelines 9.4.3. QDR-IV Layout Guidelines 9.4.4. Package Deskew 9.4.5. Package Migration 9.4.6. Slew Rates
10. Intel® Arria® 10 EMIF IP for RLDRAM 3 x
10.1. Parameter Descriptions 10.2. Board Skew Equations 10.3. Pin and Resource Planning 10.4. RLDRAM 3 Board Design Guidelines
10.1. Parameter Descriptions x
10.1.1. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: General 10.1.2. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: FPGA I/O 10.1.3. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Memory 10.1.4. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Mem Timing 10.1.5. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Board 10.1.6. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Controller 10.1.7. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Diagnostics 10.1.8. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Example Designs
10.2. Board Skew Equations x
10.2.1. Equations for RLDRAM 3 Board Skew Parameters
10.3. Pin and Resource Planning x
10.3.1. Interface Pins
10.3.1. Interface Pins x
10.3.1.1. Estimating Pin Requirements 10.3.1.2. Maximum Number of Interfaces 10.3.1.3. FPGA Resources 10.3.1.4. OCT 10.3.1.5. PLL 10.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP 10.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
10.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP x
10.3.1.6.1. General Guidelines 10.3.1.6.2. RLDRAM 3 Commands and Addresses 10.3.1.6.3. RLDRAM 3 Clock Signals 10.3.1.6.4. RLDRAM 3 Data, DM and QVLD Signals
10.4. RLDRAM 3 Board Design Guidelines x
10.4.1. RLDRAM 3 Configurations 10.4.2. General Layout Guidelines 10.4.3. RLDRAM 3 Layout Guidelines 10.4.4. Layout Approach 10.4.5. Package Deskew 10.4.6. Package Migration
11. Intel® Arria® 10 EMIF IP for LPDDR3 x
11.1. Parameter Descriptions 11.2. Board Skew Equations 11.3. Pin and Resource Planning 11.4. LPDDR3 Board Design Guidelines
11.1. Parameter Descriptions x
11.1.1. Intel Arria 10 EMIF IP LPDDR3 Parameters: General 11.1.2. Intel Arria 10 EMIF IP LPDDR3 Parameters: FPGA I/O 11.1.3. Intel Arria 10 EMIF IP LPDDR3 Parameters: Memory 11.1.4. Intel Arria 10 EMIF IP LPDDR3 Parameters: Mem I/O 11.1.5. Intel Arria 10 EMIF IP LPDDR3 Parameters: Mem Timing 11.1.6. Intel Arria 10 EMIF IP LPDDR3 Parameters: Board 11.1.7. Intel Arria 10 EMIF IP LPDDR3 Parameters: Controller 11.1.8. Intel Arria 10 EMIF IP LPDDR3 Parameters: Diagnostics 11.1.9. Intel Arria 10 EMIF IP LPDDR3 Parameters: Example Designs
11.2. Board Skew Equations x
11.2.1. Equations for LPDDR3 Board Skew Parameters
11.3. Pin and Resource Planning x
11.3.1. Interface Pins
11.3.1. Interface Pins x
11.3.1.1. Estimating Pin Requirements 11.3.1.2. Maximum Number of Interfaces 11.3.1.3. FPGA Resources 11.3.1.4. OCT 11.3.1.5. PLL 11.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP
11.3.1.6. Pin Guidelines for Intel® Arria® 10 EMIF IP x
11.3.1.6.1. General Guidelines 11.3.1.6.2. LPDDR3 Clock Signal 11.3.1.6.3. LPDDR3 Command and Address Signal 11.3.1.6.4. LPDDR3 Data, Data Strobe, and DM Signals 11.3.1.6.5. Resource Sharing Guidelines (Multiple Interfaces)
11.4. LPDDR3 Board Design Guidelines x
11.4.1. Terminations and Slew Rates with Intel® Arria® 10 Devices 11.4.2. Channel Signal Integrity Measurement 11.4.3. Layout Approach 11.4.4. Design Layout Guidelines 11.4.5. Package Deskew
11.4.1. Terminations and Slew Rates with Intel® Arria® 10 Devices x
11.4.1.1. Dynamic On-Chip Termination (OCT) in Intel® Arria® 10 Devices 11.4.1.2. Choosing Terminations on Intel® Arria® 10 Devices 11.4.1.3. On-Chip Termination Recommendations for Intel® Arria® 10 Devices
11.4.2. Channel Signal Integrity Measurement x
11.4.2.1. Importance of Accurate Channel Signal Integrity Information 11.4.2.2. Understanding Channel Signal Integrity Measurement 11.4.2.3. How to Enter Calculated Channel Signal Integrity Values 11.4.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
11.4.4. Design Layout Guidelines x
11.4.4.1. General Layout Guidelines 11.4.4.2. Layout Guidelines 11.4.4.3. Length Matching Rules 11.4.4.4. Spacing Guidelines 11.4.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 11.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals
11.4.5. Package Deskew x
11.4.5.1. DQ/DQS/DM Deskew 11.4.5.2. Address and Command Deskew 11.4.5.3. Package Deskew Recommendations for Intel® Arria® 10 Devices 11.4.5.4. Deskew Example 11.4.5.5. Package Migration
12. Intel® Arria® 10 EMIF IP Timing Closure x
12.1. Timing Closure 12.2. Timing Report DDR 12.3. Optimizing Timing 12.4. Early I/O Timing Estimation
12.1. Timing Closure x
12.1.1. Timing Analysis
12.1.1. Timing Analysis x
12.1.1.1. PHY or Core 12.1.1.2. I/O Timing
12.1.1.2. I/O Timing x
12.1.1.2.1. Read Capture 12.1.1.2.2. Write 12.1.1.2.3. Address and Command 12.1.1.2.4. DQS Gating / Postamble 12.1.1.2.5. Write Leveling
12.4. Early I/O Timing Estimation x
12.4.1. Performing Early I/O Timing Analysis
13. Optimizing Controller Performance x
13.1. Interface Standard 13.2. Bank Management Efficiency 13.3. Data Transfer 13.4. Improving Controller Efficiency
13.4. Improving Controller Efficiency x
13.4.1. Auto-Precharge Commands 13.4.2. Latency 13.4.3. Calibration 13.4.4. Bank Interleaving 13.4.5. Additive Latency and Bank Interleaving 13.4.6. User-Controlled Refresh 13.4.7. Frequency of Operation 13.4.8. Series of Reads or Writes 13.4.9. Data Reordering 13.4.10. Starvation Control 13.4.11. Command Reordering 13.4.12. Bandwidth 13.4.13. Enable Command Priority Control
13.4.2. Latency x
13.4.2.1. Additive Latency
13.4.6. User-Controlled Refresh x
13.4.6.1. Back-to-Back User-Controlled Refresh Usage
14. Intel® Arria® 10 EMIF IP Debugging x
14.1. Interface Configuration Performance Issues 14.2. Functional Issue Evaluation 14.3. Timing Issue Characteristics 14.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer 14.5. Hardware Debugging Guidelines 14.6. Categorizing Hardware Issues 14.7. Debugging Intel® Arria® 10 EMIF IP 14.8. Using the Traffic Generator with the Generated Design Example
14.1. Interface Configuration Performance Issues x
14.1.1. Interface Configuration Bottleneck and Efficiency Issues
14.2. Functional Issue Evaluation x
14.2.1. Intel® IP Memory Model 14.2.2. Vendor Memory Model 14.2.3. Transcript Window Messages 14.2.4. Modifying the Example Driver to Replicate the Failure
14.3. Timing Issue Characteristics x
14.3.1. Evaluating FPGA Timing Issues 14.3.2. Evaluating External Memory Interface Timing Issues
14.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer x
14.4.1. Signals to Monitor with the Signal Tap II Logic Analyzer
14.5. Hardware Debugging Guidelines x
14.5.1. Create a Simplified Design that Demonstrates the Same Issue 14.5.2. Measure Power Distribution Network 14.5.3. Measure Signal Integrity and Setup and Hold Margin 14.5.4. Vary Voltage 14.5.5. Operate at a Lower Speed 14.5.6. Determine Whether the Issue Exists in Previous Versions of Software 14.5.7. Determine Whether the Issue Exists in the Current Version of Software 14.5.8. Try A Different PCB 14.5.9. Try Other Configurations 14.5.10. Debugging Checklist
14.6. Categorizing Hardware Issues x
14.6.1. Signal Integrity Issues 14.6.2. Hardware and Calibration Issues
14.6.1. Signal Integrity Issues x
14.6.1.1. Characteristics of Signal Integrity Issues 14.6.1.2. Evaluating SignaI Integrity Issues
14.6.1.2. Evaluating SignaI Integrity Issues x
14.6.1.2.1. Skew 14.6.1.2.2. Crosstalk 14.6.1.2.3. Power System 14.6.1.2.4. Clock Signals 14.6.1.2.5. Read Data Valid Window and Eye Diagram 14.6.1.2.6. Write Data Valid Window and Eye Diagram 14.6.1.2.7. OCT and ODT Usage
14.6.2. Hardware and Calibration Issues x
14.6.2.1. Postamble Timing Issues and Margin 14.6.2.2. Intermittent Issue Evaluation
14.7. Debugging Intel® Arria® 10 EMIF IP x
14.7.1. Debugging With the External Memory Interface Debug Toolkit 14.7.2. On-Chip Debug Port for Intel® Arria® 10 EMIF IP 14.7.3. Efficiency Monitor and Protocol Checker
14.7.1. Debugging With the External Memory Interface Debug Toolkit x
14.7.1.1. User Interface 14.7.1.2. Communication 14.7.1.3. Setup and Use 14.7.1.4. Configuring Your EMIF IP for Use with the Debug Toolkit 14.7.1.5. Reports 14.7.1.6. On-Die Termination Calibration 14.7.1.7. Eye Diagram 14.7.1.8. Driver Margining for Intel® Arria® 10 EMIF IP 14.7.1.9. Example Tcl Script for Running the EMIF Debug Toolkit 14.7.1.10. Using the EMIF Debug Toolkit with Intel® Arria® 10 HPS Interfaces
14.7.1.4. Configuring Your EMIF IP for Use with the Debug Toolkit x
14.7.1.4.1. Daisy-Chaining Additional EMIF IP Cores for Debugging 14.7.1.4.2. General Workflow 14.7.1.4.3. Linking the Project to a Device 14.7.1.4.4. Establishing Communication to Connections 14.7.1.4.5. Selecting an Active Interface
14.7.1.8. Driver Margining for Intel® Arria® 10 EMIF IP x
14.7.1.8.1. Determining Margin
14.7.2. On-Chip Debug Port for Intel® Arria® 10 EMIF IP x
14.7.2.1. EMIF On-Chip Debug Port 14.7.2.2. Access Protocol
14.7.3. Efficiency Monitor and Protocol Checker x
14.7.3.1. Including the Efficiency Monitor and Protocol Checker in Your Generated IP 14.7.3.2. Running the Efficiency Monitor with the External Memory Debug Toolkit 14.7.3.3. Communicating Directly to the Efficiency Monitor and Protocol Checker
1. Release Information
2. External Memory Interfaces Intel® Arria® 10 FPGA IP Introduction
3. Intel® Arria® 10 EMIF IP Product Architecture
4. Intel® Arria® 10 EMIF IP End-User Signals
5. Intel® Arria® 10 EMIF – Simulating Memory IP
6. Intel® Arria® 10 EMIF IP for DDR3
7. Intel® Arria® 10 EMIF IP for DDR4
8. Intel® Arria® 10 EMIF IP for QDR II/II+/II+ Xtreme
9. Intel® Arria® 10 EMIF IP for QDR-IV
10. Intel® Arria® 10 EMIF IP for RLDRAM 3
11. Intel® Arria® 10 EMIF IP for LPDDR3
12. Intel® Arria® 10 EMIF IP Timing Closure
13. Optimizing Controller Performance
14. Intel® Arria® 10 EMIF IP Debugging
15. External Memory Interfaces Intel® Arria® 10 FPGA IP User Guide Archives
16. Document Revision History for External Memory Interfaces Intel® Arria® 10 FPGA IP User Guide

3.3.3. Calibration Algorithms

The calibration algorithms sometimes vary, depending on the targeted memory protocol.

Address and Command Calibration

Address and command calibration consists of the following parts:
  • Leveling calibration— (DDR3 and DDR4 only) Toggles the CS# and CAS# signals to send read commands while keeping other address and command signals constant. The algorithm monitors for incoming DQS signals, and if the DQS signal toggles, it indicates that the read commands have been accepted. The algorithm then repeats using different delay values, to find the optimal window.

  • Deskew calibration— (DDR4, QDR-IV, and LPDDR3 only)
    • (DDR4) Uses the DDR4 address and command parity feature. The FPGA sends the address and command parity bit, and the DDR4 memory device responds with an alert signal if the parity bit is detected. The alert signal from the memory device tells the FPGA that the parity bit was received.

      Deskew calibration requires use of the PAR/ALERT# pins, so you should not omit these pins from your design. One limitation of deskew calibration is that it cannot deskew ODT and CKE pins.

    • (QDR-IV) Uses the QDR-IV loopback mode. The FPGA sends address and command signals, and the memory device sends back the address and command signals which it captures, via the read data pins. The returned signals indicate to the FPGA what the memory device has captured. Deskew calibration can deskew all synchronous address and command signals.
    • (LPDDR3) Uses the LPDDR3 CA training mode. The FPGA sends signals onto the LPDDR3 CA bus, and the memory device sends back those signals that it captures, via the DQ pins. The returned signals indicate to the FPGA what the memory device has captured. Deskew calibration can deskew all signals on the CA bus. The remaining command signals (CS, CKE, and ODT) are calibrated based on the average of the deskewed CA bus.

Read Calibration

  • DQSen calibration— (DDR3, DDR4, LPDDR3, RLDRAMx and QDRx) DQSen calibration occurs before Read deskew, therefore only a single DQ bit is required to pass in order to achieve a successful read pass.
    • (DDR3, DDR4, and LPDDR3) The DQSen calibration algorithm searches the DQS preamble using a hardware state machine. The algorithm sends many back-to-back reads with a one clock cycle gap between. The hardware state machine searches for the DQS gap while sweeping DQSen delay values. the algorithm then increments the VFIFO value, and repeats the process until a pattern is found. The process is then repeated for all other read DQS groups.

    • (RLDRAMx and QDRx) The DQSen calibration algorithm does not use a hardware state machine; rather, it calibrates cycle-level delays using software and subcycle delays using DQS tracking hardware. The algorithm requires good data in memory, and therefore relies on guaranteed writes. (Writing a burst of 0s to one location, and a burst of 1s to another; back-to-back reads from these two locations are used for read calibration.)

      The algorithm enables DQS tracking to calibrate the phase component of DQS enable. It then issues a guaranteed write, followed by back-to-back reads. The algorithm sweeps DQSen values cycle by cycle until the read operation succeeds. The process is then repeated for all other read groups.

  • Deskew calibration— Read deskew calibration is performed before write leveling, and must be performed at least twice: once before write calibration, using simple data patterns from guaranteed writes, and again after write calibration, using complex data patterns.

    The deskew calibration algorithm performs a guaranteed write, and then sweeps dqs_in delay values from low to high, to find the right edge of the read window. The algorithm then sweeps dq-in delay values low to high, to find the left edge of the read window. Updated dqs_in and dq_in delay values are then applied to center the read window. The algorithm then repeats the process for all data pins.

  • Vref-In calibration— Read Vref-In calibration begins by programming Vref-In with an arbitrary value. The algorithm then sweeps the Vref-In value from the starting value to both ends, and measures the read window for each value. The algorithm selects the Vref-In value which provides the maximum read window.

  • LFIFO calibration— Read LFIFO calibration normalizes read delays between groups. The PHY must present all data to the controller as a single data bus. The LFIFO latency should be large enough for the slowest read data group, and large enough to allow proper synchronization across FIFOs.

Write Calibration

  • Leveling calibration— Write leveling calibration aligns the write strobe and clock to the memory clock, to compensate for skews. In general, leveling calibration tries a variety of delay values to determine the edges of the write window, and then selects an appropriate value to center the window. The details of the algorithm vary, depending on the memory protocol.
    • (DDRx, LPDDR3) Write leveling occurs before write deskew, therefore only one successful DQ bit is required to register a pass. Write leveling staggers the DQ bus to ensure that at least one DQ bit falls within the valid write window.
    • (RLDRAMx) Optimizes for the CK versus DK relationship.
    • (QDR-IV) Optimizes for the CK versus DK relationship. Is covered by address and command deskew using the loopback mode.
    • (QDR II/II+/Xtreme) The K clock is the only clock, therefore write leveling is not required.
  • Deskew calibration— Performs per-bit deskew of write data relative to the write strobe and clock. Write deskew calibration does not change dqs_out delays; the write clock is aligned to the CK clock during write leveling.

  • VREF-Out calibration— (DDR4) Calibrates the VREF level at the memory device. The VREF-Out calibration algorithm is similar to the VREF-In calibration algorithm.
Level Two Title