Intel® Docea™ solutions enable modeling and simulation of the power consumption and thermal behavior of electronic systems from an architectural perspective. The solutions are used to secure specifications, optimize power behavior, and accelerate validation and verification of design projects. Intel® Docea™ solutions apply to both electronic systems, such as boards and OEM devices, and semiconductor devices, including IC, SoC, and System in Package.
Intel® Docea™ software solutions enable a larger exploration of the design space for more power-efficient architectures, creating opportunities for productivity gains in the management of complex power architecture data as well as time-to-market savings in power/thermal verification and validation.
Intel® Docea™ Power Analytics (PA)
Capitalize on power data and improve power rollup productivity: Intel® Docea™ Power Analytics (PA) is a collaborative power modeling framework that will suit the most demanding organizations.
Intel® Docea™ Thermal Profiler (TP)
Generate multi-source compact thermal models that are up to 3 orders of magnitude1 faster to run than numerical models. Simulate the transient thermal behavior of a system in a realistic use case or thermal management policy.
Intel® Docea™ Power Simulator (PS)
Shift left your power and thermal management software development and validation with a dedicated virtual prototype for power and thermal.
Product and Performance Information
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks.
Test and System Configurations: public presentation from Samsung, published at DAC and is available on http://www2.dac.com/events/designertrackarchivesearch.aspx.