FPGA Moisture Sensitivity Level (MSL) Search Tool

The MSL data in this page is for Intel® Arria® 10, Intel® Cyclone® 10, Intel® MAX® 10 and older Programmable Device families.

Find guidance on the classification level of plastic devices that are sensitive to moisture induced stress, so that they can be properly stored and handled prior to assembly, solder reflow attachment, and/or repair operations.

Enter the part number in the “Search Part Number” box to obtain the MSL rating. Or select the values in the Filter By section: 1 – FPGA Device Family, 2 – Product Line / Density, 3 – Package Type + Pin Count, and 4 – Solder Type (if applicable). 1

For Intel Agilex® and Intel® Stratix® 10 Programmable Device Families, please consult the respective PRQ / Qualification Report or the respective MAS documents.

PRQ / Qualification Reports and MAS Documents require Premier access, please Sign in to the Intel® Developer Zone or Register to get access to the documents.

Note: For device drying or baking conditions, please refer to the higher temperature (125C +/10C, <5% RH) User Bake conditions stipulated in J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices.

A RoHS-compliant part number is denoted by the suffix "N".

Moisture/Reflow Sensitivity Classification

If a device is classified as MSL 1, it is not moisture sensitive and the device does not have to be dry packed again after the pack has been opened.

If a device is classified at a higher numerical level, it is moisture sensitive and must be dry packed in accordance with J-STD-033.

If a device is classified as Level 6, it is extremely moisture sensitive and the dry pack will not provide adequate protection. Please refer to Intel® packing label on the baking time before reflow soldering.

Disclaimer

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This search tool is designed to help you determine the moisture sensitivity level (MSL) value of an Intel device based on specified input parameters. The tool and MSL values contained herein are for classification level reference only and should not be used or relied upon for soldering or any other purposes. Please refer to the MSL on Intel packing labels to determine the criteria for baking prior to soldering. Although Intel makes every attempt to keep the information on this website current, we do not promise or guarantee that the information is correct, complete, or up-to-date. Intel may make changes to the materials at this site, or to the products described in them, at any time without notice. The tool provided at this site is provided on an “as-is” basis. Intel makes no representations, warranties or guarantees, express or implied, as to the calculator or its results, including as to the accuracy, completeness, or genuineness thereof, or suitability for any purpose other than as indicated above.