Description
Thermal management is an important design consideration for 90-nm Stratix II devices. The design of Altera® device packages minimizes thermal resistance and maximizes power dissipation. However, some applications dissipate more power and require external thermal solutions, including heat sinks. Application Note AN 358: Thermal Management for 90-nm FPGAs includes a section on determining heat sink usage.
Environment
BUILT IN - ARTICLE INTRO SECOND COMPONENT