Supported Modules for Intel® Server System D50TNP Family

The Intel® Server System D50TNP Family offers varieties of modules that can meet different workload requirements in today's data centers. These modules are available to support each of these workload criteria that can fit within the same 2U system chassis.

Each module within a system configuration is independently operated from the others. The modules installed within the same 2U system chassis share resources such as power and cooling.

The table below describes the different ways that an Intel® Server System D50TNP can be configured. For additional information regarding configuration options, see Configuration Guide for the Intel® Server D50TNP Product Family.

* See Appendix E of Technical Product Specification for the Intel® Server D50TNP Product Family for detailed information on Thermal Design Power (TDP).

Mixing of different modules within the same system chassis can be done as follows:

1. Up to two 1U Air-cooled Compute Modules and one 2U Management Module
2. Up to two 1U Air-cooled Compute Modules and one 2U Storage Module
3. One 2U Management Module and one 2U Storage Module

Intel® Server Board D50TNP1SB is at the heart of all the different modules within the product family, supporting the 3rd Generation Intel® Xeon® Scalable Processors.

Each different module type supports a different feature set in terms of:

• Type of cooling
• Storage options
• Memory options
• PCIe* add-in card support