Mobile Intel® Processor Package Types

Documentation

Product Information & Documentation

000006761

05/11/2018

Micro-FCPGA
The micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side. 

Photo examples
(Front side) (Back side)

Micro-FCBGA
Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls which act as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls, which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top side.

Photo examples
(Front side) (Back side)

Micro-BGA2 package
The BGA2 package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls which act as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The Pentium® III processor uses the BGA2 package, which includes 495 balls.

Photo examples
(Front side) (Back side)

Micro-PGA2 package
The micro-PGA2 consists of a BGA package mounted to an interposer with small pins. The pins are 1.25 mm long and 0.30 mm in diameter. While there are several micro-PGA2 socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the mobile Pentium III processor.

Photo examples
(Front side) (Back side)

MMC-2 package
The Mobile Module Cartridge 2 (MMC-2) package has a mobile Pentium® III processor and the host bridge system controller (consisting of the processor bus controller, memory controller, and PCI bus controller) on a small circuit. It connects to the system via a 400-pin connector. On the MMC-2 package, the thermal transfer plate (TTP) provides heat dissipation from the processor and host bridge system controller.

Photo examples
(Front side) (Back side)