Thermal resistances

Important: Thermal resistances are used by the PowerPlay® Power Analyzer. These settings do not affect timing analysis.

The following settings are available for thermal resistances:

  • Use cooling solution— Allows you to specify a custom cooling solution or select a preconfigured cooling solution.
  • Junction-to-case— Provides the junction-to-case thermal resistance in degrees Celsius per watt for the device selected in the Device dialog box.
  • Case-to-heat sink— Displays the case-to-heat sink thermal resistance in degrees Celsius per watt. If you specified Custom in Use cooling solution, allows you to specify the case-to-heat sink thermal resistance.
Scripting Information

Keyword:POWER_OCS_VALUE

Settings:<thermal resistance in degrees Celsius per watt>

  • Heat sink-to-ambient— Displays the heat sink-to-ambient thermal resistance in degrees Celsius per watt. If you specified Custom in Use cooling solution, allows you to specify the heat sink-to-ambient thermal resistance.
Scripting Information

Keyword:POWER_OSA_VALUE

Settings:<thermal resistance in degrees Celsius per watt>