Thermal resistances
Important: Thermal resistances are used by the
PowerPlay® Power Analyzer. These
settings do not affect timing analysis.
The following settings are available for thermal resistances:
- Use cooling solution— Allows you to specify a custom cooling solution or select a preconfigured cooling solution.
- Junction-to-case— Provides the junction-to-case thermal resistance in degrees Celsius per watt for the device selected in the Device dialog box.
- Case-to-heat sink— Displays the case-to-heat sink thermal resistance in degrees Celsius per watt. If you specified Custom in Use cooling solution, allows you to specify the case-to-heat sink thermal resistance.
Scripting Information |
Settings: |
- Heat sink-to-ambient— Displays the heat sink-to-ambient thermal resistance in degrees Celsius per watt. If you specified Custom in Use cooling solution, allows you to specify the heat sink-to-ambient thermal resistance.
Scripting Information |
Settings: |