FineLineBall-Grid Array (BGA) is a type of BGA device package in which the pins are spaced 1.0 mm apart. FineLine BGA devices support the SameFrame feature, in which the pin-out of the device is a subset or superset of the pin-outs of other FineLine BGA devices. This feature allows you to use device migration to transfer a design from the current FineLine BGA supported device(Arria series, Cyclone series, MAX V, and Stratix series) family to a larger or smaller FineLine BGA device in the same device family, while maintaining the current board layout and pin assignments.
UltraFineLineBGA packages are similar to FineLineBGA packages, but have a 0.88-mm ball pitch.
Hybrid FineLine BGA packages are similar to FineLine BGA packages, but have a 27-mm body to accommodate the larger cavity requirement of the die.
Micro FineLine BGA (MBGA) packages are available for MAX II devices. MBGA packages are suitable for any application that has board space or power constraints. MBGA packages have a 0.5-mm ball pitch.