Ball-Grid Array (BGA) is a device package offered by Altera. In BGA packages the I/O connections are on the interior of the device, improving the ratio between pin count and board area. Typical BGA packages contain up to twice as many connections as quad flat pack (QFP) packages for the same area. Further, BGA solder balls are considerably stronger than QFP leads, resulting in robust packages that can tolerate rough handling.