Intel® Compute Module HNS2600BPQ24

Intel® Compute Module HNS2600BPQ24

Essentials

Product Collection
Intel® Server System S2600BPR Family
Code Name
Products formerly Buchanan Pass
Marketing Status
Discontinued
Launch Date
Q3'17
Expected Discontinuance
Q3'19
EOL Announce
Monday, April 22, 2019
Last Order
Thursday, August 22, 2019
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Additional Extended Warranty Details
Intel® Compute Module HNS2000 Extended Warranty
Supported Operating Systems
Windows Server 2016*, Windows Server 2012 R2*, Red Hat Enterprise Linux 7.3*, SUSE Linux Enterprise Server 12 SP2*, CentOS 7.3*
Compatible Product Series
Intel® Xeon® Scalable Processors
Board Form Factor
Custom 6.8" x 19.1"
Chassis Form Factor
2U Rack
Socket
Socket P
Integrated Systems Available
Yes
Integrated BMC with IPMI
IPMI 2.0 & Redfish
Rack-Friendly Board
Yes
TDP
165 W
Included Items
(1) 1U node tray(1) Intel® Server Board S2600BPQ(1) Power Docking Board FHWBPNPB24, (3) 40x56mm dual rotor managed fans FXX4056DRFAN2(1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS(1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS(1) Air duct(1) External VGA port bracket (1) Slot 2 riser card w/80mm M.2 SSD slot, Support for Intel® QuickAssist® Technology. Required Items – Sold Separately: One (1) bridge board option - AHWBPBGB24, AHWBPBGB24R OR AHWBPBGB24P; One or two Intel® Xeon® processor Scalable family,Up to Sixteen (16) DDR4 RDIMM/LRDIMM
Board Chipset
Intel® C628 Chipset
Target Market
High Performance Computing

Supplemental Information

Embedded Options Available
No
Description
A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPQ for large memory capability and flexible configuration options for the Intel® Server Chassis H2224XXLR3.
Additional Information
View now

Memory Specifications

Max Memory Size (dependent on memory type)
1.46 TB
Memory Types
DDR4 ECC RDIMM/LRDIMM 2133/2400/2666
Max # of Memory Channels
12
# of Memory Slots
16
ECC Memory Supported ‡
Yes

GPU Specifications

Integrated Graphics ‡
No
Graphics Output
VGA

Expansion Options

PCI Express Revision
3.0
Max # of PCI Express Lanes
64
Riser Slot 2: Total # of Lanes
24
Riser Slot 3: Total # of Lanes
24
Riser Slot 4: Total # of Lanes
16

I/O Specifications

# of USB Ports
2
USB Revision
3.0
Total # of SATA Ports
0
RAID Configuration
RAID Levels 0/1/10/5/50 (LSI)
# of Serial Ports
1
# of LAN Ports
2
Integrated LAN
2x 10GbE; 1x 1GbE (Dedicated Management)

Package Specifications

Max CPU Configuration
2

Advanced Technologies

Intel® Optane™ Memory Supported ‡
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® Remote Management Module Support
Yes
Intel® Node Manager
Yes
TPM Version
2.0

Intel® Transparent Supply Chain

Includes Statement of Conformance and Platform Certificate
No

Security & Reliability

Intel® AES New Instructions
Yes
Intel® Trusted Execution Technology ‡
Yes

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

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