Intel® Server System R1304SP4SHOC

Intel® Server System R1304SP4SHOC

Essentials

Product Collection
Intel® Server System R1000SP Family
Code Name
Products formerly Salmon Pass
Launch Date
Q3'12
Marketing Status
Discontinued
Expected Discontinuance
Q2'17
EOL Announce
Wednesday, December 21, 2016
Last Order
Friday, June 30, 2017
Last Receipt Attributes
Tuesday, October 31, 2017
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Additional Extended Warranty Details
Single Processor System Extended Warranty
Chassis Form Factor
1U Rack
Chassis Dimensions
1.7" x 17.2" x 21.8"
Board Form Factor
ATX 12" x 9.6"
Rack Rails Included
Yes
Compatible Product Series
Intel® Xeon® Processor E5-2400 v2 Product Family
Socket
Socket B2
TDP
145 W
Heat Sink
1
Heat Sink Included
Yes
System Board
Intel® Server Board S1400SP4
Board Chipset
Intel® C602 Chipset
Target Market
Embedded
Rack-Friendly Board
Yes
Power Supply
450 W
Power Supply Type
AC
# of Power Supply Included
2
Redundant Fans
Yes
Redundant Power Supported
Yes
Backplanes
Included
Included Items
(1) Intel® Server Board S1400SP4

Memory & Storage

Memory Types
DDR3 ECC UDIMM 1333/1600, RDIMM 1333/1600
# of Memory Slots
6
Max Memory Size (dependent on memory type)
96 GB
# of Front Drives Supported
4
Front Drive Form Factor
Hot-swap 2.5" or 3.5"

GPU Specifications

Integrated Graphics ‡
Yes

Expansion Options

PCIe x8 Gen 3
1
Connector for Intel® I/O Expansion Module x8 Gen 3
1
Connector for Intel® Integrated RAID Module
1

I/O Specifications

# of USB Ports
13
Total # of SATA Ports
14
RAID Configuration
Software RAID 0,1,10,5 (LSI RSTE)
# of Serial Ports
2
Integrated LAN
4x 1Gbe
# of LAN Ports
4
Optical Drive Support
Yes
Firewire
No
Integrated SAS Ports
0
Embedded USB (eUSB) Solid State Drive Option
Yes
Integrated InfiniBand*
No

Package Specifications

Max CPU Configuration
1

Advanced Technologies

Intel® Remote Management Module Support
Yes
Integrated BMC with IPMI
IPMI 2.0 with OEM extensions
Intel® Node Manager
Yes
Intel® On-Demand Redundant Power
Yes
Intel® Advanced Management Technology
Yes
Intel® Server Customization Technology
Yes
Intel® Build Assurance Technology
Yes
Intel® Efficient Power Technology
Yes
Intel® Quiet Thermal Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® Matrix Storage Technology
No
Intel® Rapid Storage Technology
No
Intel® Rapid Storage Technology enterprise
Yes
TPM Version
1.2

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

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