Vertical Segment
Mobile
Lithography
130 nm

Performance Specifications

Total Cores
1
Processor Base Frequency
1.60 GHz
Cache
1 MB L2 Cache
Bus Speed
400 MHz
FSB Parity
No
TDP
24.5 W
VID Voltage Range
0.956V-1.484V

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q2'03
Servicing Status
End of Servicing Updates
Embedded Options Available
Yes
Datasheet

Memory Specifications

Physical Address Extensions
32-bit
ECC Memory Supported
No

Package Specifications

Sockets Supported
H-PBGA479,PPGA478
TJUNCTION
100°C
Package Size
35mm x 35mm
Processing Die Size
83 mm2
# of Processing Die Transistors
77 million

Advanced Technologies

Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® Virtualization Technology (VT-x)
No
Intel® 64
No
Instruction Set
32-bit
Idle States
No
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No

Security & Reliability

Intel® Trusted Execution Technology
No
Execute Disable Bit
No