Product Collection
Launch Date
Q1'23
Marketing Status
Discontinued
Expected Discontinuance
2023
EOL Announce
Friday, May 5, 2023
Last Order
Friday, June 30, 2023
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Additional Extended Warranty Details
Chassis Form Factor
1U Rack
Chassis Dimensions
767 x 438 x 43 mm
Board Form Factor
18.79” x 16.84”
Rack Rails Included
No
Compatible Product Series
4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
Socket
Socket-E LGA4677
TDP
205 W
Heat Sink Included
Yes
Board Chipset
Target Market
Mainstream
Rack-Friendly Board
Yes
Power Supply
1600 W
Power Supply Type
AC
# of Power Supply Included
0
Redundant Fans
Yes
Redundant Power Supported
Yes
Backplanes
Included
Included Items
(1) – 1U 2.5" chassis – iPN M36832-xxx
(1) – Server board – iPC M50FCP2SBSTD
(1) 12 x 2.5" combo HSBP – iPC CYPHSBP1212
(12) SSD mounting rail with extraction levers – iPN K71493-xxx
(12) 2.5" drive blanks – iPN K71491-xxx
(1) Riser #1 Bracket
(1) 1-Slot x16 LP PCIe riser card (Riser Slot #1) – iPC FCP1URISER1
(1) – Riser #2 Bracket - iPN K72604-001
(1) – Front panel (left) with two USB ports – iPN K48177- xxx
(1) – Front Panel (left) USB cable– iPN K67061- xxx
(1) – Front panel (right) with control panel – iPN K48178- xxx
(1) – Front panel (right) cable pin – iPN K67060- xxx
(8) – Dual-rotor system fans – iPC CYPFAN1UKIT
(16) – DIMM slot blanks – iPN M45676- xxx
(2) –Standard 1U heat sink- – iPC FCP1UHSSTD
(2) – E1A (XCC) processor clips – iPN AXXSPRXCCCC
(2) - E1B (MCC) processor clips - iPN AXXSPRMCCCC
(1) – Air baffle (left) – iPN K72602- xxx
(1) – Air baffle (right) – iPN K72603- xxx
(1) – Intel® RAID Maintenance Free Backup Unit (RMFBU) bracket
NOTE: NO PSU included

Supplemental Information

Description
Integrated 1U system featuring an Intel® Server Board M50FCP2SBSTD,
supporting two 4th Generation Intel® Xeon® Scalable processors,
(12) 2.5" SSD with air cooling.

Memory & Storage

Memory Types
• DDR5 (RDIMM)
• 3DS-RDIMM
• 9x4 RDIMM
• Intel® Optane™ PMem 300 series
# of Memory Slots
32
Max Memory Size (dependent on memory type)
12 TB
# of Front Drives Supported
12
Front Drive Form Factor
Hot-swap 2.5" SSD
# of Internal Drives Supported
2
Internal Drive Form Factor
M.2 SSD
Intel® Optane™ Persistent Memory Supported
Yes

GPU Specifications

Integrated Graphics
Yes

Expansion Options

PCI Express Revision
5.0
Riser Slot 1: Total # of Lanes
16
Riser Slot 2: Total # of Lanes
24
Riser Slot 3: Total # of Lanes
16

I/O Specifications

Open Compute Port (OCP) Support
1 x 3.0
# of USB Ports
5
Total # of SATA Ports
10
USB Configuration
• One USB 3.0 port at back panel
• Two USB 2.0 ports at back panel
• One USB 3.0 port front panel
• One USB 2.0 port front panel
Max # of UPI Links
3
RAID Configuration
0/1/5/10
# of Serial Ports
1

Package Specifications

Max CPU Configuration
2

Advanced Technologies

Advanced System Management key
Yes
Intel® Optane™ Memory Supported
Yes
Intel® Remote Management Module Support
Yes
Integrated BMC with IPMI
IPMI 2.0 & Redfish
Intel® Node Manager
Yes
Intel® Advanced Management Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
TPM Version
2.0

Security & Reliability

Intel® Total Memory Encryption
Yes
Intel® Trusted Execution Technology
Yes