Intel® Server System D50TNP1MHCRAC Compute Module
Intel® Server System D50TNP1MHCRAC Compute Module
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Essentials
(1) 1U half-width module tray – iPN K53210
(1) 1U compute module air duct – iPN K61940
(2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER
(2) 1U riser bracket to support TNP1UCRRISER – iPN K25206
(1) 1U Air-Cooled front Heat Sink TNP1UHSF
(1) 1U Air-Cooled Rear Heat Sink TNP1UHSB
(2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family iPN J98484
(2) M.2 heat sink assembly TNPM2HS
Supplemental Information
Memory Specifications
-3DS-RDIMM
-Load Reduced DDR4 (LRDIMM)
-3DS-LRDIMM
GPU Specifications
Expansion Options
I/O Specifications
•Two USB 3.0 ports (dual-stack)
Package Specifications
Advanced Technologies
Security & Reliability
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.