Intel® FPGA PAC D5005

Intel® FPGA PAC D5005

Essentials

Product Collection
Intel® Programmable Acceleration Cards (PAC)
Marketing Status
Discontinued
Launch Date
Q4'19
FPGA
Intel® Stratix® 10 GX FPGA
Logic Elements (LE)
2800000
On-chip Memory
244 Mb
DSP Blocks
11520

Memory Specifications

External Onboard DDR4
32 GB (8GB x 4 banks)

I/O Specifications

PCI Express Revision
3
PCI Express Configurations ‡
Gen3 x16
QSFP Interface
x2
USB Configuration
USB 2.0
Network Interface
10 Gbps, 25 Gbps, 40 Gbps, 100 Gbps

Supplemental Information

Board Form Factor
¾ length, full height, dual slot
Thermal Solution Specification
Passively Cooled
TDP
215 W

Package Specifications

Tools Supported
Intel® Acceleration Stack for Intel® Xeon® CPU with FPGAs, Intel® Quartus® Prime Software, Open Programmable Acceleration Engine (OPAE)
Datasheet
View now
Description
Intel FPGA PAC D5005, previously known as Intel PAC with Intel Stratix® 10 SX FPGA, offers inline high-speed interfaces up to 100 Gbps.

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

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