Intel® FPGA PAC N3000

Intel® FPGA PAC N3000

Essentials

Product Collection
Intel® Programmable Acceleration Cards (PAC)
Marketing Status
Discontinued
Launch Date
Q4'19
FPGA
Intel® Arria® 10 GT FPGA
Logic Elements (LE)
1150000
On-chip Memory
65.7 Mb
DSP Blocks
3036

Memory Specifications

External Onboard DDR4
9 GB
External Onboard SRAM
144 Mb QDR IV

I/O Specifications

PCI Express Revision
3
PCI Express Configurations ‡
Gen3 x16
QSFP Interface
x2
Network Interface
10 Gbps, 25 Gbps (up to 100 GbE) with  Dual Intel Ethernet Converged Network Adapter XL710

Supplemental Information

Board Form Factor
½ length, full height, single slot
Thermal Solution Specification
Passively Cooled
TDP
100 W

Package Specifications

Tools Supported
Intel® Acceleration Stack for Intel® Xeon® CPU with FPGAs, Intel® Quartus® Prime Software, Open Programmable Acceleration Engine (OPAE), Data Plane Developer Kit (DPDK)
Datasheet
View now
Description
Intel FPGA PAC N3000 accelerates network traffic for up to 100 Gbps to support low-latency, high-bandwidth 5G applications.

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

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