Product Collection
Intel® 300 Series Mobile Chipsets
Vertical Segment
Mobile
Marketing Status
Discontinued
Launch Date
Q2'18
TDP
2.4 W
Use Conditions
PC/Client/Tablet

Supplemental Information

Embedded Options Available
No

Memory Specifications

# of DIMMs per channel
2
ECC Memory Supported
No
Supports Memory Overclocking
Yes

GPU Specifications

# of Displays Supported
3

Expansion Options

Direct Media Interface (DMI) Revision
3.0
Max # of DMI Lanes
4
PCI Express Revision
3.0
PCI Express Configurations
x1, x2, x4
Max # of PCI Express Lanes
8

I/O Specifications

# of USB Ports
6
USB Revision
3.1, 2.0
Max # of SATA 6.0 Gb/s Ports
4
RAID Configuration
PCIe 0,1,5 / SATA 0,1,5,10
Integrated LAN
Integrated MAC
Integrated Wireless
Intel® Wireless-AC MAC
Supported Processor PCI Express Port Configurations
1x16 or 2x8 or 1x8+2x4

Package Specifications

Package Size
10mm x 14mm

Advanced Technologies

Intel® Optane™ Memory Supported
No
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® ME Firmware Version
12
Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
No
Intel® Standard Manageability
No
Intel® Stable IT Platform Program (SIPP)
No
Intel® Smart Sound Technology
Yes
Intel® Platform Trust Technology (Intel® PTT)
No

Security & Reliability

Intel® Trusted Execution Technology
Yes
Intel® Boot Guard
No