Agilex™ 5 FPGA and SoC FPGA E-Series
Manufactured using Intel 7 technology and delivers better performance-per-watt, low power, and smaller form factors for midrange FPGA applications.
Agilex™ 5 FPGA and SoC FPGA E-Series
Optimized for Power and Size
Up to
1.6X
better performance-per-watt vs. 16 nm node competitors.1
Up to
50%
lower total power consumption vs. Cyclone® V FPGAs.
Up to
2.5X
fabric performance compared to Cyclone® V FPGAs.
Up to
1.6X
better performance-per-watt vs. 16 nm node competitors.1
Up to
50%
lower total power consumption vs. Cyclone® V FPGAs.
Up to
2.5X
fabric performance compared to Cyclone® V FPGAs.
Benefits
Power-Efficient Performance
Built on Intel 7 technology, E-Series FPGAs deliver superior power-efficient performance at 1.6x better performance-per-watt1 compared to the competing 16 nm FPGAs and have the first asymmetric Arm application processor cluster to deliver better HPS energy efficiency.
Unmatched Reliability
Implement reliable and secure systems with functional safety (FuSa) and an integrated security device manager offering advanced security features and leveraging Intel advanced manufacturing capabilities for supply resiliency and best-in-class lead times with predictable and reliable delivery.
Innovative, Scalable, and Adaptable
Meet your diverse application needs with a broad set of IP and connectivity options with a wide density range (50KLE-656KLE) to scale device size and support the variety of I/O standards in edge and embedded sensors configurable in a single FPGA device.
Use Cases and Applications
Applications Spotlight Using Agilex™ 5 FPGAs Across Various Markets
Learn how FPGAs address design challenges in embedded and networking applications showcasing mid-range FPGAs that offer world-class features and capabilities.
Accelerating Embedded Software Development with the Intel® Simics® Simulator for FPGAs
Read how the Intel Simics Virtual Platform allows developers to start software development, debug, and verify up to a year before the physical hardware is available.
Implementing Next-Generation Data Center Platform Management Using Agilex™ 3 and 5 FPGAs and SoC FPGAs
With small form factors and high I/O counts, cost-optimized, low power, highly flexible Agilex™ 3 and 5 FPGAs and SoC FPGAs provide the capabilities and features required by next-generation platform management solutions.
Key Features
Second Generation Intel® Hyperflex™ FPGA Architecture
Advantages include higher throughput, improved power efficiency, greater design functionality, and increased designer productivity.
Enhanced DSP with AI Tensor Block
Offers up to 56 peak INT8 TOPS with FPGA AI Suite support to enable push-button flow from industry standard frameworks to FPGA bitstream.
Advanced Security
Built with robust security features, the Secure Device Manager (SDM) and firmware ensure the confidentiality and integrity of the device.
Product and Performance Information
Performance varies by use, configuration and other factors. Learn more at www.intel.com/PerformanceIndex. Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See backup for configuration details. No product or component can be absolutely secure. Your costs and results may vary.