Fodenn (Shanghai Changfu Electronics Technology Ltd.,), a high-tech enterprise, is focused on industrial board card product, MINI ITX .NANO-ITX. 3.5 inches. and professional R&D, manufacture and retail for related products; The products mainly applied to finance industry, communication industry and POS industry.
Offerings
Offering
Q477 Embedded ATX Motherboard ,Support Intel® Gen 10&11the Core™ i9/i7/i5/i3/Pentium®/Celeron® Series CPU, Intel®Q470 chipset, 4 x288 Pin DDR 4 memory slot, support 2133/2666MHz,Un-buffered Non-ECC, each max support 32GB ,MAX support 128GB. 2xRJ45 Intel® I225 2.5Geb Lan Port ,Display: VGA+DP+HDMI ,6xSATA Port+1x M Key M.2, 1xPCIE X16+1xPCIE X8+3xPCIEX4+2xPCI+1xCAN6 xCOM port(COM1/2 support RS422/RS485) 6xUSB3.1+6xUSB2.0
Offering
IPC H610 industrial mainboard motherboard: Features 1.Intel® Core™ 12-14th Gen Alder Lake S series CPU, H610 chipset. 2.Onboard PCIE X16 expansion port. 3.Support DDR4 notebook memory. 4.VGA, HDMI synchronous/asynchronous display .5.Support 10xCOM port(COM2 Support RS422/RS485). Support 14xUSB port .6.Onboard 1xMSATA port ,Onboard 1x M Key M.2
Offering
Support Intel Gen 12th,13th Gen i3 & i5 & i7 ，2 x SO-DIMM DDR5 High-speed I/O via 2.5Gbe LAN RJ45(Intel I225/Intel 226) and 2 x USB 3.2 Gen2 and 2 x USB3.0 Supports HDMI Display Interface，1 xM Key M.2 2280 PCIe x4 Gen 4 SSD，1 x 2.5 SATA III Connector，1x m.2 2230 PCIe port( support Intel AX201/AX200/AX210)，2 x USB 3.2 Gen 2 Type A(10gbps)2 x USB3.0 type-A1 x Thunderbolt 4 Type-C( support display/USB/PD)，1 x COM Port RS2322 x USB 2.0 header( can extended to 4 x USB2.0 port)1 x 2.5" SATA III SSD/HDD connector1 x Front Panel( power , HDD/SSD + power on LED)
Offering
The IPC-HC1315 is a 15.6-inch industrial panel that features an embedded Intel® i5-1145G7E CPU and 2 Intel® I226/I225 LAN ports for networking communication. These LAN ports enable customers to implement 3D defect detection functionality for cameras during the production process. By utilizing these 2 LAN ports, data processing efficiency is significantly improved compared to the previous single-port setup. The powerful computing and data processing capabilities of the Intel® Tiger Lake UP3 CPU enhance the speed of image processing and data optimization. The robust communication capability of the Intel® i225 network card greatly enhances real-time data processing capabilities. The IPC-HC1315 also comes with built-in M.2 NVME hard disk functionality, which significantly boosts machine vision storage performance. Currently, we have successfully introduced this solution into 3D defect detection manufacturing processes in Europe. Leveraging the low-power characteristics of the Intel® Tiger Lake UP3, this solution helps customers reduce energy consumption during the production process. In summary, this comprehensive solution meets customer needs in terms of energy efficiency, multi-port configuration, and high performance. It assists customers in achieving their goals of cost reduction, efficiency improvement, and environmentally friendly energy savings.