ADLINK Technology is a global leader in edge computing. Our mission is to affect positive change in society and industry by connecting people, places and things with AI. We do this through the delivery of leading edge, robust solutions addressing our customer’s critical business and technology challenges. Our offerings include robust boards, modules and systems; real-time data acquisition solutions; and application enablement for Artificial Intelligence + Internet of Things (AIoT). ADLINK serves customers in many vertical markets including: manufacturing, networking and communications, healthcare, military and aerospace, infotainment, retail, energy and transportation. We’re a Premier Member of the Intel® Internet of Things Solutions Alliance and a contributor to many standards and interoperability initiatives, including Eclipse, OCP, OMG, PICMG, SGeT and ROS 2 TSC. ADLINK’s products are available in over 40 countries, either directly or through our worldwide network of value-adding distributors and systems integrators. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on TAIEX (Stock Code: 6166).
Offerings
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Integrating Intel’s latest line of powerful, discrete graphics — Intel® Arc™ — ADLINK introduces its MXM-AXe, one of the industry’s first MXM (R3.1) Type A discrete GPU modules. Packing hardware ray tracing, AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in commercial gaming, healthcare, media processing, and transportation. ADLINK MXM-AXe provides up to 8 hardware ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at maximum 35W TGP and the industry’s first full AV1 hardware encoding. Boosting graphics rendering significantly, the module is your key to suiting next-gen graphics workloads. The MXM-AXe leverages Intel® well-established graphics ecosystems, such as OpenVINO™ for AI and Intel® OneAPI management tools, that edge developers have enjoyed and relied on for years. More than a new line of GPUs, but one that makes your migration from integrated to discrete graphics seamless as ever. Supporting Intel® Deep Link technology, MXM AXe can be paired with 12th and 13th Gen Intel® Core™ processors for even elevated performance and power efficiency by automated workload allocation between integrated GPU, discrete GPU, and CPU.
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Introducing the EGX-PCIE-A380E, a PCIe Gen4x8 graphics card boasting a low-profile design and powered by an Intel Arc A380E GPU. With a focus on superior performance, reliability, and energy efficiency, this compact card is a mere 69mm x 171mm in size and features a single-slot configuration. Equipped with 8 ray-tracing units, 128 XMX engines and a 50W TGP, the ADLINK EGX-PCIE-A380E targets the commercial gaming sector, catering to applications like slot machines, video lottery terminals, and electronic games. Seamless integration into ADLINK gaming platforms such as the ADi-SA6X, which harnesses Intel Core processors for optimal performance, ensures versatility across various gaming setups. Beyond gaming, the A380E graphics card finds utility in industrial Edge AI applications like Industrial IoT and retail scenarios such as video walls and media processing. Its compatibility with the OpenVINO™ open-source toolkit facilitates streamlined AI development and integration of deep learning, particularly in computer vision applications. Supporting a range of industry standards including DirectX 12, Vulkan 1.3, OpenGL 4.6, and OpenCL 3.0, as well as operating systems like Windows 11 and Linux, the EGX-PCIE-A380E offers a versatile solution for diverse computing environments.
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The ADLINK I-Pi SMARC EL is a SMARC module-based development kit based on Intel Atom® x6425E processor (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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The ADLINK I-Pi COM Express Type 10 EL is a COM Express Type 10 module-based development kit based on Intel Atom® x6211E processor (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. ADLINK’s nanoX-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express Type 10 Mini size Computer-on-Module. ADLINK nanoX-EL supports 6th generation Intel Atom® x6000 processors combined with Intel® UHD graphics at low power envelope and high speed interfaces. nanoX-EL modules support In-Band ECC dual channel DDR4 memory up to 16GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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ADLINK Express-TL COM Express Type 6 module with Intel® Core™, Xeon® W and Celeron® 6000 processors and octa-core (8-core) performance. Intel® UHD Graphics and Intel® AVX-512 VNNI provide superior artificial intelligence (AI) inferencing performance. The Express-TL is well-suited for image processing and analysis, high speed video encoding and streaming, medical ultrasound, predictive traffic analysis and other demanding applications. Additional 8C at 25 Watt TDP with ECC memory feature and on-board NVMe storage make it suitable for space constrained applications. AI, machine learning and internet of things (IoT) devices increase demand for real-time processing—from the edge to the cloud. The Express-TL module offers advanced tuning controls, immersive graphics, and unmatched connectivity, which allows new possibilities for AI, workload consolidation, and other intensive computing demands. The integrated Intel® UHD Graphics core can be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP).
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ADLINK’s Express-ID7 COM Express Type 7 basic size module is based on the Intel® Xeon® D processor, and is supporting up to 10-cores CPU and 128GB DDR4 2933 MT/s memory for high performance edge computing and Intel® Xeon® processor-class reliability, availability, and serviceability (RAS). The modules provide support for 16 lanes PCIe 4.0 and 16 lanes PCIe 3.0, 4x 10GBASE-KR Ethernet with industrial-class reliability and extended temperature ratings for embedded and rugged applications.The Express-ID7 features Intel® Deep Learning Boost (VNNI) and Intel® AVX-512 instructions, support for hard-real-time workloads, and up to 10 CPU cores make these modules ideal for workload consolidation, running multiple virtual machines, or creating more-robust systems for critical applications in high-bandwidth storage/analytics, manufacturing, and aerospace.
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Featuring Intel® latest Intel® Core™ Ultra processors, ADLINK cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel® modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.By harnessing a proficient GPU, hardware-accelerated AV1 encoding/decoding, and an NPU for dedicated AI acceleration along with all PCIe signals upgraded to Gen4 and USB4 support for added flexibility, the cExpress-MTL effectively simplifies your solution designs that would otherwise require additional, external processing units.The cExpress-MTL module is ideal for various battery-powered, performance-demanding edge applications, including but not limited to portable medical ultrasound devices, industrial automation, autonomous driving, and AI robots.
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Vizi-AI combines plug and play hardware and software to enable a faster, easier, and more scalable starting point for machine vision AI deployments at the edge. Initial deployments can be scaled for industrial requirements using the same software but deployed on more powerful hardware, as needed.
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ADLINK cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom®, Pentium® and Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution. Integrated IntelR Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0; and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Up to three independent displays are available. The module has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. Featured IO include a single GbE port, USB 3.0 and USB 2.0 ports, SATA 6 Gb/s ports, and up to 5 PCIe x1 lanes. In addition, SD signals are muxed with GPIO. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer. An optional eMMC 5.0 (8/16/32 GB) is supported.
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Integrating Intel’s latest line of powerful, discrete graphics — Intel® Arc™ — ADLINK introduces its MXM-AXe, one of the industry’s first MXM (R3.1) Type A discrete GPU modules. Packing hardware ray tracing, AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in sectors such as commercial / casino gaming, healthcare, media processing, and transportation.ADLINK MXM-AXe provides up to 8 hardware ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at max. 50W TGP and the industry’s first full AV1 hardware encoding. Boosting graphics rendering significantly, the module is your key to suiting next-gen graphics workloads. The MXM-AXe leverages Intel® well-established graphics ecosystems, such as OpenVINO™ for AI and Intel® OneAPI management tools, that edge developers have enjoyed and relied on for years. More than a new line of GPUs, but one that makes your migration from integrated to discrete graphics seamless as ever.Supporting Intel® Deep Link technology, MXM AXe can be paired with 12th and 13th Gen Intel® Core™ processors for even elevated performance and power efficiency by automated workload allocation between integrated GPU, discrete GPU, and CPU.
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Intel® Xeon® W-11865MRE processor; up to 8 cores with 45 watt TDPSOSA-aligned and VITA 46/48/65 compliant for quick deploymentDDR4-2666 soldered ECC SDRAM, up to 64GBUp to 1TB M.2 SSD optionalOne XMC expansion slot with PCIe x8 Gen3Ethernet connectivity: 1x 2.5GBASE-T to P2; 2x 10GBASE-KR to P1; optional 2x 1GBASE-KX to P11x DisplayPort to P2, supports DP++ with resolution up to 8K/60HzSupports VxWorks 7, Linux (kernel 5.4 and higher)
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ADLINK’s COM-HPC-cRLS COM-HPC Client Type C size module is based on the 13th Gen Intel® Core™ processor with up to 24 cores and 32 threads and PCIe Gen5 connectivity that can boost productivity and fuel IoT innovation across a wide variety of deployments. The modules provide support for PCIe 5.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities. The integrated Intel® Iris® Xe graphics architecture, with up to 96EUs, offers four concurrent 4K60 HDR displays and an Intel® Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.
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ADLINK cExpress-TL is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth compared to prior generations COM Express modules. Two other important improvements are: support for 2.5 GbE Ethernet, and support for four USB 3.2 Gen 2 ports with transfer rates of up to 10Gb/s. Both high speed interfaces are highly suited to serve as camera input ports in AI related applications. 11th Gen Intel® Core™ processors have a configurable power range of 15 to 28 watts, which makes them ideally suited for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. The integrated Intel® Iris® Xe Graphics core provides 96 EUs and can be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP).
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PICMG® CPCI-S.0 CompactPCI® Serial Processor Blade14nm multi-core 9th Gen Intel® processor, graphics engine integrated in processor supporting independent displays with DirectX 12, OpenGL 4.5Max. 32GB DDR4-2666 by 2x SODIMM, supports 2x PCIe x8 Gen 3 and 2x PCIe x4 Gen 3Up to 10x USB 2.0/3.0, up to 7x SATA to rear, supports satellite mode operation as a standalone blade in peripheral slots.
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MLC-M is a slim and light medical panel PC ideal for hospital information management at nursing stations or on medical carts. The MLC-M supports an 11th gen Intel® Core™ processor, providing the processing power needed to run high performance image processing software as well as hospital applications such as HIS, RIS, PDMS, and documentation software. The MLC-M has an IP54 rating courtesy of its screwless and fanless design, making cleaning easier, and protecting clinicians, nurses, and patients from possible infection. For superior user experience, the MLC-M has a highly flexible IO function module that can be customized for dedicated applications, four control keys for straightforward operation, a touch panel, and a selection of optional accessories.
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ADM-AL30 is dedicated to Autonomous Driving Applications. Powered by Intel® Core™ i7 and Intel® Core™ i9 processor, this AI computing platform can process huge amounts of data and make crucial decisions for autonomous vehicles.
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ADLINK cExpress-ALN is a COM Express® COM.0 R3.1 Type 6 Compact size featuring 64-bit real-time-capable (with Intel TCC and TSN support) Intel® 7th Gen. Atom® x7000E, Core™ i3 and N Series Processors. The cExpress-ALN is specifically designed for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support.
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ADLINK cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size featuring 64-bit real-time-capable (with Intel TCC and TSN support) Intel® 7th Gen. Atom® x7000RE and x7000C Series Processors. The cExpress-ALN is specifically designed for customers who need entry-level mission critical computing with real-time prowess, a balanced cost structure, extended temperature and extended product life support.
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The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option).
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The ADLINK LEC-ASL is a SMARC module that supports up to 8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) industrial series and x7000RC (x7203C, x7405C, x7809C) communication series processors, with integrated Intel® UHD graphics (Intel Atom®x7000RE series only) and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing and networking applications that require safety and reliability at all times.
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ADLINK’s new series of MLC 8 medical computers with 8th generation Intel® Core™ processors delivers high computing performance and outstanding graphics processing capabilities. The MLC 8 series are designed with optimum viewing capabilities and hygienic, fully-sealed and easy-to-clean housings. They can be used for patient’s vital sign monitoring, nursing care, clinical diagnosis, PACS (Picture Archiving and Communication System), anesthesia monitoring and operating room documentation. With additional safety design and expansion capabilities, our medical panel computers and monitors provide a reliable and flexible system with high usability and convenience for doctors and hospital staff.
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Intel® Core™ i7-7820EQ Processor and Mobile Intel® CM236 ChipsetNVIDIA Quadro® GPU MXM 3.1 Type A/B module on PCIe x164x M12 GbE with PoE, 4x USB 3.0Rich Storage Options: 2.5" SATA 6.0 Gb/s drive bay, 1x M.2 2280 slot, 1x CFast socketGNSS/3G/4G/WLAN support via 2x Mini PCIe slots and 2x USIM slotsMVB/CAN bus support by Mini PCIe add-on module (BOM option)Nominal Voltage: 110VDC (EN50155 compliant)
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14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GBVersatile storage: SSD, CFast, M.2Dual PMC/XMC sitesRemote management and TPM support
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Low power quad-core Intel Atom® x6413E Processor (formerly Elkhart Lake). Up to 32GB DDR4-2400-3200MT/s ECC soldered memory. Optional onboard SSD support. Flexibility in IO selection. Extended temperature -40 to 85 degree C supported.
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Intel® Xeon® W-11555MRE 6-Core processor. Max. 64GB DDR4-3200 by 2x SODIMMs. 80GB 3D Nand flash SSD in SLC mode. USB 3.2, USB-C and RJ-45 iAMT front panel service ports. 2x M12 2.5GbE front panel ports for on train use. Up to 4x 1GbE, 10x USB and 5x SATA (RAID) to rear.
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Quad-core Intel® Atom® x6413E processor (formerly Elkhart Lake). Up to 32GB DDR4-3200 with IBECC via SO-DIMM. Up to three RJ-45 and one M12 2.5G Gigabit Ethernet ports on the front. Multiple storage options: M.2 2280 SATA slot, onboard SATA SSD min. 40GB, 2.5” SATA space (optional). One XMC site with PCIe x4.
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Dual nodes, redundancy architecture. Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H) per node. M.2 2242 slot per node (upgradeable to 1TB by option). VITA 46/48/65 compliant for quick deployment. Supports Windows 10 IoT Enterprise LTSC 21H2 and Linux (kernel 5.13 and higher).
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on the 13th Gen Intel® Core™ mobile processor with up to 14 cores and 20 threads with performance hybrid architecture with Intel® Thread Director and up to 24 MB Intel® Smart Cache, that can boost productivity and fuel IoT innovation across a wide variety of deployments. The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities. The integrated Intel® Iris® Xe graphics architecture, with up to 96EUs, offers four concurrent 4K60 HDR displays and an Intel® Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support display alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.
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The Express-CFR is a COM Express® COM.0 R3.0 Basic Size Type 6 module supporting Hexacore 9th Generation Intel® Core™ and Xeon® and Celeron® processors (codename "Coffee Lake Refresh") with Intel® QM370, HM370, CM246 Chipset.Express-CFR supports Hexacore at 45W and Hexacore at 25W for more flexibility in system integration. DDR4 dual-channel memory up 2400 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance.
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Low power quad-core Intel® Atom® x7-E3950 Processor (formerly Apollo Lake I)Up to 8GB DDR3L-1600 ECC soldered memoryOnboard 32GB SSD support by optionSmart Embedded Management Agent (SEMA) for system health monitoringOptional additional GbE ports with MIL-STD M12 connectorsEN 50155 compliant for railway safety-critical applicationsThe ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel® Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.Available in single-slot (4HP) or dual-slot (8HP) width form factors, the cPCI-3630 Series utilizes various daughter boards to provide a broad range of I/O functionality. Faceplate I/O on the single-slot (4HP) version includes 1x USB 3.0, 2x RJ-45 GbE and 1x VGA port (common to all versions). Additional faceplate I/O on the dual-slot (8HP) versions include 2x USB 2.0, 1x COM, 1x PS/2 KB/MS and Line-in/Line-out on the cPCI-3630D; 2x DisplayPorts, 1x COM via RJ-45 connector, 1x KB/MS and USB 2.0 port on the cPCI-3630G; 2x GbE via MIL-STD M12 connectors and 1x COM on the cPCI-3630T; and 2x GbE in RJ-45 connectors and 1x COM on the cPCI-3630TR. Another dual-slot option is the cPCI-3630S with an additional XMC site on layer 2. There is also a cPCI-3630N single-slot option that provides LED indicators only with no I/O on the faceplate.The Intel® Atom® SoC integrates the low-power 9th generation graphics engine and provide excellent graphics, media and display support. By using cPCI-3630G, it supports up to 4K HD resolution. Storage options include an onboard 32GB SSD (optional), mSATA socket or CFast and 2.5" SATA drive space on the layer 2 riser card (cPCI-3630D/G/T/TR). One optional PCI 32-bit/66 MHz PCIe x1 XMC site is available on the dual-slot cPCI-3630S version.Rear I/O signals to J2 include 2x GbE, 1x VGA, 1x USB 2.0, 2x COM, 1x SATA 3 Gb/s, providing for expansion with an optional Rear Transition Module (RTM).The cPCI-3630 is an ideal solution for transportation, military, factory automation and other industrial applications that require optimal computing performance for data transfer with lower power consumption. The ADLINK cPCI-3630 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.
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Key Features6th gen. Intel® Core™ Processor (formerly codenamed Skylake)Up to 8GB DDR4-ECC soldered memory3x DDI channels, 1x micro HDMI, 1x mini DP and 1x 18/24 bit single channel LVDS4x PCIe x1 and 1x PCIe x 16 (PEG) configurable as 1x PCIe x16 or 2x PCIe x8 or 1x PCIe x8 + 2x PCIe x42x GbE LAN, 2x SATA 6Gb/s, 1x USB 3.1, 6x USB 2.0, 2x COM, 8x GPIOSupports Smart Embedded Management Agent (SEMA®) functionsExtreme Rugged operating temperature -40°C to +85°C variantThe CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset.The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel® processor supports Intel® Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.Integrated Intel® Generation 9 Graphics includes features such as OpenGL 5.x, OpenCL 2.x, DirectX 2015, DirectX 12, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full HEVC/VP8/VP9/AVC/MPEG2 hardware codec. Graphics outputs include single-channel 18/24-bit LVDS (eDP x4 lanes optional) and three DDI ports supporting HDMI/DVI/DisplayPort.The CMx-SLx is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The CMx-SLx features one mini DisplayPort (DDI1), one micro HDMI port (DDI2), and one single channel 18/24-bit LVDS port (eDP), two Gigabit Ethernet ports, four USB 2.0 ports, two COM ports, eight GPIOs (from BMC), two SATA 6Gb/s ports, and one onboard SATA SSD supporting SLC (up to 32GB) and MLC (up to 64GB). The module is equipped with an SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as fail safe BIOS, remote console, CMOS backup, hardware monitor, and watchdog timer. The CMx-SLx is capable of working in the temperature ranges of 0C-60C (standard) and -40C-85C (extended).
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ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor, and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management that can boost productivity and fuel IoT innovation across a wide variety of deployments. The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities. The integrated Intel® Iris® Xe graphics architecture, with up to 96EUs, offers four concurrent 4K60 HDR displays and an Intel® Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.
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ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D processor, and is the first COM-HPC Server Type module to support advanced architecture with up to 20-cores and 256GB DDR4 2933 MT/s memory for high performance edge computing and Intel® Xeon® processor-class reliability, availability, and serviceability (RAS). The modules provide support for 32 lanes PCIe 4.0 and 16 lanes PCIe 3.0, max. 8x ETH_KR (PHY on carrier required, except KR backplane) with 10G/25G per port, IPMB remote management with industrial-class reliability and extended temperature ratings for embedded and rugged applications. The COM-HPC-sIDH features Intel® Deep Learning Boost (VNNI) and Intel® AVX-512 instructions, support for hard-real-time workloads, and up to 20 CPU cores make these modules ideal for workload consolidation, running multiple virtual machines, or creating more-robust systems for critical applications in high-bandwidth video storage/analytics, manufacturing, and aerospace.
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ADLINK cExpress-EL supports 6th generation Intel Atom® x6000 processors combined with Intel® UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Intel® Atom® x5-E3930 processor, up to 1.8GHz10.4” color display: 4:3, 1024 x 768 pixels, high brightness 1000cd/m2, 5-wire resistive touch, auto dimming2GB DDR3L memory (up to 8GB optional)64GB eMMC storagePower Input Voltage: 24VDC, 36VDC, 72VDC and 110VDC (EN50155 compliant)-25°C to +70°C wide operating temperature range (EN50155 class OT3)IP65 front and IP20 rear ingress ratings
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• Quad-core Intel® Xeon®/Core™ i7/i5/i3 processor (formerly Coffee Lake) • Up to 32GB DDR4-2133/2600 memory via two SO-DIMMs • Support 6 USB 3.0 port • Support 1 independent display • Support 3 independent GbE ports • Support 2 RS-232/422/485
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The DMI-1210 is a 12.1” Driver Machine Interface panel PC designed specifically for the railway industry, equipped with Intel Atom® x5-E3930 processor (formerly Apollo Lake), resistive touch, and MVB interface. It can be applied as an HMI unit for driver’s desks, control panel for passenger information systems, surveillance system control/display unit or in railway diagnostics and communications applications.The DMI-1210 is an EN 50155 certified, cost-effective COTS driver interface that offers train radio display, electronic timetable, and diagnostic display functions and additional functionality such as train data recorder. The DMI-1210 accepts full range DC power input from +16.8V to 137.5VDC. Optional GNSS, 3G/LTE, WLAN, and Bluetooth give system integrators the necessary tools to expand use case possibilities. With ADLINK’s built-in SEMA management (BMC inside), the DMI-1210 provides easy and effective health monitoring and system maintenance. Robustness and reliability are provided by careful component selection for extended temperature operation, isolated IOs, conformal coated circuit boards, and securable I/O connectors.
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The ADLINK cPCI-3520 Series is a 3U CompactPCI processor blade with dual channel DDR4-2133/2400 memory up to 32GB. The ADLINK cPCI-3520 features a 8th./9th generation Intel® Core™ i7 processor with Mobile Intel® CM246 Chipset. The ADLINK cPCI-3520 Series is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3520 Series provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring.
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6th/7th Gen Intel® Core™ i7 Processors8x M12 GbE (4x PoE), 4x RS-422, 4x USB 3.0, 1x DVI-I, 4x DisplayPort with lockable connectorsMultiple storage options: 2x 2.5" SATA 6.0 Gb/s drive bays, 1x M.2 2280 slot, 1x CFast socketGNSS/3G/4G/WLAN support via 2x Mini PCIe slots and 2x USIM slotsMVB/CAN bus support through Mini PCIe add-on moduleWide range DC input: 24VDC, 36VDC, 72VDC and 110VDCEN50155-compliant, rugged, fanless design for harsh operating environments
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The VPX3020 Series is available in rugged conduction and air cooled versions with conformal coating, making it ideal for mission critical applications in radar; intelligence, surveillance and reconnaissance (ISR); and UAV/UGV platforms.
Offering
To accelerate the development of smart devices, ADLINK’s Smart Panel is an all-in-one Open Frame Panel PC offering flexible configuration with a high level of modularization. Coupled with ADLINK’s unique Function Module (FM) design, Smart Panel speeds prototyping based on application requirements with reduced time, effort and cost. System integrators, integrated solution providers, and brand vendors can all achieve project success in transportation, retail, hospitality, industrial automation, healthcare, and gaming applications, and more. To accelerate TTM, lower TCO, and enhance design flexibility, ADLINK’s Smart Panel exceeds common application demands with a modular design, enabling custom selection of touch panel type, display size, mainboard, I/O interface, and heat sink. To empower application-specific features, function enhancement and I/O expansion are fully supported through ADLINK’s FM board or I/O boards from partners and clients. Values of ADLINK’s Smart Panel cross industries show as below: l Healthcare: Much time can be saved with a panel computer integrated in medical imaging equipment. With ADLINK’s Smart Panel, medical equipment manufacturers can quickly build different diagnostic imaging requirements, e.g. CT, X-Ray, and MRI, through ADLINK’s unique Function Module board, and greatly improve the efficiency of medical imaging technicians, the throughput of diagnostic imaging equipment, and patient experience. Transportation: With the advent of new technologies, airports are embracing a combination of contactless and self services, paving the way for a true reduction in manual assistance requirements and faster clearance of passengers. To build a streamlined self bag-drop service, ADLINK’s Smart Panel provides a clean solution for a straightforward installation with low validation effort with comprehensive I/O options on the mainboard to accommodate various device connectivity for integrated control. l Retail: With the steady rise of e-commerce, retailers are faced with an unprecedented growth in orders, which must be fulfilled as fast as possible. To fulfil different kiosk functionalities, ADLINK's Smart Panel provides a high level of modularization, allowing kiosk manufacturers to quickly build interactive kiosks, making streamlined service processes, personalized customer engagement, reliable real-time updates, and remote monitoring possible