congatec AG offers a product portfolio that is comprised of embedded computer modules based on the most common form factors such as Qseven, COM Express and ETX/XTX. congatec also provides professional board support packages, extensive design-in support and specialized embedded BIOS features for industrial use.
Offerings
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Industrial grade SMARC module based on Intel Atom® x7000 Series with up to 8 cores, max. 32 GByte soldered LPDDR5 and Virtualization ready with RTS Hypervisor
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COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake").
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COM Express Type 6 Compact module based on 13th Gen Intel® Core™ embedded mobile processors (code name "Raptor Lake") with soldered down memory.
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COM-HPC Server Size D high module based on Intel® Ice Lake-D Xeon® processors Industrial Use Condition with extended Temperature options32 PCIe Express lanes AI Capabilities with Intel® DL boost Real Time Capable Platform Supporting up to 256 GB DDR4 2933MT/s Memory
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COM-HPC Client Size A high performance module based on 13th Gen Intel® Core™ processor series (code name "Raptor Lake")
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COM-HPC Client Size C high performance module based on 13th Gen Intel® Core™ processor series (code name "Raptor Lake-S")
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COM Express Type 7 Basic module based on Intel® Ice Lake-D Xeon® Processors ,industrial use condition with extended temperature options 32 PCIe express lanes AI capabilities with Intel® DL boost Real Time Capable Platform.Supporting up to 128 GB DDR4 2666MT/s memory.
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COM-HPC Mini Size high performance module based on 13th Gen Intel® Core™ processor series (code name "Raptor Lake-P")
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COM express type 6 compact module based on 11th Gen Intel® Core™ processor family and soldered down memory
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COM Express Type 6 Compact module based on 12th Gen Intel® Core™ processor family Intel® hybrid design combines Performance-cores with Efficient–cores Up to Intel® Iris® XeGraphics® architecture with up to 96 EUsPCI Express Gen 4 | USB 3.2AI Acceleration with Intel® Deep Learning Boost (VNNI)Embedded Use Condition SKUs.
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COM Express Type 6 Compact module based on 13th Gen Intel® Core™ embedded mobile processors (code name "Raptor Lake")
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COM-HPC Client Size C module based on 12th Gen Intel® Core™ Embedded Desktop Processors Intel® hybrid design combines Performance-cores with Efficient–cores Intel® UHD Graphics 770 driven by Xe Architecture PCI Express Gen 4/5 | USB 3.2 Gen 2x2AI Acceleration based on Intel® Deep Learning Embedded Use Condition SKUs.
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COM-HPC Client Size A module based on 12th Gen Intel® Core™ Embedded mobile Processors Intel® hybrid design combines Performance-cores with Efficient–cores UP to Intel® Iris XeGraphics architecture with up to 96 EUsPCI Express Gen 4 | USB 4AI Acceleration with Intel® Deep Learning Boost (VNNI)Embedded Use Condition SKUs.
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The conga-LEKs (Lan Enabling Kits) are mezzanine cards that can be used together with the conga-HPC/Eval-Server evaluation carrier board. These add-on cards enable the user to seamlessly evaluate different ethernet configuration options. The LEKs offer up to 100Gb total throughput and support modern transceiver form factors such as SFP28 and QSFP28.
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COM HPC Client Size A module based on Intel® (formerly "Tiger Lake")-UP3 high performing and low power Intel® Core™ processor series Form factor COM HPC, Size A (95 x 120 mm), Client Connector Pinout DRAM Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/sECC and non-ECC supported Graphics Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | HDMI 2.0/2.1 | DP 1.4Display3x DP/HDMI/DP++ | 1x eDPEthernet2x 2,5 GbE TSN Ethernet via Intel® i225I/O Interfaces4x PCIe Gen4 | 8x PCIe Gen32x USB 4.0 | 2x USB 3.22x SATA III (6Gb/s) | SPI | 2x UART | 12x GPIO | 2x MIPI-CSIAudio1x I2S | 2x Sound wirecongatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board StatisticsI²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection Embedded BIOS Features OEM Customization | Flash Update | based on AMI Aptio UEFI SecurityTrusted Platform Module (TPM 2.0)Power Management ACPI 5.0 with battery supportSize95 x 120 mm
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Industrial Thin Mini-ITX based on 5th Generation Intel® Atom™, Intel® Celeron® and Pentium® ProcessorsIntel® 5th Gen. Atom™, Celeron® and Pentium® ProcessorsLow Power CPUs 6 to 12 Watt TDPEnhanced Intel® HD Graphics Generation 9Long life components for 24/7 embedded useExtended Temperature variants
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Highest Performance 3.5'' Single Board Computer based on 8th Generation Intel® Core™ processor series called "Whiskey Lake"Highest Performance 3.5'' Single Board Computer8th Generation Intel® Core™ Mobile Low Power U-Processors with up to 4 coresGen 9 Intel Graphics, up to 24 Execution UnitsMultiple Expansion card possibilitiesOption for 2nd internal video interface
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Highest Performance Thin-Mini-ITX board based on 8th Generation Intel® Core™ Mobile Processors "Whiskey Lake"Highest Performance Thin Mini-ITX board8th Generation Intel® Core™ MobileLow Power U-Processors with up to 4 coresGen 9 Intel Graphics, up to 24EUOptions for 2nd internal displayWide Range Power Input 12-24 Voltcongatec embedded Board Controller Features
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COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family8th Generation Intel® Core™ SOC processorup to 4 coresConfiguration of display mode by software (LVDS/eDP)Low power consumption (TDP 15W, cTDP 10W)Up to 64 GByte dual channel DDR4 2400 MT/sOptional eMMC 5.1 on board mass storageTrusted Platform Module (TPM 2.0)
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Ready for Intel® Optane™ memory technology FormfactorCOM Express CompactCPUIntel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)DRAM2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channelChipsetIntegrated PCH-LPEthernetIntel® i219-LM GbE LAN Controller with AMT 11.6 supportI/O Interfaces8 x PCI Express GEN 3.0 lanesIntel® Optane™ memory can be connected via PCI Express Gen 3.03 x Serial ATA® Gen 3 (can be configured as RAID)4 x USB 3.0 (XHCI)8 x USB 2.0 (XHCI)LPC bus (no DMA)I²C bus (fast mode, 400 kHz, multi-master) 2 x UARTSoundDigital High Definition Audio Interface with support for multiple audio codecsGraphicsIntel® Gen9 HD Graphics Engine OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encodingcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware8/16 MByte serial SPI firmware flashSecurityThe conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.Power ManagementACPI 4.0 with battery supportOperating SystemsMicrosoft® Windows 10 (64bit only)Fedora 24UbuntuSuSeRed Hat EnterpriseYocto Project v2.2Chromium 2Wind River VxWorksMicrosoft® Windows 10 IoT Enterprise (64bit only)Power ConsumptionSee User's Guide for full detailsTemperatureStandardOperating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces2x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPISize95 x 95 mm (3,74" x 3,74")
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Formfactor Qseven Form Factor Rev. 2.0 compliant | 70x70 mmCPUIntel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPIntel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPFeaturesDRAM: Dual Channel | up to 8GB onboard DDR3L with 1867 MT/sChipset: Integrated in SoCEthernet: Intel® I210 (Industrial) / I211 (Commercial) Gigabit Ethernet ControllerI/O Interfaces: 3x PCIe Gen2 | 1x USB 3.0/2.0 | 5x USB 2.0 | 2x SATA3 | SDv3 | LPC Bus | SMBus | I2C Bus | UARTMass Storage: eMMC 5.0 onboard flash up to 64 GByteSound: Intel® High Definition Audio (Intel® HD Audio)Graphics: Intel® Gen 9 LP Graphics supporting DirectX 12 | OpenGL 4.3 | OpenCL 2.0 | OpenGL ES 3.0 | HW accelerated video decoding HEVC/H.264/MVC/MPEG2/VP9/VC-1/WMV9/MJPEG and encoding HEVC/H.264/MVC/VP8/MJPEG | Content protection using PAVP 2.0 and HDCP 1.4/2.2LVDS: 18/24-bit Single/Dual Channel LVDS Interface, resolutions up to 1920X1200@60Hz | VESA standard or JEIDA data mapping Automatic Panel Detection via EDID/EPI | shared with eDP 1.3 supporting up to 3840x2160@60 Hz (option)DisplayPort Interface (DDI): DisplayPort 1.2 up to 4096×2160@60Hz or HDMI 1.4b up to 3840×2160@30HzMIPI-CSI: 1x MIPI-CSI x4 and 1x MIPI-CSI x2congatec Board controller: Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics I²C bus (fast mode | 400 kHz | multi master) | power loss controlEmbedded BIOS Features: AMI Aptio® UEFI 2.x firmware | 8 MByte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control Display Auto Detection | Backlight Control | Flash UpdatePower Management: ACPI 5 .0 compliant | Smart Battery ManagementOperating Systems: Microsoft® Windows 10 | LinuxPower Consumption: Typ. application 6W...12WTemperature: Commercial : Operating: 0 to +60°C Storage: -20 to +70°CIndustrial: Operating: -40 to +85°C Storage: -40 to +85°CHumidity: Operating: 10 to 90% r. H. non cond.Storage: 5 to 95% r. H. non cond.Size: 70 x 70 mm (2¾” x 2¾”)
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Ready for Intel® Optane™ memory technology FormfactorCOM Express BasicCPUIntel® Core™ i7-7820EQ (4 x 3.0 / 3.7 GHz, 8MB Cache, 45W)Intel® Core™ i5-7440EQ (4 x 2.9 / 3.6 GHz, 6MB Cache, 45W)Intel® Core™ i5-7442EQ (4 x 2.1 / 2.9 GHz, 6MB Cache, 25W)Intel® Core™ i3-7100E (2 x 2.9 GHz, 3MB Cache, 35W)Intel® Core™ i3-7102E (2 x 2.1 GHz, 3MB Cache, 25W)Intel® Xeon® E3-1505M V6 (4 x 3.0 / 4.0 GHz, 8MB Cache, 45W)Intel® Xeon® E3-1505L V6 (4 x 2.2 / 3.0 GHz, 8MB Cache, 25W)DRAM2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC supportChipsetMobile Intel® 100 Series ChipsetEthernetIntel® i219-LM GbE LAN Controller with AMT 11.6 supportI/O Interfaces8 x PCI Express GEN 3.0 lanesIntel® Optane™ memory can be connected via PCI Express Gen 3.04 x Serial ATA Gen 34 x USB 3.0 (XHCI)8 x USB 2.0 (XHCI)1 x PEG x16 Gen 3LPC busI²C bus (fast mode, 400 kHz, multi-master) 2 x UARTSoundDigital High Definition Audio Interface with support for multiple audio codecsGraphicsIntel® Gen9 HD Graphics Engine OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encodingcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware8/16 MByte serial SPI firmware flashSecurityThe conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)Power ManagementACPI 4.0 with battery supportOperating SystemsMicrosoft® Windows 10 (64bit only)Microsoft® Windows 10 IoT Enterprise (64bit only) LinuxFedora 24UbuntuSuSeRed Hat EnterpriseYocto Project v2.2Chromium 2Wind River VxWorksPower ConsumptionSee User's Guide for full detailsTemperatureStandardOperating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPISize95 x 125 mm (3.74" x 4.92")
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FormfactorCOM Express® Compact | (95 x 95 mm) | Type 6 Connector LayoutCPU Intel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPIntel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPFeaturesDRAM: 2 SO-DIMM sockets for DDR3L memory modules up to 8 GByte with 1867 MT/s | Dual channel memory interface for increased graphics performanceChipset: Integrated in SoCEthernet: Intel I210 (Industrial) /I211 (Commercial) Gigabit Ethernet Controller with SDP supportI/O Interfaces: 5x PCIe x1 | 4x USB 3.0 (XHCI) | 8x USB 2.0 (EHCI) | 2x SATA III | LPC | SPI | I²C bus (fast mode 400 kHz | multi-master) | SDIO 2x UART (RX/TX)s | 2x MIPI-CSIMass Storage: eMMC 5.0 onboard flash up to 64 GByteSound: Digital High Definition Audio InterfaceGraphics: Intel® HD Graphics Gen 9 | PAVP 2.0 | H.265/HEVC | VP9 | OpenCL 2.0 | OpenGL 4.3 | OpenGL ES 3.0 | DirectX12 | HDCP1.4LVDS: Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200@60Hz.Digital Display Interface (DDI): Up to 2x DisplayPort 1.2a or 2x HDMI 1.4b (max. 3840x2160 @ 30Hz) | 1x eDP 1.3 (optional)congatec Board Controller: Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup I²C bus (fast mode, 400 kHz, multi-master) | Power Loss ControlEmbedded BIOS Features: OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update | based on AMI Aptio UEFISecurity: Trusted Platform Module (TPM) optional. Hash and RSA algorithms | key lengths up to 2048 bits | real random number generatorPower Management: ACPI 5.0 with battery supportOperating Systems: Microsoft® Windows 10 | LinuxPower Consumption: see user’s guide for full details | CMOS Battery BackupTemperature:Commercial : Operating: 0 to +60°C Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C Storage: -20 to +80°CHumidity: Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.Size: 95 x 95 mm (3.74” x 3.74”)
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Formfactor Pico-ITX Singleboard Computer CPU Intel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPIntel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPDRAMMemory up to 4 Channels onboard LPDDR4 (V1.1) with up to 2400 MT/s | max. 8 GBChipsetIntegrated in SoCEthernet2x LAN Gbit / 100 Mbit / 10 Mbit | Intel Gigabit Ethernet i211 controller (i210 for industrial temperature)SoundHigh Definition Audio Interface | Cirrus Logic CS4207GraphicsIntel® Gen 9 HD Graphics with support for DirectX12 | OpenGL 4.3 | OpenCL 2.0 | OpenGLES 3.x | MPEG2 full HW acceleration with H.265/HEVC decoding and H.264 encoding | VP9 | PAVP 3.x | HDCP 1.4 | MVC and 2x independent display support in 4K (3840 x 2160 px) @30 Hz or WQXGA (2560 x 1600 px) @60 HzGraphic Interfaces1x 18/24-bit Single/Dual Channel LVDS Interface (via eDP to LVDS converter PTN3460) | 1x DisplayPort DP++ | resolution up 1920x1200 with 60Hz up to 4096x2160 @ 60Hz with eDPInternal Connectors 1x miniPCIe or mSATA full size | 1x SATA (6G) (with auxiliary +5V power connector for 2.5" HDD)2x USB 2.0 | 1x LVDS 2x24bit | 1x Backlight power connector | 1x Line Out | 1xMic In | 1x S/PDIF Out | 1x Power In (+12V) 2x COM (RS232 / RS-485 / RS422) | 1x Fan Connector | 3x Feature Connector | micro SD Card | MIPI-CSI 2.0External Connectors(Frontpanel)1x DisplayPort DP++ | 2x LAN RJ45 | 1x USB 3.0 Type C (with PD and DP++) | 2x USB 3.0 | 1x DC-In (only for commercial variants)congatec embedded ControllerMulti-Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup I²C bus (fast mode | 400 kHz | multi-master) | Power Loss ControlEmbedded BIOSAMI Aptio® 2.X (UEFI) BIOS; SM-BIOS | BIOS Update | Logo Boot | Quiet Boot | HDD PasswordPower Specification Power Supply 12V | RTC batteryOperating SystemsMicrosoft® Windows 10 | Microsoft® Windows 10 IoT | Linux (Wind River, Yocto) | Android | Wind River VxWorksOperating Temperature:Operating: Commercial: 0 .. +60°C Storage: Commercial: -40 .. +70°CIndustrial: -40 + 85°C Industrial: -40 + 85°CHumidity Operating:Operating: 10 - 90% r. H. | Storage: 5 - 95% r.H.Size 100 x 72 mm (3.9” x 2,8”)
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FormfactorSMARC Specification 2.0 | 82x50 mmCPUIntel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPIntel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPFeaturesDRAM: up to 8GB onboard LPDDR4 with 2400MT/sChipset: Integrated in SoCEthernet: up to 2x Intel® I210 (Industrial) /I211 (Commercial) Gigabit Ethernet Controller with SDP support | 2x Real Time TriggerI/O Interfaces: 2x USB3.0 | 4x USB2.0 | 1x SATA3 | 1x SDIO | up to 4x PCIe Gen2 | 2x I²C Bus | 2x SPI I 4x UART | optional M.2 1216 WiFi module (soldered down)Mass Storage: eMMC 5.0 onboard flash up to 64 GByteSound: Intel® High Definition Audio (Intel® HD Audio) Integrated Audio DSP with Intel® Smart Sound TechnologyGraphics: Intel® Gen 9 HD Graphics with support for DirectX 12 | OpenGL 4.3 | OpenCL 2.0 | OpenGL ES 3.0 | MPEG2 full HW acceleration with H.265/HEVC decoding and encoding | MVC and 2x independent display support in 4K | VP9 | PAVP 2.0 | HDCP 1.4 (wired), HDCP 2.0 (wireless)LVDS: Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 @60Hz | shared with eDP or 2x MIPI-DSI x4 (option)DisplayPort Interface (DDI): DisplayPort 1.2 up to 4096x2160px or HDMI 1.4b up to 3840x2160pxMIPI-CSI: 1x MIPI-CSI x4 and 1x MIPI-CSI x2congatec Board controller: Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics I²C bus (fast mode | 400 kHz | multi master) | power loss controlEmbedded BIOS Features: AMI Aptio® UEFI 2.x firmware | 8 MByte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control Display Auto Detection | Backlight Control | Flash UpdatePower Management: ACPI 5 .0 compliant | Smart Battery ManagementOperating Systems: Microsoft® Windows 10 | Microsoft® Windows IoT Core | Linux | Android 6.0 | VxWorks 7.0Power Consumption: Typ. application: tbd. | see manual for full detailsTemperature:Commercial : Operating: 0 to +60°C Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C Storage: -40 to +70°CHumidity: Operating: 10 to 90% r. H. non cond. Storage: 50 to 95% r. H. non cond.Size: 82 x 50 mm (3,23” x 1,97”)
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FormfactorCOM Express BasicCPUIntel® Xeon® D1577 (16 x 1.3 / 2.1 GHz, 25MB cache, 45 W)Intel® Xeon® D1548 (8 x 2.0 / 2.6 GHz, 12MB cache, 45 W)Intel® Xeon® D1527 (4 x 2.2 / 2.7 GHz, 6MB cache, 35 W)Intel® Pentium™ D1509 (2 x 1.5 GHz, 3MB cache, 19 W)Intel® Pentium™ D1508 (2 x 2.2 / 2.6 GHz, 3MB cache, 25 W )Intel® Xeon® D1559 (12 x 1.5 / 2.1 GHz, 18MB cache, 45 W)Intel® Xeon® D1539 (8 x 1.6 / 2.2 GHz, 12MB cache, 35 W)Intel® Xeon® D1529 (4 x 1.3 GHz, 6MB cache, 20 W)Intel® Pentium™ D1519 (4 x 1.5 / 2.1 GHz, 6MB cache, 25 W)DRAMup to 3 SO-DIMM sockets for DDR4 memory modules up to 16 GByte each (48 GByte total) with 2400 MT/s | ECC and non-ECC supportedChipsetIntegrated in SoCEthernet1x Intel I210AT /IT Gigabit Ethernet Controller | 2x 10GbE with KR interface support - the 10GbE PHY must be implemented on the carrier boardI/O Interfaces24 x PCI Express GEN 3.0 lanes8 x PCI Express 2.04 x USB 2.02 x SATA IIILPC busSPII²C bus2 x UARTcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesOEM LogoOEM CMOS DefaultsFlash UpdateAMI Aptio UEFISecurityTrusted Platform Module (TPM) optional. Hash and RSA algorithms, key lengths up to 2,048 bits, real random number generatorPower ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows 10 EnterpriseMicrosoft® Windows® 8.1Microsoft® Windows® 7Microsoft® Windows Server 2016Fedora 22Ubuntu 14.10CentOS 6.6 & 7.1FreeBSD 10.3 & 11VMwareMicrosoft® Windows Server 2012 R2Microsoft® Windows Server 2012Microsoft® Windows Server 2008 R2 SP1RHEL 6.6 & 7.1SuSE 11 SP4 & 12 SP1Yocto v.2.0 Kernel 4.1Wind River VxWorks 7ESXiTemperatureStandardOperating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size95 x 125 mm (3.74" x 4.92")
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Codename "Denverton"COM Express Type 7 Basic module based on the latest Intel Atom® C3000 processor series FormfactorCOM Express BasicCPUIntel® Atom™ C3958 (16 x 2.0 GHz, 16MB cache , 31 W)Intel® Atom™ C3858 (12x 2.0 GHz , 12MB cache, 25W)Intel® Atom™ C3758 (8x 2.2 GHz, 16MB cache, 25W)Intel® Atom™ C3558 (4x 2.2 GHz, 8MB cache, 16W)Intel® Atom™ C3538 (4x 2.1 GHz, 8MB cache, 15W)Intel® Atom™ C3808 (12x 2.0 GHz, 12MB cache, 24W)Intel® Atom™ C3708 (8x 1.7 GHz, 16MB cache, 17W )Intel® Atom™ C3508 (4x 1.5 GHz, 8MB cache, 11)DRAMup to 3 SO-DIMM sockets for DDR4 memory modules up to 16 GByte each (48 GByte total) with 2400 MT/s | ECC and non-ECC supportedChipsetIntegrated in SoCEthernet4x 10GbE with KR interface supportI/O Interfaces12 x PCI Express GEN 3.0 lanes8 x PCIe Gen22 x USB 3.04 x USB 2.02 x SATA IIILPC busSPI2 x UARTSM-Buscongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesOEM LogoOEM CMOS DefaultsFlash UpdateAMI Aptio UEFISecurityTrusted Platform Module (TPM) optional. Hash and RSA algorithms, key lengths up to 2,048 bits, real random number generatorPower ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows 10 EnterpriseMicrosoft® Windows® 8.1Microsoft® Windows® 7Microsoft® Windows Server 2016Fedora 22Ubuntu 14.10CentOS 6.6 & 7.1FreeBSD 10.3 & 11VMwareMicrosoft® Windows Server 2012 R2Microsoft® Windows Server 2012Microsoft® Windows Server 2008 R2 SP1RHEL 6.6 & 7.1SuSE 11 SP4 & 12 SP1Yocto v.2.0 Kernel 4.1Wind River VxWorks 7ESXiRTS Hypervisor
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FormfactorCOM Express MiniCPUIntel® Atom™ x7-E3950 (4 x 1.6 / 2.0 GHz, 2MB L2 cache, 12W)Intel® Atom™ x5-E3940 (4 x 1.6 / 1.8 GHz, L2 cache 2MB, 9W)Intel® Atom™ x5-E3930 (2 x 1.3 / 1.8 GHz, L2 cache 1MB, 6.5W)Intel® Pentium® N4200 (4 x 1.1 / 2.5 GHz, L2 cache 2MB, 6W)Intel® Celeron® N3350 (2 x 1.1 / 2.4 GHz, L2 cache 1MB, 6W)DRAMDual channel onboard DDR3L memory support for up to 8 GByte at 1866MT/sChipsetIntegrated in SoCEthernetIntel® I210 (Industrial) / I211 (Commercial) Gigabit Ethernet ControllerI/O Interfaces4 x PCIe Gen22 x USB 3.06 x USB 2.02 x SATA3SDIOLPC busSM-BusI²C bus2 x UARTSoundHigh Definition Audio InterfaceGraphicsIntel® HD Graphics Gen 9 | PAVP 2.0 | H.265/HEVC | VP9 | OpenCL 2.0 | OpenGL 4.3 | OpenGL ES 3.0 | DirectX12 | HDCP1.4congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware8 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash UpdateSecurityInfineon’s Trusted Platform Module (TPM 2.0/1.2) SLB 9665/9660 optionPower ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows 10 EnterpriseMicrosoft® Windows IoT CoreLinuxAndroidPower ConsumptionTyp. application <10 WattTyp. application <10 W @ 5 V, CMOS Battery BackupTemperatureStandard Operating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size55 x 84 mm (2.17" x 3.31")
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Ready for Intel® Optane™ memory technology FormfactorMini ITXCPUIntel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)Intel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)DRAMSupport for 2x SO DIMM Socket (dual channel DDR4 up to 2133 MT/s), max. 2x 16GBChipsetIntegrated in SoCEthernetDual LAN Gbit / 100 Mbit / 10 Mbit; 1x Intel® Gigabit Ethernet PHY i219LM (with AMT support); 1x Intel ®Gigabit Ethernet Controller i211 (i210 optional)Internal Connectors1x PCIe x4 slot (gen3)1x Full/Half-size Mini PCIe slotM.2 key B 2242/3042 connector (2x PCIe lanes for Intel® Optane™ memory support)3x SATA (6G), one shared with M.21x SATA Power4x USB 2.01x LVDS (2x24 bit)1x Embedded DisplayPort (x4)1x Backlight (Power, control)1x Monitor OFF1x Surround1x Front Panel HD Audio1 x Digital MIC or S/PDIF1x Internal stereo speaker2x Serial Port COM2 (opt. as ccTALK)1x Feature connector - congatec custom (8 Bit General Purpose I/O)Connector for Integrated Sensor Hub1x Frontpanel (Power Switch, LEDs, Reset)1x Intrusion (Case Open),1x FAN CPU1x FAN System1x internal power header (12-24V)1x CEC1x microSIM card slot1x microSD card slot1x opt. battery header signal + power (SBM3)1x I²C BusExternal Connectors2x DisplayPort dp++Audio InLine Out2x LAN RJ454x USB 3.0/2.01x DC-In (external input) 12-24 Vcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI Aptio UEFISM-BIOSBIOS UpdateLogo BootQuiet BootHDD PasswordSecurityThe conga-IC175 can be optionally equipped with a discrete ”Trusted Platform Module 2.0”t is capable of calculating efficient hash and RSA algorithms with key lengths up to 2048 bits and includes a real random number generator.Power ManagementPower Management | ACPI S3/S4 DeepSx | Wake on time from S5 | Power Supply 12-24 V | 2x fan (CPU / system) monitored & controlledOperating SystemsMicrosoft® Windows 10 (64bit only)Microsoft® Windows 10 IoT Enterprise (64bit only) LinuxPower ConsumptionSee User's Guide for full detailsTemperatureOperating: 0 to +60°C Storage: -20 to +70°CHumidityOperating: 10 - 90% r. H. non cond.Size170 x 170 mm (6.7” x 6.7”)
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conga-TS370COM Express Type 6 Basic module based on the latest Intel® processor series (formerly Coffee Lake) 8th Generation Intel® Core™ processorwith up to 6 CoresIntel® Xeon® processors for data center applicationsSupport for USB 3.1 Gen2 with 10Gb/sIntel® Optane™ memory supportECC memory supportUp to 32 GByte dual channel DDR4 memory
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COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 AI/DL Instruction Sets including VNNI Optional onboard NVMe SSD Integrated Xe (Gen 12) graphics with 32 EU
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COM-HPC high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake-H") Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 | USB 4.0 AI/DL Instruction Sets including VNNI Up to 128 Gbyte DDR4-3200 MT/s Integrated Xe (Gen 12) graphics with 32 EU
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COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 AI/DL Instruction Sets including VNNI Optional onboard NVMe SSD Integrated Xe (Gen 12) graphics with 32 EU
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COM Express Type 6 Compact based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s onboard Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing (optional)
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COM Express® Mini Type 10 module based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s onboard Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing
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Qseven module based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s onboard Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing Form Factor Qseven Form Factor | Qseven Spec. Rev. 2.1 compliant | 70 x 70 mm DRAM max. 16GB onboard LPDDR4x | up to 4.267 MT/s Ethernet Intel® GbE with TSN support and Out-Of-Band Management | real-time trigger I/O Interfaces 2x USB SuperSpeedPlus extentsion | up to 8x USB 2.0 (1x OTG) | 2x SATA III | 1x SDIO | 4x PCIe Gen3 | I²C Bus | SMBus | 1x SPI | UART | CAN | LPC | Mass Storage UFS 2.1 onboard flash up to 64 Gbyte Sound HD Audio Intel® LPE Audio via I2S Graphics Intel® HD Graphics LVDS Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 @60Hz | shared with eDP or MIPI-DSI x4 (option) DisplayPort Interface (DDI) DisplayPort 1.4 4096x2160px @60Hz or HDMI 2.0 4096+2160px @60Hz congatec Board controller Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics | fast mode and multi-master I²C bus | power loss control Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 MByte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Power Management ACPI 5 .0 compliant | Smart Battery Management Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux (Yocto Project) | Android | RTS Hypervisor Power Consumption Typ. Application: see manual for full details Temperature Range Commercial: Industrial: Operating Temperature: 0 to +60°C Operating Temperature: -40 to +85°C Storage Temperature: -20 to +80°C Storage Temperature: -40 to +85°C Humidity Operating Humidity: 10 to 90% r. H. non cond. Storage Humidity: 5 to 95% r. H. non cond. Size Qseven 70 x 70 mm (approx. 2.75” x 2.75”)
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SMARC 2.1 module based on Intel® Atom® x6000E and Intel® Pentium® and Celeron® J Series processors High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing Product Video Form Factor SMARC Specification 2.1 | 82x50 mm DRAM max. 16GB onboard LPDDR4x with up to 4.267 MT/s Ethernet 2x Intel® GbE with TSN support and Out-Of-Band Management | 2x real-time trigger I/O Interfaces 2x USB 3.0 (1x OTG) | 6x USB 2.0 (1x OTG) | 1x SATA III | 1x SDIO | up to 4x PCIe Gen3 | 2x I²C Bus | 1x SPI I 1x eSPI | 4x UART | GPIO | 2x CAN | 1x I2S | onboard M.2 1216 WiFi/BT module (optional) Mass Storage UFS 2.1 onboard flash up to 64 Gbyte (optional up to 512 Gbyte) Sound Intel® LPE Audio via I2S Graphics Intel® HD Graphics LVDS Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 @60Hz | shared with eDP or 1x MIPI-DSI x4 (option) DisplayPort Interface (DDI) DisplayPort 1.2 up to 4096x2160px and HDMI 1.4b up to 3840x2160px congatec Board controller Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics | fast mode and multi-master I²C bus | power loss control Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Power Management ACPI 5 .0 compliant | Smart Battery Management Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Android | Yocto | RTS Hypervisor Temperature Range Commercial: Industrial: Operating Temperature: 0 to +60°C Operating Temperature: -40 to +85°C Storage Temperature: -20 to +80°C Storage Temperature: -40 to +85°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 50 to 95% r. H. non cond. Size 82 x 50 mm (approx. 3,23” x 1,97”)
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Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing enable improved Realtime Capability Up to 4.267 MT/s Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing
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COM Express Compact Type 6 module based on Intel® Tiger Lake-UP3 high performing and low power Intel® Core™ processor series