Avnet Embedded builds embedded compute, display and software solutions that meet the demand for innovation and quality, with reduced time to market, utilizing Avnet Embedded’s platform technologies, design and manufacturing capabilities, and a world-class team of experts. Formerly known as MSC Technologies, the business was acquired by Avnet and today continues to design and manufacture award-winning embedded technology in-house. From industrial robotics to advanced medical equipment, Avnet Embedded helps its customers to build the best products for their market. Some of the world’s most well-recognized industry leaders trust Avnet Embedded as their partner, to get their products to market faster, better and stronger. Avnet Embedded focuses its innovative solutions on three core areas: displays, compute, and software. In the compute sector, Avnet Embedded has many years of development and production expertise in designing and manufacturing standard and customized Single Board Computers and complete systems. Due to its consulting competence including providing turnkey solutions, Avnet Embedded secures a competitive advantage for its customers with premium-quality solutions and long-term availability. Utilizing Avnet’s global logistics footprint and sales organizations, Avnet Embedded can serve any customer worldwide.
Offerings
Offering
The MSC HSD-ILDL COM-HPC Server module hosts the Intel® Xeon® D-1700 processor and delivers server class performance on embedded form factor. The processor is a fully integrated System on Chip (SoC) combining up to ten Xeon cores, memory controller, high bandwidth network and multiple PCIe root complexes on a single socket.The on chip network controller facilitates up to eight Ethernet ports with different configuration options ranging from 1G to 25G per port and an aggregated throughput of up to 100G. An additional Ethernet port based on Intel® i225 provides 1GbE/2.5GbE bandwidth and TSN capability for real-time applications. An extensive set of PCI Express lanes with Gen 4 and Gen 3 support allow for connecting external HW accelerators, FPGAs, storage and IO devices.The user can scale memory capacity from 8GB to 256GB based on registered DIMMs (RDIMM) or unbuffered DIMMs (UDIMM). Machine robustness can be extended by enabling error correction code (ECC) and utilizing RDIMM or ECC UDIMM. Selected variants of the MSC HSD-ILDL can be operated at extended temperature range with true 24/7 utilization. This supports system designs exposed to harsh environmental conditions that require a reliable computeengine.System investments are well protected through long-term availability of the module. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-ALN features the Intel® Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series. The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment. The MSC C6C-ALN can drive up to three independent displays with a maximum of 4k resolution. The COM Express Type 6 interface allows direct access to digital display interfaces including DisplayPort, HDMI, VGA, and the choice of LVDS versus eDP. With a maximum capacity of 16GB fast DDR5 memory the board satisfies even demanding applications. Optional in-band ECC capability allows for protecting code and data kept in memory. High speed IO includes up to six PCIe Gen 3 lanes and up to four USB 3.1 interfaces. Mass storage is provided with the optional on-board eMMC memory and externally accessible via up to two SATA channels. The network interface based on Intel® i226 supports up to 2.5GbE bandwidth.
Offering
The MSC C6B-RLP COM Express module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in industrial, medical, transportation, video surveillance and gaming. The Intel® performance hybrid architecture combines performance-cores and efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP) and can go as low as 12W TDP. Selected variants of the processor provide TSN and Intel® TCC enabling extended real-time capabilities, allow continuous running (24/7) and support module variants to operate in extended temperature range.- For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The ethernet interface provides up to 2.5GbE band width based on the Intel® i226 network controller.
Offering
The MSC HS-MB-EV is intended for design teams that require an easy and fast enablement of COM-HPC® based solutions for lab evaluation, rapid prototyping, and application development. Engineers can use it as a reference design for developing their own COM-HPC platform. The COM-HPC carrier provides a COM-HPC Server interface with a rich set of I/O routed to the module socket including high-speed PCIe, multiple Ethernet ports, USB and SATA. COM-HPC Server modules of either Size D or E can be installed on the carrier. Combined with the MSC HSD-ILDL Server module, many of the Intel® Xeon® D-1700 and Intel® Xeon® D-2700 high-speed I/O is available on break-out connectors located on the face plate and on-board, including 25G / 10G Ethernet ports and PCIe sockets. The carrier features four SFP28 cages for up to 25G Ethernet per port, and which are controlled by the Intel® Ethernet Connection C827-IM1. The two 10GBASE-T connectors are driven by the Intel® Ethernet Connection X557-AT4.
Offering
The MSC C6C-ASL features the Intel Atom® Processor x7000RE/C Series. With support for up to eight processor cores, the module fits to a wide range of applications including automation, point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment. The board is ideal for system products that are exposed to harsh ambient conditions. It is designed for extended temperature range and 24/7 continuous operation. The MSC C6C-ASL can drive up to three independent displays with a maximum of 4k resolution. The COM Express Type 6 interface allows direct access to digital display interfaces including DisplayPort, HDMI, and a choice of LVDS versus eDP. With a maximum capacity of 16GB fast DDR5 memory the board satisfies even demanding applications. The In-band ECC capability protects code and data kept in memory. High speed IOincludes up to six PCIe Gen 3 lanes and up to four USB 3.2 interfaces. Mass storage is provided with the optional on-board eMMC memory and externally accessible via up to two SATA channels. The network interface based on the Intel® i226 supports up to 2.5GbE bandwidth. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC HCA-RLP COM-HPC client module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance, the module is ideal for compute intense applications in automation, instrumentation, high-end medical equipment, transportation, and video surveillance. The Intel® performance hybrid architecture combines performance-cores and efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). The board is ideal for applications requiring support for extended temperature range and 24/7 continuous operation. For highest data throughput the module enables fast DDR5-4800 memory technology with up to sixty-four GB SO-DIMM based memory. Module I/O comprises up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 5. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel® i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-RLP COM express module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. The module is ideal for applications such as in industrial automation, transportation, medical equipment, process control and HMI terminals, that require outstanding performance on a small form factor. The Intel® performance hybrid architecture combines performance-cores and efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12WTDP. The board is ideal for mission critical applications supporting extended temperature range, 24/7 continuous operation, memory down with in-band ECC protection and optional conformal coating. The module enables fast LPDDR5-6400 memory technology and up to thirty-two GB main memory. I/O located on COM express carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes and up to sixteen lanes PCIeGen 4. The Ethernet interface provides up to 2.5GbEbandwidth based on the Intel® i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC HCA-ALP COM-HPC Client module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performance-focused compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in instrumentation, high-end medical equipment, transportation, video surveillance and gaming. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). Applications requiring lower power dissipation can be operated with selected processor variants at 12W TDP. For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM-HPC carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel® i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performance-focused compute solutions. The module is ideal for applications such as in medical equipment, process control, HMI terminals, transportation, and intelligent kiosk, that require outstanding performance on a small form factor. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to twelve cores and sixteen threads at 28W thermal design power (TDP).For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP. For highest data throughput the module enables fast LPDDR5-5200 memory technology. Carried out as memory-down, the board can be assembled with up to thirty-two GB main memory. I/O located on COM Express carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes and four lanes PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C10M-EL module is based on the Intel Atom® Processor x6000 Series (codenamed "Elkhart Lake"). Built on 10nm process technology the SoC integrates the next generation Intel Atom® processor with graphics accelerators, memory controller and rich I/O functionality in a single package. The module is designed for extended temperature range and 24/7 operation in mission critical tasks that require a reliable and performant computing base. The COM Express Mini Module fits into space and thermally constraint system environments, while providing outstanding performance. Typical applications include industrial IoT, communication units, mobile medical equipment, way-side controllers and outdoor POS terminals. The MSC C6C-EL can drive up to two independent displays with a maximum of 4k resolution. The COM Express Type 10 interface allows direct access to digital display interfaces including DisplayPort, HDMI and the choice of LVDS versus eDP. With a maximum capacity of 16GB fast LPDDR4x memory the board satisfies even demanding applications. Optional in-band ECC capabilities allow for protecting code and data kept in memory. High speed I/O includes four PCIe Gen 3 lanes and two USB 3.1 interfaces. Mass storage can be supported with the optional on-board eMMC memory and via two SATA channels.System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. The COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6B-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance, the module is ideal for compute intense applications in medical, transportation, video surveillance and gaming. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP. For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-EL module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (codenamed "Elkhart Lake"). Built on 10nm process technology the SoC integrates the next generation Intel Atom® processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design. Typical applications are industrial IoT, mobile medical equipment, on-board units, way-side controllers and outdoor POS terminals. The MSC C6C-EL can drive up to three independent displays with a maximum of 4k resolution. The COMExpress Type 6 interface allows direct access to digital display interfaces including DisplayPort, HDMI and the choice of LVDS versus eDP. With a maximum capacity of 32GB fast DDR4 memory the board satisfies even demanding applications. Optional in-band ECC capabilities allow for protecting code and data kept in memory. High speed IO includes up to eight PCIe Gen 3 lanes and two USB 3.1 interfaces. Mass storage can be supported with the optional on-board eMMC memory and via two SATA channels.
Offering
The MSC C6B-TLH COM Express module features the 11th Gen Intel® Core™ vPro®, Intel® Xeon® W-11000E Series, and Intel® Celeron® processors, giving application designers a great variety of choices of power efficient and performant compute solutions. CPU core count scales from two cores/two hyper threads up to eight cores/sixteen hyper threads. Processor variants with 25W and 45/35W thermal design power (TDP) are available. With eight PCIe Gen 3 lanes and a sixteen lane PEG port based on PCIe Gen 3 and 4, the module is well equipped to handle demanding I/O traffic. The Ethernet controller based on Intel® i225 provides 1GbE and 2.5GbE bandwidth and offers TSN capability for real-time applications. For further real-time support, TCC is enabled on boards equipped with the Intel® Xeon® W-11000E Series processor. Board memory capacities is configurable from 8GB to 64GB via two SO-DIMM sockets. Error correction code (ECC) is optionally supported by dedicated module variants and use of ECC SO-DIMMs. Selection variants of the MSC C6B-TLH can be operated at extended temperature range with full 24/7 utilization. This supports system designs exposed to harsh environmental conditions that require a reliable compute engine. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
Avnet Integrated has combined its decades of hardware innovation with Intel's game-changing components to develop a platform perfectly suited to video analytics and artificial intelligence at the edge. Aimed at software and solution developers in a wide variety of industries that require smart video analysis, t he technology platform is perfect for quickly unlocking the benefits of visual AI. The platform comes pre-loaded with basic solutions but can easily be used to run specialist software. This makes it perfect for software vendors looking for a perfect hardware platform to run their solution that is rugged, reliable and accurate. Leveraging Intel’s OpenVINO platform and other cutting edge technology, this “Intelligent Vision” solution is a combination of AI-Optimized hardware and software providing out of the box Intelligent video analytics at the edge. The solution r educes effort for the customer and time to market by using pre-evaluated building blocks. Deep learning video analytics at the edge to improve operational efficiency and security in different verticals including: Industrial Automation Manufacturing Retail Security Banking Transport Logistics Robotics The technology platform is designed specifically to handle demanding video analysis for applications including: People detection Behavior analysis GDPR compliant face recognition / redaction Object detection Vehicle recognition License plate identification
Offering
The MSC HCC-CFLS module is the first member of the new COM-HPC product family. It enables a PICMG COM-HPC Client interface and features size C module format. The Client interface offers a wide range of I/O, including multiple graphics interfaces, 1G and 10GBASE-T Ethernet as well as PCIe and USB data paths. Designed for the 9th Generation Intel® Core™ S-Series Processor family, the module comes with the greatest scalability, from cost efficient Pentium up to most performant Core i7 processor. Depending on selected processor variant up to eight cores can be utilized by most demanding applications. A total of 64GB of main memory provides extended and reliable space for data intensive tasks. The graphics units on the MSC HCC-CFLS provide highest level graphics acceleration and hardware based video en-/decoding. They connect to three DDI interfaces and one eDP display port allowing for a maximum of three independent displays at up to 4k x 2k resolution. The 16 lane width PEG port based on PCIe Gen 3 gives system designers the possibility to integrate external graphics and AI accelerators into their application. Further I/O include additional PCIe lanes, USB 3 Gen1 and 2, SATA, 1G and 10GBASE-T Ethernet and GPIOs. For lab evaluation, rapid prototyping and application development Avnet Embedded offers the MSC HC-MB-EV, a COM-HPC Client carrier.
Offering
The MSC HC-MB-EV is intended for design teams that require an easy and fast enablement of COM-HPC based solutions for lab evaluation, rapid prototyping and application development. Engineers can use it as a reference design for developing their own COM-HPC platform. For design support for COM-HPC solutions please contact Avnet Embedded. The COM-HPC Client carrier provides a rich set of COM-HPC Client interfaces routed to the module socket including PCIe and PEG ports, DDI and eDP graphics interfaces, and high speed I/O like USB and SATA. COM-HPC Client modules of either Size A, B and C can be installed on the carrier. The carrier can be configured with COM-HPC Client modules from Avnet Embedded to enable powerful system solutions based on the 9th Generation Intel® Core™ processors.
Offering
The MSC C6C-TLU module is based on the 11th Gen Intel® Core™ processor generation (codename "Tiger Lake UP3"). Built on 10nm process technology the processor integrates the next generation Intel micro architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The board is ideal for mission critical applications, that require the durability of a well-designed board including memory-down, 24/7 continuous operation, extended temperature specification, shock and vibration product performance and optional conformal coating. It provides significant performance gains over previous Intel Core generations allowing for technology upgrades within existing power and cooling requirements defined by the system design. Typical applications are industrial IoT, medical equipment, on-board units, way-side controllers and outdoor POS terminals. The MSC C6C-TLU can drive up to four independent displays with a maximum of 4k resolution. The COM Express Type 6 interface allows direct access to display interfaces including DisplayPort, HDMI and the choice of LVDS versus eDP. With a maximum capacity of 32GB fast LPRRD4X memory soldered to the board the product satisfies even demanding applications. Optional in-band ECC capabilities allow for protecting code and data kept in memory. High speed IO includes up to nine PCIe Gen 3 lanes and four USB 3.1 interfaces. Mass storage can be supported via two SATA channels. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The new MSC Q7-EL module features the next-generation low-power, multi-core system-on-chip (SOC) Intel Atom® generation. Built on 10nm process technology the SoC integrates the next generation Intel Atom® processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Intel Atom® generations allowing for technology upgrades within existing power and cooling requirements defined by the system design. The new MSC Q7-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4 memory with up to 16GB and optional IBECC capabilities, fast UFS 2.0, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 module. Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC Q7-EL offers 1 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 1 CAN-FD interface. For evaluation and design-in of the MSC Q7-EL module, Avnet Embedded provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.
Offering
The new MSC SM2S-EL module features the next-generation low-power, multi-core system-on-chip (SOC) Intel Atom® generation. Built on 10nm process technology the SoC integrates the next generation Intel Atom® processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Intel Atom® generations allowing for technology upgrades within existing power and cooling requirements defined by the system design. The new MSC SM2S-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4 memory with up to 16GB and optional IBECC capabilities, fast UFS 2.0, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1 Short Size module. Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-EL offers 2 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 2 CAN-FD interfaces. For evaluation and design-in of the MSC SM2S-EL module, MSC provides a suitable SMARC 2.1 development platform. A complete, ready-to-run Starterkit is also available from Avnet Embedded.
Offering
The MSC C6C-AL module is based on the multi-core system-on-chip (SOC) Intel Atom® X5/X7 - 3900 Series that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core Intel Atom™ processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The MSC C6C-AL brings triple independent display support, DirectX 12, fast DDR3L memory and four USB 3.0 on a compact, power saving and cost-efficient module. Different SOCs with dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6C-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The 1GbE network interface is based on the Intel ® Ethernet Controller i210 Series. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4b and DVI. USB 3.0 interfaces support the fastest peripheral devices currently available. Supporting extended temperature range and long availability the modules are perfectly suited for modern IoT applications. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-KLU module is based on Intel‘s 7th generation Core processor family. The Intel multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier and allows extreme compact high-performance designs. The new MSC C6C-KLU brings triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.0/2.0 interfaces complete the compact and power saving module. Different dual-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6C-KLU optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4b and DVI as well as up to four USB 3.0 interfaces supporting the fastest peripherals currently available. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC Q7-BW module is based on the multi-core system-on-chip (SOC) of the Intel Atom® generation that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core processor provides outstanding computing and graphics performance and is more power efficient compared to its predecessors. The new MSC Q7-BW brings triple independent display support, DirectX 11.1, fast DDR3L-1600 memory and USB 3.0 on a compact, power saving and cost-efficient Qseven Rev. 2.0 compliant module. Different SOCs with dual- and quad-core processors are supported by this design. Next to an extensive set of interfaces and features, the MSC Q7-BW optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). For evaluation and design-in of the MSC Q7-BW module, Avnet Embedded provides suitable Qseven Rev. 2.0 platform boards. A complete, ready-to-run Starterkit is also available.
Offering
The MSC C6B-KLH module is based on Intel‘s 7th generation Core processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The new MSC C6B-KLH offers triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.0/2.0 interfaces complete the compact and powerful module. Different dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6B-KLH optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.3, HDMI 1.4b and DVI as well as up to four USB 3.0 interfaces supporting the fastest peripherals currently available. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C10M-AL module is based on the Intel® Atom® multi-core system-on-chip (SOC) (Formerly"Apollo Lake"). It integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one solution. Manufactured in 14nm processor technology this multi-core Intel® Atom® processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The MSC C10M-AL brings dual independent display support, DirectX 12, fast DDR3L memory, two USB 3.0 and 6 USB 2.0 on a compact, power saving and cost-efficient COM Express Mini module. Different SOCs with dual- and quad-core processors are supported. Besides an extensive set of interfaces and features, the MSC C10M-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The 1GbE network interface is based on the Intel ® Ethernet Controller i210 Series. Type 10 pin-out supports digital display interfaces like DisplayPort, HDMI and DVI. The rugged design with soldered memory, optional ECC support and extended temperature range combined with a long-term availability commitment make it perfectly suited for modern IoT solutions. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6-MB-EV is a compact platform for developing and prototyping system electronics and software before a specific baseboard becomes available. It provides the interface infrastructure for the COM Express Type 6 modules and offers various PC type connectors for external access. For design support for COM Express solutions please contact Avnet Embedded. With this universal platform a tool is offered to test quickly what’s needed to choose the right product out of MSC’s COM Express portfolio. This development tool also helps to develop software in parallel with the hardware to speed up the integration process. The carrier can be configured with COM Express Type 6 modules from Avnet Embedded to enable powerful system solutions based on the 11th Gen Intel® Core™, 9th Generation Intel® Core™ or 8th Generation Intel® Core™ processors.
Offering
The new MSC Q7-AL module features the next-generation Intel® low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom® Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core processor provides outstanding computing and graphics performance and is more power efficient compared to its predecessors. The new MSC Q7-AL offers triple independent display support, DirectX 12, fast DDR3L-1866 memory and USB 3.0 on a compact, power saving and cost-efficient Qseven Rev. 2.1 module. Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC Q7-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). For evaluation and design-in of the MSC Q7-AL module, Avnet Embedded provides suitable Qseven Rev. 2.0 platform board. A complete, ready-to-run Starterkit is also available.
Offering
The MSC C10-MB-EV is a compact platform for developing and prototyping system electronics and software before a specific baseboard becomes available. It provides the interface infrastructure for the COM Express Type 10 modules and offers various PC type connectors for external access. For design support for COM Express solutions please contact Avnet Embedded. With this universal platform a tool is offered to test quickly what’s needed to choose the right product out of MSC’s COM Express portfolio. This development tool also helps to develop software in parallel with the hardware to speed up the integration process.
Offering
The new MSC SM2S-AL module features the next-generation Intel® low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom® Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core processor provides outstanding computing and graphics performance and is more power efficient compared to its predecessors. The new MSC SM2S-AL offers triple independent display support, DirectX 12, fast LPDDR4 memory, eMMC and USB 3.0 on a power saving and cost-efficient SMARC 2.0 Short Size module. Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). For evaluation and design-in of the MSC SM2S-AL module, Avnet Embedded provides a suitable SMARC 2.0 development platform. A complete, ready-to-run Starterkit is also available.
Offering
The MSC C7B-DV is equipped with Intel® C3000 series processors, offering broadest scalability from four to sixteen processor cores as well as low-cost entry-level models. The modules have up to five Ethernet interfaces, four of which offer transfer rates of 10Gb, up to 22 PCIe lanes and up to 48 GB DDR4 ECC memory. Some variants that support industrial-level temperatures (-40 to +85°C) are also thought for use in harsh environmental conditions. For evaluation purposes and for starter kits, MSC offers a matching Type 7 ATX form factor carrier board. This feature-rich carrier board brings not only numerous PCI Express slots, four 10Gb Ethernet ports, SATA and other interfaces, but also an optional BMC (Board Management Controller) for remote maintenance. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6B-CFLR module is based on the 9th Generation Intel® Core™ Processor family. The Intel® two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The MSC C6B-CFLR offers triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.1/2.0 interfaces complete the compact and powerful module. With choices of six and quad-core processor options the board is well positioned to address challenging performance demands. Besides an extensive set of interfaces and features, the MSC C6B-CFLR offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.4, DisplayPort 1.2, HDMI 1.4 and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-WLU module is based on Intel‘s 8th generation Core processor family. The Intel multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier. It allows for ultra compact high performance solutions in applications, where real-estate and cooling is constrained. The MSC C6C-WLU introduces 4 processor core capability based on the Intel Core U processor family. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities with application requirements. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C7B-DVL is equipped with Intel® C3000 series processors, offering broadest scalability from four to sixteen processor cores as well as low-cost entry-level models. The modules have up to five Ethernet interfaces, four of which offer transfer rates of 10Gb, up to 14 PCIe lanes and up to 48 GB DDR4 ECC memory. Some variants that support industrial-level temperatures (-40 to +85°C) are also thought for use in harsh environmental conditions. For evaluation purposes and for starter kits, MSC offers a matching Type 7 ATX form factor carrier board. This feature-rich carrier board brings not only numerous PCI Express slots, four 10Gb Ethernet ports, SATA and other interfaces, but also an optional BMC (Board Management Controller) for remote maintenance. Up to 15 years long-term supply. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
Application-Ready Embedded Platform Flexible and Cost-Optimized The Single Board Computer (SBC) Solution with COM Modules enables great advantages in many applications like HMI, Industrial Control, Multiple Display Solutions, Home/Building Automation, Industrial Infotainment, Object Recognition (AI) and IoT Gateways. Combined with the versatile Qseven computer modules from Avnet Embedded based on the Intel Atom® Processor X Series and the Intel Atom® Processor E Series, the platform provides a fast and easy way for creating flexible system solutions. PROPERTIES • Perfectly fitting platforms, shortest time to market • By design optimized for low production cost and simple customization • Customer-specific partial assembly for medium to high volume • Built-in versatility by many customization options • Scalability = carrier assembly variants • Industrial temperature range from -40°C to +85°C • CAN optionally with galvanic isolation • WLAN / BT / NFC Module optionally assembled • Intel® I210 ethernet controller for up to 2 x 10/100/1000 Base-T • Designed and manufactured by Avnet Embedded
Offering
MSC Qseven-BT Module featuring the new Intel Atom® Processor E3xxx series. Qseven Spec.. Rev. 2.0 compatible module Intel Atom® Single, Dual and Quad Core Processors TDP from 5 Watt based on Intel Atom® E3815 Processor Intel® Generation 7 HD Graphics Up to 8 GB DDR3L memory soldered, optional ECC Up to 32 GB Flash memory soldered PCIe x1, SATA USB 3.0 Host and Client USB 2.0 Host and Client LPC, SPI, I²C, SDIO, UART interfaces Intel® HD Graphics Hardware acceleration for MPEG2, H.264, DirectX11, OpenCL 1.2, OpenGL 3.0 DisplayPort 1.2 (max. 2560x1600) / HDMI 1.4a (max. 1920x1200) Dual-channel LVDS interface 18/24 bit Designed and manufactured by Avnet Embedded
Offering
The MSC C6B-SLH with 6th generation Intel® Core™ processors brings triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.0/2.0 interfaces complete the compact and powerful module. Different dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6B-SLH optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.3, HDMI 1.4b and DVI as well as up to four USB 3.0 interfaces supporting the fastest peripherals currently available. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-BT module is based on the Intel® Atom™ multi-core system-on-chip (SOC) that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Based on 22nm processor technology, the multi-core Intel® Atom™ processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The new MSC C6C-BT brings dual independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power saving and cost-efficient module. Different SOCs with single-, dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6C-BT offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The 1GbE network interface is based on the Intel® Ethernet Controller i210 Series. The new Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4a and DVI. USB 3.0 interfaces support the fastest peripheral devices currently available. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC C6C-BW module is based on the multi-core system-on-chip (SOC) Itel® Atom™ that integrates next generation processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The MSC C6C-BW brings triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power saving and cost-efficient module. Different SOCs with dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6C-BW optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4b and DVI. USB 3.0 interfaces support the fastest peripheral devices currently available. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Offering
The MSC CXC-BT module is based the multi-core system-on-chip (SOC) Intel Atom®/Intel® Celeron®, that integrates next generation graphics, memory, and I/O interfaces into one solution. Based on 22nm processor technology this multi-core Intel® Atom™ processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The new MSC CXC-BT brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a compact, power saving and cost-efficient module. Different SOCs with single-, dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC CXC-BT optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 2 pin-out ensures compatibility to existing system and carrier board designs. The board is designed and manufactured by Avnet Embedded.
Offering
The MSC C10M-BT module is based on the multi-core system-on-chip (SOC) Intel® Atom™/Celeron® that integrates processor core, graphics, memory, and I/O interfaces into one solution. Based on 22nm processor technology it provides outstanding computing and graphics power and highest power efficiency. The MSC C10M-BT brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very compact, power saving and cost-efficient COM Express Mini module. Different SOCs with single-, dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C10M-BT optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). Type 10 pin-out offers USB 3.0 support and digital display interfaces like DisplayPort, HDMI 1.4a and DVI. The rugged design with soldered memory, optional ECC support and extended temperature range opens new application areas. The board is designed and manufactured by Avnet Embedded.