Intel Invests $3.5 Billion in New Mexico Operations

New Mexico Gov. Michelle Lujan Grisham (left) and Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, display a plaque with a processor wafer on Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During a news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

New Mexico Gov. Michelle Lujan Grisham speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

U.S. Sen. Ben Ray Luján, of New Mexico, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

U.S. Rep. Teresa Leger Fernandez, of New Mexico, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

Katie Prouty, Intel vice president, Manufacturing and Operations, Fab 11x plant manager and Intel New Mexico site leader, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

New Mexico Gov. Michelle Lujan Grisham is interviewed by media Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. At an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

Keyvan Esfarjani, (second from left) Intel senior vice president and general manager of Manufacturing and Operations, and New Mexico by Gov. Michelle Lujan Grisham bump elbows Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. In the background: Mindy Koch (left), Intel New Mexico Corporate Services site manager, and Erika Edgerly (right), Intel New Mexico director of public affairs. During an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)

A drone photo shows Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)

New Mexico Gov. Michelle Lujan Grisham speaks to Intel New Mexico employees on Wednesday, Jan. 24, 2024, at the company’s Rio Rancho campus. Attendees include (from left) Rio Rancho Mayor Greggory Hull, Sandoval County Commission Chairman David Heil, U.S. Rep. Teresa Leger Fernández, and U.S. Rep. Melanie Stansbury. (Credit: Intel Corporation)

Keyvan Esfarjani (center), Intel chief global operations officer, cuts the ribbon in the ceremonial opening of Fab 9 in Rio Rancho, New Mexico, on Wednesday, Jan. 24, 2024. He is joined at an employee celebration with local elected officials and Intel managers (from left): Rio Rancho Mayor Greggory Hull; Ali Diouf, Fab 9 factory manager; U.S. Rep. Teresa Leger Fernández; Sandoval County Commission Chairman David Heil; U.S. Rep. Melanie Stansbury; New Mexico Gov. Michelle Lujan Grisham; Esfarjani; Katie Prouty, Intel New Mexico plant manager; Peter Charvat, general manager of Disaggregation Manufacturing Organization; Brian Chavez, F11x factory manager; Mindy Koch, New Mexico Corporate Services site manager; and Kenneth Nava, New Mexico director of Fab Construction Enterprise. (Credit: Intel Corporation)

Manufacturing technicians work in the clean room of Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)

A manufacturing technician looks through a window of advanced packaging equipment at Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)

A photo from January 2024 at Intel's new Fab 9 in Rio Rancho, New Mexico shows chiplet bonding as part of Intel's advanced packaging technology called Foveros. This breakthrough 3D packaging technology offers flexible options for combining multiple chips that are optimized for power, performance and cost. (Credit: Intel Corporation)

A wafer moves through the manufacturing process at Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)

In January 2024, an Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a small wafer containing Intel silicon photonics chips. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)

An Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a bond module carrier containing a single silicon photonics chip in January 2024. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)

An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)

The Intel Rio Rancho campus in New Mexico develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)

Workers at Fab 11x at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)

An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)

An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)

An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)

An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)

Workers at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)